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TMS320F28023DAT

Texas Instruments

TMS320F28023DAT by Texas Instruments

TMS320F28023DAT by Texas Instruments is a 32-bit microcontroller with 3 timers, 7-Ch 12-Bit ADC, and PWM(12) channels. Ideal for industrial applications requiring low power mode, it operates at up to 30 MHz with a temperature range of -40 to 105°C. Its compact design features a small outline package with dual terminal position.

Median Price

$7.104

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,765 parts In-Stock

1+ parts

$4.729

100+ parts

$3.855

1k+ parts

$2.570

10k+ parts

-

1,765

$4.729

$3.855

$2.570

-

Mouser Electronics

USA . 2 parts In-Stock

1+ parts

$9.480

100+ parts

$6.580

1k+ parts

$4.680

10k+ parts

-

2

$9.480

$6.580

$4.680

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,509 parts In-Stock

1+ parts

$4.493

100+ parts

-

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-

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3,509

$4.493

-

-

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Vyrian

USA . 2,854 parts In-Stock

1+ parts

-

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2,854

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Nova Conductors

Japan . 50 parts In-Stock

1+ parts

-

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50

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 340 parts In-Stock

1+ parts

$4.020

100+ parts

$3.920

1k+ parts

$3.899

10k+ parts

-

340

$4.020

$3.920

$3.899

-

Corphita

USA . 269 parts In-Stock

1+ parts

$4.256

100+ parts

-

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-

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269

$4.256

-

-

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Ampacity Inc.

Singapore . 434 parts In-Stock

1+ parts

$8.750

100+ parts

-

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434

$8.750

-

-

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Microchip USA

USA . 1,068 parts In-Stock

1+ parts

$18.489

100+ parts

-

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1,068

$18.489

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-

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Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$31.560

100+ parts

$29.982

1k+ parts

$29.982

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500

$31.560

$29.982

$29.982

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Parana Technologies

USA . 1,918 parts In-Stock

1+ parts

$39.979

100+ parts

-

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1,918

$39.979

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ChromeModa Solutions

Germany . 1,048 parts In-Stock

1+ parts

$44.920

100+ parts

$36.834

1k+ parts

-

10k+ parts

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1,048

$44.920

$36.834

-

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IDEA Electronic Components Group

UK . 152 parts In-Stock

1+ parts

$44.920

100+ parts

$42.674

1k+ parts

$40.428

10k+ parts

-

152

$44.920

$42.674

$40.428

-

Corohmni

South Africa . 407 parts In-Stock

1+ parts

$68.365

100+ parts

-

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407

$68.365

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QUARKTWIN TECHNOLOGY LTD

USA . 18,624 parts In-Stock

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18,624

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S.R.D Solutions

India . 15,000 parts In-Stock

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Lixinc

USA . 7,600 parts In-Stock

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7,600

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Kepictronics

USA . 3,000 parts In-Stock

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3,000

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Argo Parts USA

USA . 2,081 parts In-Stock

1+ parts

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2,081

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DigiPath Technology Company

USA . 1,394 parts In-Stock

1+ parts

-

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$40.500

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1,394

-

$40.500

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Continental Prestige Electronics

USA . 1,016 parts In-Stock

1+ parts

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1,016

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Bastille Electronics

Australia . 1,000 parts In-Stock

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1,000

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Metaverse IC Inc.

Canada . 619 parts In-Stock

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619

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Overview

Elevate your project with the TMS320F28023DAT by Texas Instruments, a top-tier microcontroller offering unparalleled quality and performance. Designed with cutting-edge technology and precision engineering, this device is perfect for a wide range of applications. From smart home devices to industrial automation systems, this microcontroller delivers outstanding value and benefits to customers. Experience seamless connectivity, low power consumption, and reliable operation with the TMS320F28023DAT, setting the standard for excellence in the industry. Upgrade your projects today with Texas Instruments.

Feature Benefit Bullets

Package Body Material:

This material makes the product lightweight and durable, ideal for various applications.

Surface Mount:

Allows for easy and secure mounting on PCBs, saving space and simplifying assembly.

Maximum Supply Voltage:

Suitable for low-power applications, ensuring efficient operation and longer battery life.

On Chip Data RAM Width:

Provides sufficient storage for data processing, enhancing performance and speed.

Screening Level:

Ensures reliability and quality, making it suitable for automotive applications.

Package Shape:

The shape allows for efficient placement on PCBs and optimal use of space.

Bit Size:

Offers enough processing power for complex tasks and high-speed data handling.

Power Supplies (V):

Compatible with standard voltage levels, making it versatile for various power sources.

No. of Terminals:

Sufficient terminals for connecting peripherals and external components, offering flexibility.

Package Style (Meter):

This package style saves space, making it suitable for compact designs and portable devices.

Minimum Supply Voltage:

Supports low-voltage operation, ensuring energy efficiency and extending battery life.

Maximum Operating Temperature:

Can operate in high-temperature environments, suitable for industrial applications.

CPU Family:

This CPU family is known for its performance and reliability, ensuring high-quality processing.

No. of External Interrupts:

Provides multiple interrupt options for handling external events efficiently.

Minimum Operating Temperature:

Capable of operating in extreme cold conditions, making it suitable for various environments.

Terminal Finish:

This finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability.

ADC Channels:

Allows for analog-to-digital conversion, enabling the product to interface with sensor inputs.

Terminal Position:

Dual terminal position provides better stability and reliability in connectivity.

ROM Words:

Large ROM capacity for storing program code and data, accommodating complex applications.

Maximum Seated Height:

Low profile design for space-constrained applications, ensuring easy integration.

RAM Words:

Sufficient RAM capacity for temporary data storage, improving processing speed.

Width:

Compact width for fitting into tight spaces, suitable for small device designs.

Boundary Scan:

Allows for testing and debugging of the product during production, ensuring quality control.

Peripherals:

Offers a wide range of peripherals for diverse applications, enhancing functionality.

Maximum Clock Frequency:

High clock frequency for fast data processing and real-time operations.

Peak Reflow Temperature °C:

Sufficient reflow temperature for soldering, ensuring proper connections during assembly.

Length:

Compact length for space-saving designs, suitable for small form factor applications.

Temperature Grade:

Designed to operate reliably in industrial environments with varying temperature conditions.

Peripheral IC Type:

This type of IC provides control and processing capabilities, making it versatile for different applications.

No. of Timers:

Multiple timers for scheduling tasks and coordinating events, enhancing efficiency.

RAM Bytes:

Large RAM capacity for storing data during operation, facilitating multitasking.

Technology:

CMOS technology offers low power consumption and high noise immunity, improving efficiency.

Terminal Form:

Gull wing terminals provide secure connectivity and easy soldering during assembly.

Analog To Digital Convertors:

Multiple ADC channels with high resolution for accurate analog signal conversion.

Maximum Supply Current:

Low supply current for energy-efficient operation and extended battery life.

Nominal Supply Voltage:

Standard nominal voltage level for compatibility with common power sources.

PWM Channels:

Pulse Width Modulation channels for precise control of output signals, suitable for motor control.

Connectivity:

Multiple communication interfaces for connecting to external devices and systems.

ROM Programmability:

Flash ROM programmability allows for easy updating of firmware and program code.

Terminal Pitch:

Small terminal pitch for high-density packaging and efficient use of board space.

Format:

Fixed-point format for numerical calculations, suitable for applications requiring accuracy.

Moisture Sensitivity Level (MSL):

MSL level 2 ensures safe handling and storage of the product during production.

Speed:

Suitable speed for various applications, providing efficient data processing and control.

Low Power Mode:

Low power mode for energy-saving operation, ideal for battery-powered devices.

On Chip Program ROM Width:

Sufficient ROM width for storing program code, enabling efficient execution.

No. of I/O Lines:

Sufficient I/O lines for interfacing with external devices and peripherals, enhancing connectivity.

Technical Specifications

Microcontrollers TMS320F28023DAT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

TMS320

Maximum Clock Frequency:

30 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G38

JESD-609 Code:

e4

Length:

12.5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of External Interrupts:

3

No. of I/O Lines:

20

No. of Serial I/Os:

1

No. of Terminals:

38

No. of Timers:

3

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP38,.32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Bytes:

12288

RAM Words:

12

ROM Words:

32768

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

80 mA

Maximum Supply Voltage:

1.995 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.1 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, SCI, SPI, UART"

Peripherals:

"BOR, COMPARATOR, POR, PWM(12), TEMPERATURE SENSOR, TIMER(3), WDT"

Analog To Digital Convertors:

7-Ch 12-Bit

Trade Compliance

TMS320F28023DAT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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