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TMS320F28050PNT

Texas Instruments

TMS320F28050PNT by Texas Instruments

TMS320F28050PNT by Texas Instruments is a 32-bit microcontroller with 16-Ch 12-Bit ADC, 14 PWM channels, and operates at max frequency of 20 MHz. Ideal for industrial applications requiring CAN, I2C, SCI(3), SPI connectivity and features BOR, POR, WDT peripherals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,529 parts In-Stock

1+ parts

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3,529

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Digiode

USA . 1,569 parts In-Stock

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1,569

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Distributors (Availability)

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AZTECH Wire

Italy . 260 parts In-Stock

1+ parts

$9.898

100+ parts

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260

$9.898

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One Stop Electronics

USA . 801 parts In-Stock

1+ parts

$22.000

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801

$22.000

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Parana Technologies

USA . 556 parts In-Stock

1+ parts

$40.598

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556

$40.598

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DigiPath Technology Company

USA . 2,362 parts In-Stock

1+ parts

$44.704

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2,362

$44.704

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ChromeModa Solutions

Germany . 3,160 parts In-Stock

1+ parts

$45.616

100+ parts

$37.405

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3,160

$45.616

$37.405

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IDEA Electronic Components Group

UK . 1,780 parts In-Stock

1+ parts

$45.616

100+ parts

$43.335

1k+ parts

$41.054

10k+ parts

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1,780

$45.616

$43.335

$41.054

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Corphita

USA . 617 parts In-Stock

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617

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Microchip USA

USA . 497 parts In-Stock

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497

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Overview

Unleash the power of innovation with the TMS320F28050PNT microcontroller by Texas Instruments. This cutting-edge device offers unmatched quality and reliability, making it the top choice for a wide range of applications. From industrial automation to consumer electronics, this microcontroller delivers exceptional performance and efficiency. Experience seamless connectivity and advanced features that cater to your specific needs. Elevate your projects to new heights with the TMS320F28050PNT - where excellence meets value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good durability and protection for the microcontroller, ensuring long-term reliability.

Surface Mount: YES

Enables easy integration onto circuit boards, saving space and simplifying manufacturing processes.

Maximum Supply Voltage: 1.995 V

Allows for efficient power usage and compatibility with various power sources.

Package Shape: SQUARE

Facilitates uniform and compact design layout in electronic devices.

Bit Size: 32

Offers high processing capabilities and performance for complex tasks.

Power Supplies (V): 1.8,3.3

Provides flexibility in power input options for different operating conditions.

No. of Terminals: 80

Allows for versatile connectivity options and interfacing with external components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Enhances compactness and efficiency in circuit board layout and assembly.

Minimum Supply Voltage: 1.71 V

Ensures stable operation even under low voltage conditions.

Maximum Operating Temperature: 105 °C

Suitable for industrial environments with high temperature requirements.

CPU Family: TMS320

Comes from a well-known and reputable microcontroller family, ensuring reliability and performance.

Minimum Operating Temperature: -40 °C

Suitable for use in extreme cold environments without compromising performance.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides good conductivity and corrosion resistance for reliable connections.

ADC Channels: YES

Enables analog-to-digital conversion for interfacing with sensors and external analog devices.

Terminal Position: QUAD

Facilitates easy connection setup and organization on circuit boards.

ROM Words: 16384

Offers ample memory capacity for storing program instructions and data.

Maximum Seated Height: 1.6 mm

Allows for slim and compact designs in electronic devices.

Width: 12 mm

Provides a balance between size and functionality for various applications.

Peripherals: BOR, COMPARATOR(6), POR, PWM(14), TIMER(3), WDT

Offers a wide range of peripheral features for diverse application requirements.

Maximum Clock Frequency: 20 MHz

Provides high-speed processing capabilities for efficient operation.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures reliable soldering during manufacturing processes.

Peak Reflow Temperature °C: 260

Compatible with standard reflow soldering processes for ease of assembly.

Length: 12 mm

Complements the compact square package shape for uniform design aesthetics.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments and operating conditions.

Peripheral IC Type: MICROCONTROLLER

Tailored for specific microcontroller applications with integrated peripherals.

RAM Bytes: 6144

Provides sufficient random-access memory capacity for data storage and manipulation.

Technology: CMOS

Utilizes low power consumption and high noise immunity CMOS technology for efficient operation.

Terminal Form: GULL WING

Facilitates easy surface mounting and soldering on circuit boards.

Analog To Digital Convertors: 16-Ch 12-Bit

Offers high-resolution analog-to-digital conversion for accurate sensor interfacing.

Nominal Supply Voltage: 1.8 V

Optimal voltage input for efficient and reliable operation.

PWM Channels: YES

Enables pulse-width modulation for controlling various outputs and devices.

Connectivity: CAN, I2C, SCI(3), SPI

Supports multiple communication protocols for diverse connectivity options.

ROM Programmability: FLASH

Allows for reprogrammable memory storage for flexible application development.

Terminal Pitch: 0.5 mm

Provides compact terminal spacing for efficient circuit board layout.

Moisture Sensitivity Level (MSL): 3

Suitable for industrial and manufacturing environments with standard moisture levels.

Speed: 60 rpm

Provides fast processing speed for quick response times in applications.

On Chip Program ROM Width: 8

Optimizes memory storage capacity for efficient program execution.

No. of I/O Lines: 42

Offers ample input-output lines for versatile interfacing with external devices.

Technical Specifications

Microcontrollers TMS320F28050PNT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

TMS320

Maximum Clock Frequency:

20 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

42

No. of Terminals:

80

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Bytes:

6144

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

60 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.995 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C, SCI(3), SPI

Peripherals:

BOR, COMPARATOR(6), POR, PWM(14), TIMER(3), WDT

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

TMS320F28050PNT Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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