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TMS320F28052FPNT

Texas Instruments

TMS320F28052FPNT by Texas Instruments

TMS320F28052FPNT by Texas Instruments is a 32-bit microcontroller with 16-Ch 12-Bit ADC and 14 PWM channels. Ideal for industrial applications, it operates at up to 30 MHz with -40 to 105 °C temperature range. Features include CAN, I2C, SPI connectivity and on-chip Flash ROM programmability.

Median Price

$5.395

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 27,344 parts In-Stock

1+ parts

$5.395

100+ parts

$4.713

1k+ parts

$3.250

10k+ parts

-

27,344

$5.395

$4.713

$3.250

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ozdisan Elektronik

Türkiye . 38 parts In-Stock

1+ parts

$3.030

100+ parts

-

1k+ parts

-

10k+ parts

-

38

$3.030

-

-

-

Digiode

USA . 1,698 parts In-Stock

1+ parts

$5.125

100+ parts

-

1k+ parts

-

10k+ parts

-

1,698

$5.125

-

-

-

Vyrian

USA . 3,324 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,324

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,532 parts In-Stock

1+ parts

$4.856

100+ parts

-

1k+ parts

-

10k+ parts

-

2,532

$4.856

-

-

-

AZTECH Wire

Italy . 142 parts In-Stock

1+ parts

$9.550

100+ parts

-

1k+ parts

-

10k+ parts

-

142

$9.550

-

-

-

Microchip USA

USA . 1,784 parts In-Stock

1+ parts

$16.360

100+ parts

$16.130

1k+ parts

$16.010

10k+ parts

$15.890

1,784

$16.360

$16.130

$16.010

$15.890

Parana Technologies

USA . 1,422 parts In-Stock

1+ parts

$23.328

100+ parts

-

1k+ parts

$23.971

10k+ parts

-

1,422

$23.328

-

$23.971

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DigiPath Technology Company

USA . 1,833 parts In-Stock

1+ parts

$25.687

100+ parts

$23.632

1k+ parts

-

10k+ parts

-

1,833

$25.687

$23.632

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-

ChromeModa Solutions

Germany . 4,029 parts In-Stock

1+ parts

$26.211

100+ parts

$21.493

1k+ parts

-

10k+ parts

-

4,029

$26.211

$21.493

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-

IDEA Electronic Components Group

UK . 912 parts In-Stock

1+ parts

$26.211

100+ parts

$24.900

1k+ parts

$23.590

10k+ parts

-

912

$26.211

$24.900

$23.590

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GreenTree Electronics

Israel . 50 parts In-Stock

1+ parts

-

100+ parts

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50

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Authorized Procurement Solutions

USA . 38 parts In-Stock

1+ parts

-

100+ parts

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38

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Overview

Unlock the power of cutting-edge technology with the TMS320F28052FPNT microcontroller by Texas Instruments. Designed for industrial applications, this high-quality device offers unparalleled performance and reliability. With advanced features such as multiple ADC channels, PWM capabilities, and connectivity options like CAN and SPI, this microcontroller is a versatile solution for a wide range of projects. Trust in Texas Instruments' renowned expertise in semiconductor manufacturing to deliver a product that exceeds expectations. Experience seamless integration and enhanced functionality with the TMS320F28052FPNT, setting new standards in the world of microcontrollers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the microcontroller lightweight and durable.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation on PCBs, saving time and effort during production.

Maximum Supply Voltage: 1.995 V

The high maximum supply voltage ensures stable performance even under high voltage conditions.

Screening Level: AEC-Q100

The AEC-Q100 screening level ensures that the microcontroller meets automotive-grade reliability and quality standards.

Package Shape: SQUARE

The square package shape provides a compact design, saving space on the PCB.

Bit Size: 32

The 32-bit architecture allows for faster and more complex processing tasks to be performed efficiently.

No. of Terminals: 80

The high number of terminals provide ample connectivity options for various external devices and components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, fine pitch package style makes it suitable for applications where space is limited.

Minimum Supply Voltage: 1.71 V

The low minimum supply voltage ensures compatibility with a wide range of power sources.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature allows the microcontroller to function reliably even in extreme temperature conditions.

CPU Family: C28X

The C28X CPU family offers high performance and efficiency for various embedded applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures the microcontroller can operate in cold environments without issues.

Technical Specifications

Microcontrollers TMS320F28052FPNT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

1-CH BUFFRED DAC IS THERE

Address Bus Width:

0

Bit Size:

32

CPU Family:

C28X

Maximum Clock Frequency:

30 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

42

No. of Terminals:

80

On Chip Program ROM Width:

16

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

16384

ROM Words:

32768

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.6 mm

Speed:

60 rpm

Maximum Supply Voltage:

1.995 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C, SCI(3), SPI

Peripherals:

BOR, COMPARATOR(7), POR, PWM(14), TIMER(3), WDT

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

TMS320F28052FPNT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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