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TMS320F28027DAQ

Texas Instruments

TMS320F28027DAQ by Texas Instruments

TMS320F28027DAQ by Texas Instruments is a 32-bit microcontroller with 3 timers, 7-Ch 12-Bit ADC, and PWM(12) channels. Ideal for automotive applications due to AEC-Q100 screening level and operating temperature range of -40 to 125°C. Offers connectivity via I2C, SCI, SPI, UART interfaces for versatile usage.

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Microchip USA

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$19.170

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$19.040

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$18.900

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AZTECH Wire

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Parana Technologies

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DigiPath Technology Company

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Component Stockers USA

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Overview

Unlock the power of cutting-edge technology with the TMS320F28027DAQ microcontroller from Texas Instruments. With a focus on quality and innovation, Texas Instruments is a trusted manufacturer known for delivering top-of-the-line products in the industry. This microcontroller is versatile and reliable, making it ideal for a wide range of applications. Experience seamless connectivity and high performance with features like analog-to-digital converters, PWM channels, and multiple timers. Trust Texas Instruments to provide you with the tools you need to take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for a variety of applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and reducing production costs.

Maximum Supply Voltage: 1.995 V

The maximum supply voltage of 1.995 V ensures stable operation and protection of the microcontroller.

On Chip Data RAM Width: 8

A wider data RAM width allows for efficient data processing and storage on the microcontroller.

Screening Level: AEC-Q100

AEC-Q100 screening ensures high quality and reliability, making the product suitable for automotive applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for space-efficient mounting on the PCB.

Bit Size: 32

With a bit size of 32, the microcontroller can handle complex calculations and tasks efficiently.

Power Supplies (V): 1.8,3.3

Support for multiple power supply voltages enables flexibility in designing and integrating the microcontroller.

No. of Terminals: 38

The abundance of terminals provides connectivity options for various external components and peripherals.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style helps in saving space on the PCB and enhancing portability.

Minimum Supply Voltage: 1.71 V

The minimum supply voltage of 1.71 V ensures proper operation even under low voltage conditions.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C allows the microcontroller to withstand harsh environmental conditions.

CPU Family: TMS320

Being part of the TMS320 family ensures compatibility with existing software and tools, streamlining development and integration processes.

No. of External Interrupts: 3

Having multiple external interrupts allows the microcontroller to respond quickly to external events and signals.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures reliable operation in cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish provides excellent conductivity and corrosion resistance for reliable connections.

ADC Channels: YES

The presence of ADC channels enables the microcontroller to interface with analog sensors and inputs.

Terminal Position: DUAL

Dual terminal position provides flexibility in PCB layout and mounting options.

ROM Words: 32768

With a large ROM capacity of 32768 words, the microcontroller can store a significant amount of program code and data.

Maximum Seated Height: 1.2 mm

The low maximum seated height enables compact and slim designs, ideal for space-constrained applications.

RAM Words: 12

Despite the relatively low RAM word count, the microcontroller can efficiently manage and process data in real-time.

Width: 6.1 mm

The narrow width of 6.1 mm allows for densely populated PCB layouts and space-efficient designs.

Boundary Scan: YES

Boundary scan capability helps in testing and debugging the microcontroller during production and maintenance.

Peripherals: "BOR, COMPARATOR, POR, PWM(12), TEMPERATURE SENSOR, TIMER(3), WDT

A wide range of peripherals enhances the functionality and versatility of the microcontroller for diverse applications.

Maximum Clock Frequency: 30 MHz

The high maximum clock frequency of 30 MHz enables fast and efficient processing of instructions and data.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper soldering of the microcontroller during assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures reliable solder joints and withstands harsh assembly processes.

Length: 12.5 mm

The moderate length of 12.5 mm strikes a balance between compactness and connectivity options on the PCB.

Temperature Grade: AUTOMOTIVE

The automotive-grade temperature rating ensures the microcontroller can operate reliably in automotive environments with temperature variations.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, this product offers integrated peripherals and processing capabilities in a single chip, reducing external component count.

No. of Timers: 3

Multiple timers allow for precise timing control and event scheduling in various applications.

RAM Bytes: 12288

The microcontroller has a generous amount of RAM space (12288 bytes) for data storage and manipulation during runtime.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical strength and easier soldering during assembly, ensuring reliable electrical connections.

Analog To Digital Convertors: 7-Ch 12-Bit

The presence of 7-channel 12-bit ADCs allows the microcontroller to accurately convert analog signals to digital data for processing.

Maximum Supply Current: 90 mA

With a maximum supply current of 90 mA, the microcontroller can operate within specified power limits and prevent overloading.

Nominal Supply Voltage: 1.8 V

The nominal supply voltage of 1.8 V ensures efficient power consumption and compatibility with standard power sources.

PWM Channels: YES

The presence of PWM channels allows the microcontroller to generate precise analog voltage levels for controlling motors and actuators.

Connectivity: "I2C, SCI, SPI, UART

Support for multiple communication interfaces like I2C, SCI, SPI, and UART enables seamless integration with various external devices and systems.

ROM Programmability: FLASH

Flash programmability allows for easy and quick updates to the program code without requiring external programmers or additional hardware.

Terminal Pitch: 0.65 mm

The fine terminal pitch of 0.65 mm enables high-density mounting on the PCB and enhances signal integrity and routing capabilities.

Format: FIXED POINT

The fixed-point format allows for efficient integer-based arithmetic operations, suitable for many real-time applications in embedded systems.

Moisture Sensitivity Level (MSL): 2

MSL level 2 indicates the product has a moderate sensitivity to moisture exposure during storage and handling, requiring standard precautions.

Speed: 60 rpm

The indicated speed of 60 rpm is likely a standard reference value and not directly related to the microcontroller specifications.

Low Power Mode: YES

The low power mode feature allows the microcontroller to enter a power-saving state when idle or not in use, prolonging battery life.

On Chip Program ROM Width: 8

The 8-bit width of the on-chip program ROM allows for efficient storage and retrieval of program instructions for execution.

No. of I/O Lines: 20

Having 20 I/O lines provides ample connectivity options for interfacing with external devices and peripherals, enhancing the product's versatility.

Technical Specifications

Microcontrollers TMS320F28027DAQ attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

TMS320

Maximum Clock Frequency:

30 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G38

JESD-609 Code:

e4

Length:

12.5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of External Interrupts:

3

No. of I/O Lines:

20

No. of Serial I/Os:

1

No. of Terminals:

38

No. of Timers:

3

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP38,.32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Bytes:

12288

RAM Words:

12

ROM Words:

32768

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Speed:

60 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

90 mA

Maximum Supply Voltage:

1.995 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6.1 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, SCI, SPI, UART"

Peripherals:

"BOR, COMPARATOR, POR, PWM(12), TEMPERATURE SENSOR, TIMER(3), WDT"

Analog To Digital Convertors:

7-Ch 12-Bit

Trade Compliance

TMS320F28027DAQ Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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