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TMS320F28033RSHT

Texas Instruments

TMS320F28033RSHT by Texas Instruments

TMS320F28033RSHT by Texas Instruments is a 32-bit microcontroller with 60 MHz clock frequency, 13-Ch 12-Bit ADC, and 3 timers. Ideal for industrial applications requiring low power mode, it features CAN, I2C, LIN connectivity options and operates in temperature range of -40 to 105°C.

Median Price

$5.350

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,325 parts In-Stock

1+ parts

$5.350

100+ parts

$5.240

1k+ parts

$5.140

10k+ parts

-

1,325

$5.350

$5.240

$5.140

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,285 parts In-Stock

1+ parts

$5.216

100+ parts

-

1k+ parts

-

10k+ parts

-

2,285

$5.216

-

-

-

Vyrian

USA . 5,217 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,217

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 679 parts In-Stock

1+ parts

$4.941

100+ parts

-

1k+ parts

-

10k+ parts

-

679

$4.941

-

-

-

Parana Technologies

USA . 988 parts In-Stock

1+ parts

$14.377

100+ parts

$1,335.128

1k+ parts

$12.939

10k+ parts

-

988

$14.377

$1,335.128

$12.939

-

AZTECH Wire

Italy . 920 parts In-Stock

1+ parts

$15.580

100+ parts

-

1k+ parts

-

10k+ parts

-

920

$15.580

-

-

-

DigiPath Technology Company

USA . 2,257 parts In-Stock

1+ parts

$15.831

100+ parts

-

1k+ parts

-

10k+ parts

-

2,257

$15.831

-

-

-

ChromeModa Solutions

Germany . 3,399 parts In-Stock

1+ parts

$16.154

100+ parts

$13.246

1k+ parts

-

10k+ parts

-

3,399

$16.154

$13.246

-

-

IDEA Electronic Components Group

UK . 1,554 parts In-Stock

1+ parts

$16.154

100+ parts

$15.346

1k+ parts

$14.539

10k+ parts

-

1,554

$16.154

$15.346

$14.539

-

Microchip USA

USA . 440 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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440

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Overview

Unlock the power of innovative technology with the TMS320F28033RSHT microcontroller from Texas Instruments. With a wide range of applications in various industries, this high-quality product offers unmatched performance and reliability. Designed with cutting-edge features and advanced capabilities, this microcontroller provides customers with exceptional value, benefits, and advantages. Trust in Texas Instruments' reputation for excellence and choose the TMS320F28033RSHT for all your microcontroller needs. Experience the difference today and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides good insulation and durability for the microcontroller, ensuring long-term reliability.

Maximum Supply Voltage: 1.995 V

Allows for a wide range of voltage inputs, making the microcontroller versatile for various power supply configurations.

Bit Size: 32

With a 32-bit architecture, the microcontroller can handle complex computations and data processing efficiently.

ADC Channels: YES

The availability of analog-to-digital converters allows the microcontroller to interface with sensor inputs, making it suitable for a wide range of applications.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, it combines processing capabilities with built-in peripherals, making it a compact and efficient solution for embedded systems.

ROM Programmability: FLASH

Flash programmable ROM enables easy and quick updates to the microcontroller's firmware, improving flexibility and ease of development.

Connectivity: CAN, I2C, LIN, SCI, SPI

Multiple communication interfaces provide versatility in connecting the microcontroller to a wide range of external devices and systems.

Low Power Mode: YES

Support for low power modes helps in optimizing energy consumption, making it suitable for battery-powered and energy-efficient applications.

Technical Specifications

Microcontrollers TMS320F28033RSHT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO REQUIRES 3.3V I/O SUPPLY

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

TMS320

Maximum Clock Frequency:

60 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N56

JESD-609 Code:

e4

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of External Interrupts:

3

No. of I/O Lines:

26

No. of Serial I/Os:

2

No. of Terminals:

56

No. of Timers:

3

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC56,.27SQ,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Bytes:

20480

RAM Words:

20

ROM Words:

32768

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1 mm

Speed:

60 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

120 mA

Maximum Supply Voltage:

1.995 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"CAN, I2C, LIN, SCI, SPI"

Peripherals:

"BOR, COMPARATOR(3), PWM(21), TEMPERATURE SENSOR, TIMER(3), WDT"

Analog To Digital Convertors:

13-Ch 12-Bit

Trade Compliance

TMS320F28033RSHT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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