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TMS320F28027DATR

Texas Instruments

TMS320F28027DATR by Texas Instruments

TMS320F28027DATR by Texas Instruments is a 32-bit microcontroller with 3 timers, 7-Ch 12-Bit ADCs, and PWM channels. Ideal for industrial applications due to its CMOS technology, operating temperature range of -40 to 105 °C, and connectivity options like I2C, SCI, SPI, UART.

Median Price

$5.428

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 8,358 parts In-Stock

1+ parts

$5.428

100+ parts

$4.425

1k+ parts

$2.950

10k+ parts

-

8,358

$5.428

$4.425

$2.950

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 527 parts In-Stock

1+ parts

$5.157

100+ parts

-

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-

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527

$5.157

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Vyrian

USA . 7,566 parts In-Stock

1+ parts

-

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7,566

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,241 parts In-Stock

1+ parts

$4.885

100+ parts

-

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-

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3,241

$4.885

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AZTECH Wire

Italy . 987 parts In-Stock

1+ parts

$19.430

100+ parts

-

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987

$19.430

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Parana Technologies

USA . 467 parts In-Stock

1+ parts

$66.792

100+ parts

-

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467

$66.792

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-

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DigiPath Technology Company

USA . 231 parts In-Stock

1+ parts

$73.546

100+ parts

-

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231

$73.546

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ChromeModa Solutions

Germany . 4,195 parts In-Stock

1+ parts

$75.047

100+ parts

$61.539

1k+ parts

-

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4,195

$75.047

$61.539

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IDEA Electronic Components Group

UK . 115 parts In-Stock

1+ parts

$75.047

100+ parts

$71.295

1k+ parts

$67.542

10k+ parts

-

115

$75.047

$71.295

$67.542

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Overview

Experience the power of cutting-edge technology with Texas Instruments' TMS320F28027DATR microcontroller. Designed with precision and innovation, this device offers unparalleled performance for a wide range of applications. With advanced features like multiple peripherals, low power mode, and high-speed connectivity options, this microcontroller provides exceptional value and benefits to customers. Trust in Texas Instruments' reputation for quality and reliability, and unlock the full potential of your projects with the TMS320F28027DATR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material ensures durability and reliability of the product.

Surface Mount: YES

Surface mount capability allows for easier integration and assembly in electronic devices.

Maximum Supply Voltage: 1.995 V

Support for a maximum supply voltage of 1.995V allows for a wide range of power supply options.

Bit Size: 32

32-bit architecture provides enhanced processing capabilities and performance.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, this product offers integrated peripherals for various applications.

Maximum Clock Frequency: 30 MHz

High clock frequency of 30 MHz enables fast operation and response times.

Connectivity: I2C, SCI, SPI, UART

Multiple connectivity options such as I2C, SCI, SPI, and UART enable versatile communication capabilities.

Technical Specifications

Microcontrollers TMS320F28027DATR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

TMS320

Maximum Clock Frequency:

30 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G38

JESD-609 Code:

e4

Length:

12.5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of External Interrupts:

3

No. of I/O Lines:

20

No. of Serial I/Os:

1

No. of Terminals:

38

No. of Timers:

3

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP38,.32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Bytes:

12288

RAM Words:

12

ROM Words:

32768

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Speed:

60 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

90 mA

Maximum Supply Voltage:

1.995 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.1 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, SCI, SPI, UART"

Peripherals:

"BOR, COMPARATOR, POR, PWM(12), TEMPERATURE SENSOR, TIMER(3), WDT"

Analog To Digital Convertors:

7-Ch 12-Bit

Trade Compliance

TMS320F28027DATR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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