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TMS320F28052PNS

Texas Instruments

TMS320F28052PNS by Texas Instruments

TMS320F28052PNS by Texas Instruments is a 32-bit microcontroller with 80 terminals, 20KB RAM, and 16-Ch 12-Bit ADC. Ideal for automotive applications due to AEC-Q100 screening level, CAN connectivity, and operating temperature range of -40 to 125°C.

Median Price

$6.094

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,263 parts In-Stock

1+ parts

$6.094

100+ parts

$4.968

1k+ parts

$3.312

10k+ parts

-

3,263

$6.094

$4.968

$3.312

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,662 parts In-Stock

1+ parts

$5.789

100+ parts

-

1k+ parts

-

10k+ parts

-

4,662

$5.789

-

-

-

Vyrian

USA . 2,892 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,892

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,145 parts In-Stock

1+ parts

$5.485

100+ parts

-

1k+ parts

-

10k+ parts

-

1,145

$5.485

-

-

-

AZTECH Wire

Italy . 1,193 parts In-Stock

1+ parts

$9.640

100+ parts

-

1k+ parts

-

10k+ parts

-

1,193

$9.640

-

-

-

Microchip USA

USA . 1,248 parts In-Stock

1+ parts

$16.670

100+ parts

$16.430

1k+ parts

$16.310

10k+ parts

$16.200

1,248

$16.670

$16.430

$16.310

$16.200

Parana Technologies

USA . 2,142 parts In-Stock

1+ parts

$61.277

100+ parts

-

1k+ parts

-

10k+ parts

-

2,142

$61.277

-

-

-

DigiPath Technology Company

USA . 1,289 parts In-Stock

1+ parts

$67.474

100+ parts

$62.076

1k+ parts

-

10k+ parts

-

1,289

$67.474

$62.076

-

-

IDEA Electronic Components Group

UK . 1,118 parts In-Stock

1+ parts

$68.851

100+ parts

$65.408

1k+ parts

$61.966

10k+ parts

-

1,118

$68.851

$65.408

$61.966

-

ChromeModa Solutions

Germany . 696 parts In-Stock

1+ parts

$68.851

100+ parts

$56.458

1k+ parts

-

10k+ parts

-

696

$68.851

$56.458

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-

Component Stockers USA

USA . 962 parts In-Stock

1+ parts

$72.480

100+ parts

-

1k+ parts

-

10k+ parts

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962

$72.480

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-

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QUARKTWIN TECHNOLOGY LTD

USA . 20,441 parts In-Stock

1+ parts

-

100+ parts

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20,441

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

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10,000

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Overview

Unlock the power of innovation with the TMS320F28052PNS microcontroller by Texas Instruments. As a leader in cutting-edge technology, Texas Instruments delivers top-quality products that exceed expectations. This microcontroller is versatile and reliable, perfect for a wide range of applications. Experience the seamless integration and superior performance this product offers, providing unparalleled value and benefits to customers seeking efficiency and excellence in their projects. Elevate your designs with the TMS320F28052PNS and discover endless possibilities for success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good protection for the microcontroller, making it durable and reliable for various applications.

Maximum Supply Voltage: 1.995 V

Allows for a higher operating voltage range, providing flexibility in power supply options.

No. of Serial I/Os: 5

Multiple serial I/Os allow for easy communication with other devices, expanding the connectivity options of the microcontroller.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, this product contains all necessary components (CPU, memory, I/O interfaces) on a single chip, simplifying system design and reducing overall size.

Maximum Clock Frequency: 20 MHz

High clock frequency enables fast data processing and operation, making it suitable for applications that require real-time performance.

ADC Channels: YES

Built-in Analog to Digital Convertors allow for easy interfacing with analog sensors and signals, making it suitable for a wide range of measurement and control applications.

Technical Specifications

Microcontrollers TMS320F28052PNS attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

TMS320

Maximum Clock Frequency:

20 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

3

No. of External Interrupts:

3

No. of I/O Lines:

42

No. of Serial I/Os:

5

No. of Terminals:

80

No. of Timers:

3

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Bytes:

20480

RAM Words:

20

ROM Words:

32768

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.6 mm

Speed:

60 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

110 mA

Maximum Supply Voltage:

1.995 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C, SCI(3), SPI

Peripherals:

BOR, COMPARATOR(7), POR, PWM(14), TIMER(3), WDT

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

TMS320F28052PNS Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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