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TMS320F28032RSHS

Texas Instruments

TMS320F28032RSHS by Texas Instruments

TMS320F28032RSHS by Texas Instruments is a 32-bit microcontroller with 60 MHz clock frequency, 13-Ch 12-Bit ADCs, and 3 timers. Ideal for automotive applications due to AEC-Q100 screening level, CAN/I2C/LIN/SCI/SPI connectivity, and low power mode support.

Median Price

$7.303

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,050 parts In-Stock

1+ parts

$7.303

100+ parts

$5.954

1k+ parts

$3.969

10k+ parts

-

1,050

$7.303

$5.954

$3.969

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 632 parts In-Stock

1+ parts

$6.938

100+ parts

-

1k+ parts

-

10k+ parts

-

632

$6.938

-

-

-

Vyrian

USA . 4,289 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,289

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,250 parts In-Stock

1+ parts

$6.573

100+ parts

-

1k+ parts

-

10k+ parts

-

2,250

$6.573

-

-

-

AZTECH Wire

Italy . 709 parts In-Stock

1+ parts

$17.970

100+ parts

-

1k+ parts

-

10k+ parts

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709

$17.970

-

-

-

Microchip USA

USA . 2,942 parts In-Stock

1+ parts

$19.080

100+ parts

$18.810

1k+ parts

$18.670

10k+ parts

$18.540

2,942

$19.080

$18.810

$18.670

$18.540

Parana Technologies

USA . 2,155 parts In-Stock

1+ parts

$69.156

100+ parts

-

1k+ parts

-

10k+ parts

-

2,155

$69.156

-

-

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DigiPath Technology Company

USA . 1,265 parts In-Stock

1+ parts

$76.149

100+ parts

-

1k+ parts

-

10k+ parts

-

1,265

$76.149

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-

-

ChromeModa Solutions

Germany . 4,525 parts In-Stock

1+ parts

$77.703

100+ parts

$63.716

1k+ parts

-

10k+ parts

-

4,525

$77.703

$63.716

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-

IDEA Electronic Components Group

UK . 1,950 parts In-Stock

1+ parts

$77.703

100+ parts

$73.818

1k+ parts

$69.933

10k+ parts

-

1,950

$77.703

$73.818

$69.933

-

QUARKTWIN TECHNOLOGY LTD

USA . 5,670 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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5,670

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Overview

Discover the innovative TMS320F28032RSHS by Texas Instruments, setting new standards in microcontrollers for automotive applications. With a powerful 32-bit processor, extensive peripheral options, and low power mode, this chip offers unmatched performance and efficiency. Manufactured with high-quality materials and advanced technology, it ensures reliability and durability. Ideal for CAN, I2C, LIN, SCI, and SPI connectivity, this microcontroller is designed to meet the demands of the automotive industry. Unlock the full potential of your automotive projects with the TMS320F28032RSHS and experience superior quality and performance like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy package body material makes the product lightweight and durable, ideal for applications where weight and sturdiness are important factors.

Maximum Supply Voltage: 1.995 V

With a maximum supply voltage of 1.995 V, this microcontroller is designed for low-power applications, making it energy-efficient and cost-effective.

RAM Words: 20

With 20 RAM words, this microcontroller provides sufficient memory for storing and manipulating data during operation, ensuring efficient performance.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, this product comes equipped with various built-in peripherals such as timers, PWM channels, and ADC channels, making it a versatile and integrated solution for a wide range of applications.

Maximum Clock Frequency: 60 MHz

Operating at a maximum clock frequency of 60 MHz, this microcontroller offers high-speed processing capabilities, suitable for applications that require rapid data processing and response times.

Technical Specifications

Microcontrollers TMS320F28032RSHS attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO REQUIRES 3.3V I/O SUPPLY

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

TMS320

Maximum Clock Frequency:

60 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N56

JESD-609 Code:

e4

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of External Interrupts:

3

No. of I/O Lines:

26

No. of Serial I/Os:

2

No. of Terminals:

56

No. of Timers:

3

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC56,.27SQ,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Bytes:

20480

RAM Words:

20

ROM Words:

32768

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1 mm

Speed:

60 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

120 mA

Maximum Supply Voltage:

1.995 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"CAN, I2C, LIN, SCI, SPI"

Peripherals:

"BOR, COMPARATOR(3), PWM(21), TEMPERATURE SENSOR, TIMER(3), WDT"

Analog To Digital Convertors:

13-Ch 12-Bit

Trade Compliance

TMS320F28032RSHS Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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