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TMS320F28062UPFPS

Texas Instruments

TMS320F28062UPFPS by Texas Instruments

TMS320F28062UPFPS by Texas Instruments is a 32-bit microcontroller with 80 terminals, operating at up to 30 MHz. It features DAC and ADC channels, PWM support, and Flash ROM programmability. Ideal for automotive applications due to its -40°C to 125°C temperature range and CMOS technology.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,864 parts In-Stock

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3,864

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Digiode

USA . 3,598 parts In-Stock

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3,598

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Distributors (Availability)

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AZTECH Wire

Italy . 470 parts In-Stock

1+ parts

$18.149

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470

$18.149

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One Stop Electronics

USA . 285 parts In-Stock

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$23.000

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285

$23.000

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Parana Technologies

USA . 155 parts In-Stock

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$59.783

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155

$59.783

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IDEA Electronic Components Group

UK . 1,419 parts In-Stock

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$67.172

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$63.813

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$60.455

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1,419

$67.172

$63.813

$60.455

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ChromeModa Solutions

Germany . 513 parts In-Stock

1+ parts

$67.172

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$55.081

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513

$67.172

$55.081

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Microchip USA

USA . 4,520 parts In-Stock

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4,520

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Corphita

USA . 3,312 parts In-Stock

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DigiPath Technology Company

USA . 509 parts In-Stock

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$60.562

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509

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$60.562

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Overview

Experience the cutting-edge technology of the TMS320F28062UPFPS microcontroller by Texas Instruments. With a focus on quality and reliability, Texas Instruments has a proven track record in delivering top-notch products. This microcontroller offers a wide range of applications in various industries, providing value and performance to customers. From automotive to industrial automation, this microcontroller is designed to meet your specific needs. Trust in Texas Instruments for superior technology that delivers results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the microcontroller suitable for various applications.

Surface Mount: YES

Being surface mountable makes it easier to integrate into compact designs and saves space on the PCB.

Maximum Supply Voltage: 1.995 V

This low maximum supply voltage helps in reducing power consumption and extends battery life in portable devices.

Package Shape: SQUARE

The square package shape facilitates easier PCB layout and mounting options.

Bit Size: 32

A 32-bit architecture provides higher processing capabilities and efficiency compared to lower bit sizes.

DAC Channels: YES

Having Digital-to-Analog Converter (DAC) channels enables the microcontroller to output analog signals, useful in various applications like audio processing.

Power Supplies (V): 1.8,3.3

Support for different power supply voltages allows flexibility in designing and powering the microcontroller circuit.

No. of Terminals: 80

Having a higher number of terminals provides more connectivity options and interfaces for peripherals and external components.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Offers multiple package styles for different mounting and cooling requirements, suitable for diverse applications.

Minimum Supply Voltage: 1.71 V

The low minimum supply voltage ensures reliable operation even with lower power sources.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the microcontroller can withstand harsh environmental conditions and extended usage without overheating.

CPU Family: TMS320

Being part of the TMS320 CPU family ensures compatibility, reliability, and access to a wide range of support resources for development.

Minimum Operating Temperature: -40 °C

The wide temperature range for operation allows the microcontroller to function in extreme cold environments without performance degradation.

Terminal Finish: NICKEL PALLADIUM GOLD

This terminal finish provides good conductivity, corrosion resistance, and reliability for long-term operation.

ADC Channels: YES

Having Analog-to-Digital Converter (ADC) channels allows the microcontroller to accurately sample and convert analog signals into digital data for processing.

DMA Channels: YES

Support for Direct Memory Access (DMA) channels enables efficient data transfer between peripherals and memory without CPU intervention, improving overall system performance.

Terminal Position: QUAD

The quad terminal position offers better mechanical stability and ease of soldering during PCB assembly and maintenance.

ROM Words: 65536

With a large ROM capacity, the microcontroller can store a significant amount of program instructions and data for complex applications.

Maximum Seated Height: 1.2 mm

The low seated height allows for slim and compact designs while still providing high performance.

Width: 12 mm

The compact width dimension enables the microcontroller to be used in space-constrained applications without compromising functionality.

Maximum Clock Frequency: 30 MHz

The high maximum clock frequency allows for fast processing speed and responsiveness in real-time applications.

Maximum Time At Peak Reflow Temperature (s): 30

With a short reflow time, the microcontroller can undergo solder reflow processes quickly and efficiently during manufacturing.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance ensures the microcontroller can withstand the soldering process without damage.

Length: 12 mm

The compact length dimension along with the square package shape allows for space-saving mounting options on the PCB.

Temperature Grade: AUTOMOTIVE

Being automotive-grade means the microcontroller meets stringent quality and reliability standards for use in automotive applications with high temperature and performance requirements.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller with various built-in peripherals simplifies system design, reduces external component count, and improves overall integration.

RAM Bytes: 53248

With a large RAM size, the microcontroller can efficiently store and access data during program execution, enhancing performance in multitasking applications.

Technology: CMOS

Using CMOS technology offers low power consumption, high noise immunity, and reliable operation, suitable for battery-powered and sensitive electronic devices.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical strength, easy soldering, and secure connections during PCB assembly and usage.

Nominal Supply Voltage: 1.8 V

Having a stable nominal supply voltage ensures consistent and reliable operation of the microcontroller within specified performance parameters.

PWM Channels: YES

Pulse Width Modulation (PWM) channels enable precise control of analog outputs like motor speed, LED brightness, and power levels in various applications.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and quick updating of firmware and software, enhancing flexibility and future-proofing of the microcontroller.

Terminal Pitch: 0.5 mm

The fine terminal pitch allows for higher pin density and more I/O lines in a compact package, suitable for high-performance applications with numerous interfacing requirements.

Moisture Sensitivity Level (MSL): 3

The MSL rating indicates the microcontroller's sensitivity to moisture during storage and handling, ensuring proper precautions are taken to prevent damage.

Speed: 80 rpm

With an operational speed of 80 rpm, the microcontroller can execute tasks quickly and efficiently in various applications.

No. of I/O Lines: 40

Having a sufficient number of I/O lines allows for versatile connectivity to external devices, sensors, and communication interfaces, enhancing the microcontroller's usability.

Technical Specifications

Microcontrollers TMS320F28062UPFPS attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

TMS320

Maximum Clock Frequency:

30 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

40

No. of Terminals:

80

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP80,.55SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Bytes:

53248

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.995 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Trade Compliance

TMS320F28062UPFPS Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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