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TMS320F28035RSHT

Texas Instruments

TMS320F28035RSHT by Texas Instruments

TMS320F28035RSHT by Texas Instruments is a 32-bit microcontroller with 60 MHz clock frequency, 13-Ch 12-Bit ADC channels, and 21 PWM peripherals. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities. Package style includes chip carrier, heat sink/slug, very thin profile.

Median Price

$5.531

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 46 parts In-Stock

1+ parts

$2.473

100+ parts

$2.445

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$2.412

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46

$2.473

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$2.412

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Verical

USA . 46 parts In-Stock

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$2.473

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46

$2.473

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Texas Instruments

USA . 10,430 parts In-Stock

1+ parts

$8.589

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$7.502

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$5.174

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10,430

$8.589

$7.502

$5.174

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Chip1Stop

Japan . 46 parts In-Stock

1+ parts

$9.258

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$7.218

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46

$9.258

$7.218

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Distributors (In-Stock)

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Digiode

USA . 2,030 parts In-Stock

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$6.862

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$6.862

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Nova Conductors

Japan . 450 parts In-Stock

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$9.000

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$9.000

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Vyrian

USA . 5,836 parts In-Stock

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5,836

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ComSIT Distribution GmbH

Germany . 2,360 parts In-Stock

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Speed Components Ltd

Israel . 48 parts In-Stock

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48

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Prism Electronics

USA . 6 parts In-Stock

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6

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Semicontronic

India . 1,786 parts In-Stock

1+ parts

$6.140

100+ parts

$5.986

1k+ parts

$5.956

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1,786

$6.140

$5.986

$5.956

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Ampacity Inc.

Singapore . 1,767 parts In-Stock

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$6.140

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Corphita

USA . 4,434 parts In-Stock

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$6.501

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$6.501

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Continental Prestige Electronics

USA . 6,646 parts In-Stock

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$9.000

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$8.820

6,646

$9.000

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$8.820

Corohmni

South Africa . 106 parts In-Stock

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$9.000

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$9.000

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Advanced Electronics

New Zealand . 40 parts In-Stock

1+ parts

$9.270

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$8.807

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$8.806

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40

$9.270

$8.807

$8.806

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Microchip USA

USA . 2,473 parts In-Stock

1+ parts

$30.720

100+ parts

$30.280

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$30.060

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$29.840

2,473

$30.720

$30.280

$30.060

$29.840

Parana Technologies

USA . 1,362 parts In-Stock

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$67.525

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$67.525

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DigiPath Technology Company

USA . 1,900 parts In-Stock

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$74.354

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$74.354

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IDEA Electronic Components Group

UK . 644 parts In-Stock

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$75.871

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$72.077

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$68.284

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644

$75.871

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ChromeModa Solutions

Germany . 577 parts In-Stock

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$75.871

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$62.214

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Lixinc

USA . 17,356 parts In-Stock

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iodParts Technologies Inc.

India . 8,021 parts In-Stock

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Perfect Parts

USA . 3,360 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

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$8.820

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$8.550

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$8.370

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$8.550

$8.370

Futuretech Components

Singapore . 770 parts In-Stock

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Kepictronics

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Argo Parts USA

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Overview

Unlock the full potential of your projects with the TMS320F28035RSHT microcontroller by Texas Instruments. Built with precision and reliability, this microcontroller offers a wide range of applications in the automotive, industrial, and consumer electronics industries. With advanced features like 13-channel ADC, 3 timers, and 21 PWM channels, this powerhouse delivers high performance at a maximum clock frequency of 60 MHz. Trust Texas Instruments for quality and innovation, and experience the value and benefits of the TMS320F28035RSHT in your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good durability and protection for the microcontroller, ensuring longevity and reliability.

Maximum Supply Voltage: 1.995 V

The high maximum supply voltage allows for flexibility in power supply options, making it suitable for a variety of applications.

RAM Bytes: 20480

With a large RAM size of 20480 bytes, this microcontroller can handle complex operations and data processing efficiently.

ADC Channels: YES

The availability of ADC channels enables the microcontroller to interface with analog sensors or signals, increasing its versatility.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, this product has various built-in peripherals such as timers, PWM, and temperature sensors, reducing the need for external components.

Connectivity: CAN, I2C, LIN, SCI, SPI

Support for multiple communication protocols like CAN, I2C, LIN, SCI, and SPI enables seamless integration with other devices and systems.

Technical Specifications

Microcontrollers TMS320F28035RSHT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO REQUIRES 3.3V I/O SUPPLY

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

TMS320

Maximum Clock Frequency:

60 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N56

JESD-609 Code:

e4

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of External Interrupts:

3

No. of I/O Lines:

26

No. of Serial I/Os:

2

No. of Terminals:

56

No. of Timers:

3

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC56,.27SQ,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Bytes:

20480

RAM Words:

20

ROM Words:

65536

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1 mm

Speed:

60 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

120 mA

Maximum Supply Voltage:

1.995 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"CAN, I2C, LIN, SCI, SPI"

Peripherals:

"BOR, COMPARATOR(3), PWM(21), TEMPERATURE SENSOR, TIMER(3), WDT"

Analog To Digital Convertors:

13-Ch 12-Bit

Trade Compliance

TMS320F28035RSHT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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