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TMS320F28062PFPS

Texas Instruments

TMS320F28062PFPS by Texas Instruments

TMS320F28062PFPS by Texas Instruments is a 32-bit microcontroller with 80 terminals, 12 ADC channels, and 14 PWM peripherals. Ideal for automotive applications due to AEC-Q100 screening, it operates at up to 30 MHz with low power mode support. Features include CAN, I2C, SPI connectivity and on-chip flash ROM programmability.

Median Price

$8.656

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,004 parts In-Stock

1+ parts

$6.940

100+ parts

$6.800

1k+ parts

$6.660

10k+ parts

-

2,004

$6.940

$6.800

$6.660

-

Texas Instruments

USA . 2,844 parts In-Stock

1+ parts

$10.372

100+ parts

$9.060

1k+ parts

$6.248

10k+ parts

-

2,844

$10.372

$9.060

$6.248

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,002 parts In-Stock

1+ parts

$6.593

100+ parts

-

1k+ parts

-

10k+ parts

-

3,002

$6.593

-

-

-

Vyrian

USA . 3,964 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,964

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,920 parts In-Stock

1+ parts

$6.246

100+ parts

-

1k+ parts

-

10k+ parts

-

3,920

$6.246

-

-

-

AZTECH Wire

Italy . 1,044 parts In-Stock

1+ parts

$17.970

100+ parts

-

1k+ parts

-

10k+ parts

-

1,044

$17.970

-

-

-

Microchip USA

USA . 2,044 parts In-Stock

1+ parts

$28.800

100+ parts

$28.390

1k+ parts

$28.180

10k+ parts

$27.980

2,044

$28.800

$28.390

$28.180

$27.980

Parana Technologies

USA . 1,942 parts In-Stock

1+ parts

$75.557

100+ parts

-

1k+ parts

-

10k+ parts

-

1,942

$75.557

-

-

-

DigiPath Technology Company

USA . 1,658 parts In-Stock

1+ parts

$83.197

100+ parts

$76.541

1k+ parts

-

10k+ parts

-

1,658

$83.197

$76.541

-

-

ChromeModa Solutions

Germany . 4,743 parts In-Stock

1+ parts

$84.895

100+ parts

$69.614

1k+ parts

-

10k+ parts

-

4,743

$84.895

$69.614

-

-

IDEA Electronic Components Group

UK . 527 parts In-Stock

1+ parts

$84.895

100+ parts

$80.650

1k+ parts

$76.406

10k+ parts

-

527

$84.895

$80.650

$76.406

-

QUARKTWIN TECHNOLOGY LTD

USA . 7,890 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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7,890

-

-

-

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Kepictronics

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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2,000

-

-

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Overview

Enhance your next automotive project with the TMS320F28062PFPS by Texas Instruments. As a leader in microcontrollers, Texas Instruments delivers top-notch quality and reliability. This versatile microcontroller offers advanced features like DAC and ADC channels, DMA capabilities, and a wide range of connectivity options. With a wide operating temperature range and low power mode, this microcontroller is perfect for automotive applications. Trust Texas Instruments to provide the cutting-edge technology you need to bring your projects to life.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials are lightweight and offer good durability, making this microcontroller suitable for applications where weight and resilience are important.

Surface Mount: YES

Surface mount technology enables easy integration onto circuit boards, providing a compact and efficient design for the end product.

Maximum Supply Voltage: 1.995V

Provides a wide range of acceptable supply voltage, giving flexibility in power source options for different applications.

Screening Level: AEC-Q100

Complies with automotive industry standards for reliability and quality, ensuring the microcontroller can withstand harsh environmental conditions in automotive applications.

Bit Size: 32

With a 32-bit architecture, this microcontroller offers enhanced processing power and capability for handling complex tasks and calculations efficiently.

DAC Channels: YES

Integrated digital-to-analog converters provide the ability to convert digital signals into analog output, making this microcontroller suitable for applications requiring precise analog control.

No. of Terminals: 80

With a high number of terminals, this microcontroller allows for versatile connectivity options and interfacing with external devices, enhancing its overall flexibility in system integration.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

The varied package styles offer flexibility in design and mounting options, allowing for optimized thermal management, space-saving solutions, and compatibility with different PCB layouts.

Minimum Supply Voltage: 1.71V

The low minimum supply voltage requirement enables efficient power consumption, making the microcontroller suitable for battery-operated or low-power applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this microcontroller can withstand elevated temperatures in harsh industrial or automotive environments, ensuring reliable performance under challenging conditions.

Technical Specifications

Microcontrollers TMS320F28062PFPS attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

2KB OF OTP ROM

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

TMS320

Maximum Clock Frequency:

30 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

3

No. of I/O Lines:

40

No. of Terminals:

80

On Chip Program ROM Width:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP80,.55SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

RAM Bytes:

53248

ROM Words:

65536

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Speed:

80 rpm

Maximum Supply Current:

245 mA

Maximum Supply Voltage:

1.995 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

12 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C, SCI(2), SPI(2), UART(2), USB

Peripherals:

BOR, COMPARATOR(3), DMA, POR, PWM(14), TIMER(3), WDT

Analog To Digital Convertors:

12-Ch 12-Bit

Trade Compliance

TMS320F28062PFPS Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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