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TMS320F28026DATR

Texas Instruments

TMS320F28026DATR by Texas Instruments

TMS320F28026DATR by Texas Instruments is a 32-bit microcontroller with 1.71-1.995 V supply voltage range, operating at -40 to 105 °C. It features 16384 ROM words, 12288 RAM bytes, and supports DAC/ADC channels for industrial applications requiring up to 30 MHz clock frequency.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,174 parts In-Stock

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4,174

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Vyrian

USA . 1,974 parts In-Stock

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1,974

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 452 parts In-Stock

1+ parts

$7.000

100+ parts

-

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452

$7.000

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AZTECH Wire

Italy . 199 parts In-Stock

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$12.780

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199

$12.780

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Parana Technologies

USA . 1,979 parts In-Stock

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$22.054

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$22.626

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1,979

$22.054

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$22.626

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IDEA Electronic Components Group

UK . 1,356 parts In-Stock

1+ parts

$24.780

100+ parts

$23.541

1k+ parts

$22.302

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-

1,356

$24.780

$23.541

$22.302

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ChromeModa Solutions

Germany . 971 parts In-Stock

1+ parts

$24.780

100+ parts

$20.320

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971

$24.780

$20.320

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Corphita

USA . 3,328 parts In-Stock

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3,328

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Microchip USA

USA . 358 parts In-Stock

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358

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DigiPath Technology Company

USA . 45 parts In-Stock

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$22.342

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45

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$22.342

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Overview

Elevate your product design with the TMS320F28026DATR by Texas Instruments, a top-tier microcontroller known for its superior quality and reliability. With cutting-edge technology and innovative features, this microcontroller offers unmatched performance in various applications. From industrial automation to consumer electronics, this versatile device delivers exceptional value and benefits to customers seeking high-speed processing, efficient power management, and seamless connectivity. Trust Texas Instruments to provide you with the tools you need to bring your ideas to life.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the microcontroller lightweight and durable, ideal for applications where weight is a concern.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto circuit boards, saving space and making production faster.

Maximum Supply Voltage: 1.995 V

The high maximum supply voltage of 1.995 V offers flexibility in voltage requirements, allowing for a wider range of power supply options.

Package Shape: RECTANGULAR

The rectangular package shape is standard and easily mountable, making it compatible with various board layouts and designs.

Bit Size: 32

A 32-bit architecture provides higher processing power and efficiency, making the microcontroller suitable for complex tasks and demanding applications.

DAC Channels: YES

The presence of DAC channels enables the microcontroller to convert digital signals into analog voltages, expanding its functionality for applications requiring analog output.

Power Supplies (V): 1.8,3.3

Support for multiple power supply voltages (1.8V and 3.3V) offers compatibility with various power sources and allows for flexible voltage requirements in different applications.

No. of Terminals: 38

Having 38 terminals provides ample connectivity options for interfacing with external components and peripherals, enhancing the versatility of the microcontroller.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style save space on the PCB, making the microcontroller suitable for compact designs and applications with limited board real estate.

Minimum Supply Voltage: 1.71 V

The low minimum supply voltage of 1.71 V ensures efficient power consumption and operation in low-power modes, making the microcontroller energy-efficient.

Technical Specifications

Microcontrollers TMS320F28026DATR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

TMS320

Maximum Clock Frequency:

30 MHz

DAC Channels:

YES

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G38

JESD-609 Code:

e4

Length:

12.5 mm

Moisture Sensitivity Level (MSL):

2

No. of I/O Lines:

20

No. of Terminals:

38

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP38,.32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Bytes:

12288

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

60 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.995 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6.1 mm

Peripheral IC Type:

Trade Compliance

TMS320F28026DATR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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