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TMS320F28055PNQ

Texas Instruments

TMS320F28055PNQ by Texas Instruments

TMS320F28055PNQ by Texas Instruments is a 32-bit microcontroller with 16-Ch 12-Bit ADC, 10240 Bytes RAM, and Flash ROM. Ideal for automotive applications due to its -40 to 125 °C operating temperature range and CAN, I2C, SCI(3), SPI connectivity options. Package style: FLATPACK, LOW PROFILE, FINE PITCH.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,471 parts In-Stock

1+ parts

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2,471

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Digiode

USA . 1,079 parts In-Stock

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1,079

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,360 parts In-Stock

1+ parts

$7.000

100+ parts

-

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1,360

$7.000

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AZTECH Wire

Italy . 835 parts In-Stock

1+ parts

$15.223

100+ parts

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835

$15.223

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Parana Technologies

USA . 2,039 parts In-Stock

1+ parts

$34.855

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2,039

$34.855

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ChromeModa Solutions

Germany . 5,915 parts In-Stock

1+ parts

$39.163

100+ parts

$32.114

1k+ parts

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5,915

$39.163

$32.114

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IDEA Electronic Components Group

UK . 2,078 parts In-Stock

1+ parts

$39.163

100+ parts

$37.205

1k+ parts

$35.247

10k+ parts

-

2,078

$39.163

$37.205

$35.247

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DigiPath Technology Company

USA . 1,259 parts In-Stock

1+ parts

-

100+ parts

$35.309

1k+ parts

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1,259

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$35.309

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Corphita

USA . 1,065 parts In-Stock

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1,065

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Microchip USA

USA . 338 parts In-Stock

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338

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Overview

Unlock the power of cutting-edge technology with the TMS320F28055PNQ microcontroller by Texas Instruments. Crafted with precision and reliability, this device offers unparalleled performance in a compact package. Ideal for a wide range of applications, from automotive to industrial control systems, this microcontroller delivers seamless connectivity and advanced features. Experience the value and benefits of Texas Instruments' expertise with the TMS320F28055PNQ, where innovation meets excellence. Elevate your projects to new heights with this top-of-the-line microcontroller.

Feature Benefit Bullets

Package Body Material PLASTIC/EPOXY

Lightweight and durable material helps in reducing overall weight of the product and ensures long-term reliability.

Surface Mount

Allows for easy installation on PCBs, saving time and effort during assembly.

Maximum Supply Voltage 1.995 V

Operates efficiently at lower voltage levels, saving power and reducing heat dissipation.

Package Shape SQUARE

Space-efficient shape that helps in compact design of the overall system.

Bit Size 32

High processing capability with 32-bit architecture, suitable for performance-intensive applications.

Power Supplies (V) 1.8,3.3

Supports multiple power supply options, providing flexibility in power management.

No. of Terminals 80

Sufficient number of terminals for versatile connectivity and I/O options.

Package Style (Meter) FLATPACK, LOW PROFILE, FINE PITCH

Various package styles offer flexibility in PCB layout and design.

Minimum Supply Voltage 1.71 V

Allows for operation at low voltage levels, enhancing power efficiency.

Maximum Operating Temperature 125 °C

Can withstand high temperatures, suitable for demanding industrial environments.

CPU Family TMS320

Part of a well-established CPU family known for performance and reliability.

Minimum Operating Temperature -40 °C

Can operate in extreme cold temperatures, making it suitable for a wide range of environmental conditions.

Terminal Finish NICKEL PALLADIUM GOLD

Provides excellent corrosion resistance and conductivity, enhancing overall durability of the product.

ADC Channels YES

Built-in analog-to-digital converters offer versatility in data acquisition and sensor interfacing.

ROM Words 65536

Large ROM capacity for storing program instructions and data.

Maximum Seated Height 1.6 mm

Low profile design for space-constrained applications.

Width 12 mm

Compact size for efficient PCB mounting and integration.

Peripherals BOR, COMPARATOR(7), POR, PWM(14), TIMER(3), WDT

Rich set of peripherals for enhanced functionality and system control.

Maximum Clock Frequency 20 MHz

High clock frequency for fast processing and real-time operation.

Maximum Time At Peak Reflow Temperature (s) 30

Optimized for reflow soldering processes, ensuring reliable solder joints.

Peak Reflow Temperature °C 260

Capable of withstanding high reflow temperatures during assembly.

Length 12 mm

Compact size for efficient PCB layout and space utilization.

Temperature Grade AUTOMOTIVE

Designed for automotive applications, meeting industry standards and requirements.

Peripheral IC Type MICROCONTROLLER

Integrated microcontroller for system control and processing tasks.

RAM Bytes 10240

Sufficient RAM capacity for data storage and processing.

Technology CMOS

Utilizes CMOS technology for low power consumption and high reliability.

Terminal Form GULL WING

Gull wing terminals for easy soldering and reliable electrical connections.

Analog To Digital Convertors 16-Ch 12-Bit

Multiple ADC channels for precision analog input conversion.

Nominal Supply Voltage 1.8 V

Operates at a low nominal voltage, which is energy-efficient.

PWM Channels YES

Supports pulse width modulation for precise control of digital signals.

Connectivity CAN, I2C, SCI(3), SPI

Various communication interfaces for seamless connectivity with external devices.

ROM Programmability FLASH

Flash ROM for easy programmability and firmware updates.

Terminal Pitch 0.5 mm

Fine pitch terminals for compact design and efficient PCB layout.

Moisture Sensitivity Level (MSL) 3

MSL level 3 indicates moderate sensitivity to moisture, suitable for standard handling and storage conditions.

Speed 60 rpm

Operates at a moderate speed suitable for a wide range of applications.

On Chip Program ROM Width 8

8-bit wide on-chip program ROM for storing program instructions.

No. of I/O Lines 42

Sufficient number of I/O lines for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers TMS320F28055PNQ attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

TMS320

Maximum Clock Frequency:

20 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

42

No. of Terminals:

80

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Bytes:

10240

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

60 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.995 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C, SCI(3), SPI

Peripherals:

BOR, COMPARATOR(7), POR, PWM(14), TIMER(3), WDT

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

TMS320F28055PNQ Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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