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TMS320F28031RSHT

Texas Instruments

TMS320F28031RSHT by Texas Instruments

TMS320F28031RSHT by Texas Instruments is a 32-bit microcontroller with 56 terminals, operating at up to 60 MHz. It features 26 I/O lines, PWM channels, and ADC channels, making it ideal for industrial applications requiring high-speed processing and precise control.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,306 parts In-Stock

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Digiode

USA . 557 parts In-Stock

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557

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AZTECH Wire

Italy . 775 parts In-Stock

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$5.026

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$5.026

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One Stop Electronics

USA . 1,232 parts In-Stock

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$10.000

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Parana Technologies

USA . 1,626 parts In-Stock

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$48.167

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$4,473.018

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$43.350

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$48.167

$4,473.018

$43.350

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DigiPath Technology Company

USA . 1,220 parts In-Stock

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$53.038

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ChromeModa Solutions

Germany . 4,467 parts In-Stock

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$54.120

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$44.378

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$54.120

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IDEA Electronic Components Group

UK . 1,288 parts In-Stock

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$54.120

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$51.414

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$48.708

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$54.120

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$48.708

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Corphita

USA . 2,666 parts In-Stock

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Microchip USA

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Overview

Unlock the potential of your next project with the TMS320F28031RSHT microcontroller from Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality and reliability. This versatile chip is perfect for a wide range of applications, offering unmatched value with its high performance and efficient power consumption. With features like ADC channels, PWM channels, and ROM programmability, this microcontroller provides endless possibilities for your designs. Trust Texas Instruments to provide you with the tools you need to bring your ideas to life.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, making it ideal for various applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving time and space.

Maximum Supply Voltage: 1.995 V

This allows for a wide range of supply voltages, making it versatile for different power requirements.

Package Shape: SQUARE

The square shape of the package allows for efficient use of space on the PCB, optimizing design layout.

Bit Size: 32

A 32-bit architecture provides high processing power and performance for demanding applications.

Power Supplies (V): 1.8,3.3

Support for multiple power supply voltages enables compatibility with various systems and components.

No. of Terminals: 56

Having a higher number of terminals offers greater connectivity options for interfacing with other devices.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The different package styles allow for customization based on thermal management needs and space constraints.

Minimum Supply Voltage: 1.71 V

The low minimum supply voltage ensures efficient power usage and compatibility with low-power applications.

Maximum Operating Temperature: 105 °C

A high operating temperature range makes the microcontroller suitable for industrial and extreme environments.

CPU Family: TMS320

Belonging to the TMS320 family indicates high-performance and reliability, backed by a reputable brand.

Minimum Operating Temperature: -40 °C

A wide temperature range ensures operation in harsh conditions, making it a robust choice for various applications.

Terminal Finish: NICKEL PALLADIUM GOLD

This terminal finish offers corrosion resistance and reliable electrical connections for long-term usability.

ADC Channels: YES

The presence of Analog-to-Digital Converter channels allows for accurate and precise analog signal processing.

Terminal Position: QUAD

Quad terminal positioning facilitates easy soldering and assembly on the PCB, saving assembly time and effort.

ROM Words: 32768

With a large ROM capacity, the microcontroller can store ample program instructions and data for complex applications.

Maximum Seated Height: 1 mm

A low seated height saves space in compact designs while still providing high functionality.

Width: 7 mm

A compact width dimension offers versatility in board layouts and integration into various equipment designs.

Maximum Clock Frequency: 60 MHz

A high clock frequency enables fast processing speeds, essential for real-time applications and data-intensive tasks.

Maximum Time At Peak Reflow Temperature (s): 30

This spec ensures reliable soldering and reflow processes during manufacturing, leading to high-quality assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance indicates robustness and reliability in manufacturing processes.

Length: 7 mm

A compact length dimension allows for flexibility in board placement and compact product designs.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperatures ensures reliable operation in rugged environments and industrial applications.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller with various peripherals integrated offers a comprehensive solution for diverse application requirements.

RAM Bytes: 16384

With a spacious RAM capacity, the microcontroller can efficiently handle data processing and storage requirements.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, enhancing overall performance and efficiency.

Terminal Form: NO LEAD

The no-lead terminal form factor simplifies the assembly process and enhances reliability in connection.

Nominal Supply Voltage: 1.8 V

The nominal supply voltage ensures stable and efficient operation within specified voltage requirements.

PWM Channels: YES

Pulse Width Modulation (PWM) channels enable precise control of analog signals and outputs for enhanced system functionality.

ROM Programmability: FLASH

ROM programmability using Flash technology allows for convenient and flexible updating of program code and data storage.

Terminal Pitch: 0.4 mm

A tight terminal pitch enables high-density mounting on PCBs, optimizing space usage and layout design.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity to moisture, requiring standard precautions in handling and storage.

Speed: 60 rpm

A speed of 60 rpm allows for efficient processing and execution of instructions in time-critical applications.

No. of I/O Lines: 26

Having 26 I/O lines offers ample connectivity options for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers TMS320F28031RSHT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO REQUIRES 3.3V I/O SUPPLY

Address Bus Width:

0

Bit Size:

32

CPU Family:

TMS320

Maximum Clock Frequency:

60 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N56

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

26

No. of Terminals:

56

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC56,.27SQ,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

60 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.995 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Trade Compliance

TMS320F28031RSHT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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