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TMS320F28050PNS

Texas Instruments

TMS320F28050PNS by Texas Instruments

TMS320F28050PNS by Texas Instruments is a 32-bit microcontroller with 12KB RAM, 16-Ch 12-Bit ADC, and 14 PWM channels. Ideal for automotive applications due to AEC-Q100 screening, CAN connectivity, and operating temperature range of -40 to 125°C. Package style: Flatpack, low profile, fine pitch; suitable for compact designs in automotive electronics.

Median Price

$4.880

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,965 parts In-Stock

1+ parts

$4.880

100+ parts

$3.978

1k+ parts

$2.652

10k+ parts

-

2,965

$4.880

$3.978

$2.652

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,424 parts In-Stock

1+ parts

$4.636

100+ parts

-

1k+ parts

-

10k+ parts

-

2,424

$4.636

-

-

-

Vyrian

USA . 2,911 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,911

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,582 parts In-Stock

1+ parts

$4.392

100+ parts

-

1k+ parts

-

10k+ parts

-

3,582

$4.392

-

-

-

AZTECH Wire

Italy . 998 parts In-Stock

1+ parts

$17.150

100+ parts

-

1k+ parts

-

10k+ parts

-

998

$17.150

-

-

-

Parana Technologies

USA . 245 parts In-Stock

1+ parts

$22.602

100+ parts

$2,098.979

1k+ parts

$20.342

10k+ parts

-

245

$22.602

$2,098.979

$20.342

-

DigiPath Technology Company

USA . 2,190 parts In-Stock

1+ parts

$24.888

100+ parts

$22.897

1k+ parts

-

10k+ parts

-

2,190

$24.888

$22.897

-

-

ChromeModa Solutions

Germany . 6,136 parts In-Stock

1+ parts

$25.396

100+ parts

$20.825

1k+ parts

-

10k+ parts

-

6,136

$25.396

$20.825

-

-

IDEA Electronic Components Group

UK . 789 parts In-Stock

1+ parts

$25.396

100+ parts

$24.126

1k+ parts

$22.856

10k+ parts

-

789

$25.396

$24.126

$22.856

-

Microchip USA

USA . 1,377 parts In-Stock

1+ parts

$30.990

100+ parts

$30.800

1k+ parts

$30.700

10k+ parts

$30.610

1,377

$30.990

$30.800

$30.700

$30.610

Overview

Unlock the power of cutting-edge technology with the TMS320F28050PNS by Texas Instruments. As a leader in microcontrollers, Texas Instruments delivers unparalleled quality and reliability. This versatile device is perfect for a wide range of applications, offering customers value and benefits like never before. Experience seamless connectivity and top-notch performance with this innovative product. Trust Texas Instruments to provide you with the tools you need to succeed in today's competitive market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and cost-effective, ideal for applications where weight and cost are important factors.

Maximum Supply Voltage: 1.995 V

This low maximum supply voltage helps in reducing power consumption and heat dissipation, making the product energy-efficient.

ADC Channels: YES

Having Analog to Digital Converter channels integrated allows for efficient analog signal processing, making the product suitable for applications that require precise measurements.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, this product offers a wide range of built-in peripherals like timers, PWM, and serial communication interfaces, making it versatile for different applications.

ROM Programmability: FLASH

The Flash ROM programmability allows for easy firmware updates and quick development cycles, making the product suitable for applications that require flexibility and frequent updates.

Technical Specifications

Microcontrollers TMS320F28050PNS attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

TMS320

Maximum Clock Frequency:

20 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

3

No. of External Interrupts:

3

No. of I/O Lines:

42

No. of Serial I/Os:

5

No. of Terminals:

80

No. of Timers:

3

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Bytes:

20480

RAM Words:

12

ROM Words:

16384

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.6 mm

Speed:

60 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

110 mA

Maximum Supply Voltage:

1.995 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C, SCI(3), SPI

Peripherals:

BOR, COMPARATOR(6), POR, PWM(14), TIMER(3), WDT

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

TMS320F28050PNS Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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