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TMS320F280260DAS

Texas Instruments

TMS320F280260DAS by Texas Instruments

TMS320F280260DAS by Texas Instruments is a 32-bit microcontroller with 38 terminals, operating at up to 30 MHz. Ideal for automotive applications, it features 6144 bytes of RAM, FLASH ROM programmability, and PWM channels for precise control.

Median Price

$2.612

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 640 parts In-Stock

1+ parts

-

100+ parts

$2.340

1k+ parts

$2.090

10k+ parts

$1.970

640

-

$2.340

$2.090

$1.970

DigiKey

USA . 640 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.700

10k+ parts

-

640

-

-

$2.700

-

Verical

USA . 640 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.612

10k+ parts

$2.462

640

-

-

$2.612

$2.462

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,408 parts In-Stock

1+ parts

$2.470

100+ parts

-

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3,408

$2.470

-

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Vyrian

USA . 7,945 parts In-Stock

1+ parts

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7,945

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DigiKey Marketplace

USA . 640 parts In-Stock

1+ parts

-

100+ parts

$2.700

1k+ parts

-

10k+ parts

-

640

-

$2.700

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,242 parts In-Stock

1+ parts

$2.340

100+ parts

-

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2,242

$2.340

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-

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Parana Technologies

USA . 29 parts In-Stock

1+ parts

$64.838

100+ parts

-

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29

$64.838

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ChromeModa Solutions

Germany . 488 parts In-Stock

1+ parts

$72.852

100+ parts

$59.739

1k+ parts

-

10k+ parts

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488

$72.852

$59.739

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-

IDEA Electronic Components Group

UK . 1 parts In-Stock

1+ parts

$72.852

100+ parts

$69.209

1k+ parts

$65.567

10k+ parts

-

1

$72.852

$69.209

$65.567

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DigiPath Technology Company

USA . 1,516 parts In-Stock

1+ parts

-

100+ parts

$65.683

1k+ parts

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1,516

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$65.683

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Microchip USA

USA . 320 parts In-Stock

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320

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Overview

Elevate your projects to new heights with the TMS320F280260DAS by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality microcontrollers like this one that offer unparalleled performance and reliability. Whether you're working on automotive applications or require precise control in your designs, this microcontroller has you covered. With its advanced features, flexible power supplies, and compact package style, the TMS320F280260DAS provides exceptional value and benefits to customers looking for cutting-edge technology. Experience the advantage of using a superior product that meets all your needs effortlessly.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and corrosion resistance, making the product suitable for various environments.

Maximum Supply Voltage: 3.63 V

Higher maximum supply voltage allows for flexibility in power supply options and compatibility with a range of circuits.

Bit Size: 32

32-bit architecture enables efficient processing and handling of data, suitable for complex applications.

Power Supplies (V): 1.8,3.3

Support for multiple power supply voltages allows for versatile use in different power scenarios.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliability and performance in demanding conditions.

ADC Channels: YES

Analog-to-digital converter channels enable the microcontroller to interface with various analog sensors and devices.

ROM Words: 8192

Ample ROM capacity allows for storing program instructions and data, essential for proper functioning of the microcontroller.

RAM Bytes: 6144

Sufficient RAM capacity enables efficient data storage and processing, supporting the execution of complex programs.

Maximum Clock Frequency: 30 MHz

High clock frequency enables fast processing speed, suitable for real-time applications and high-performance computing tasks.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, contributing to energy efficiency and reliable operation.

ROM Programmability: FLASH

Flash programmable ROM allows for easy and quick reprogramming of the microcontroller, facilitating firmware updates and customization.

Technical Specifications

Microcontrollers TMS320F280260DAS attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

TMS320

Maximum Clock Frequency:

30 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G38

JESD-609 Code:

e4

Length:

12.5 mm

Moisture Sensitivity Level (MSL):

2

No. of I/O Lines:

20

No. of Terminals:

38

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP38,.32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Bytes:

6144

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

90 mA

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

2.97 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6.1 mm

Peripheral IC Type:

Trade Compliance

TMS320F280260DAS Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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