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TMS320F280200PTS

Texas Instruments

TMS320F280200PTS by Texas Instruments

TMS320F280200PTS by Texas Instruments is a 32-bit microcontroller with 48 terminals, operating at up to 30 MHz. It features DAC and ADC channels, ROM of 8192 words, and RAM of 4096 bytes. Ideal for automotive applications due to its low profile package style and wide temperature range from -40°C to 125°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,050 parts In-Stock

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Digiode

USA . 2,904 parts In-Stock

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Semtec, LLC

USA . 250 parts In-Stock

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250

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Distributors (Availability)

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AZTECH Wire

Italy . 395 parts In-Stock

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$9.717

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395

$9.717

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One Stop Electronics

USA . 1,449 parts In-Stock

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$25.000

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$25.000

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Parana Technologies

USA . 736 parts In-Stock

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$42.876

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736

$42.876

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IDEA Electronic Components Group

UK . 2,088 parts In-Stock

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$48.175

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$45.766

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$43.358

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2,088

$48.175

$45.766

$43.358

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ChromeModa Solutions

Germany . 427 parts In-Stock

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$48.175

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$39.504

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427

$48.175

$39.504

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DigiPath Technology Company

USA . 2,315 parts In-Stock

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$43.435

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2,315

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$43.435

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Corphita

USA . 1,428 parts In-Stock

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Microchip USA

USA . 170 parts In-Stock

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Overview

Elevate your projects with the TMS320F280200PTS from Texas Instruments, a cutting-edge microcontroller that delivers unparalleled quality and performance. With a wide range of applications in automotive and industrial settings, this product offers customers exceptional value and benefits. Take advantage of its innovative features, versatile package body material, and powerful DAC and ADC channels for seamless integration into your designs. Trust in Texas Instruments' reputation for excellence and choose the TMS320F280200PTS for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material provides durability and protection for the microcontroller, ensuring long-term functionality.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on PCBs, saving time and space during assembly.

Maximum Supply Voltage: 1.995 V

The high maximum supply voltage of 1.995 V allows for flexibility in powering the microcontroller, accommodating various voltage requirements.

Bit Size: 32

32-bit architecture provides enhanced performance and computational power for demanding applications and tasks.

DAC Channels: YES

Digital-to-Analog Converter channels enable the microcontroller to interface with analog components and sensors, expanding its functionality.

Power Supplies (V): 1.8,3.3

Support for multiple power supply voltages (1.8V and 3.3V) allows for compatibility with a wide range of power sources and systems.

No. of Terminals: 48

The ample number of terminals (48) provide flexibility in connecting external devices, peripherals, and components to the microcontroller.

Minimum Supply Voltage: 1.71 V

The low minimum supply voltage of 1.71V ensures efficient power consumption and operation, ideal for battery-powered applications.

Maximum Operating Temperature: 125 °C

High maximum operating temperature of 125°C ensures reliability and stability in harsh environments and industrial applications.

CPU Family: TMS320

TMS320 CPU family is known for its high performance and efficiency, making the microcontroller suitable for demanding computational tasks.

ADC Channels: YES

Analog-to-Digital Converter channels enable the microcontroller to convert external analog signals into digital data for processing and analysis.

ROM Words: 8192

The ROM capacity of 8192 words provides ample storage for program code, configuration data, and firmware, supporting complex applications.

Width: 7 mm

Compact width of 7mm allows for space-efficient placement on PCBs, ideal for applications with size constraints.

Maximum Clock Frequency: 30 MHz

High maximum clock frequency of 30 MHz enables fast and efficient data processing, essential for real-time applications and communication.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature rating ensures reliable operation in automotive and transportation applications, where temperature fluctuations are common.

Peripheral IC Type: MICROCONTROLLER

Microcontroller with a variety of integrated peripherals, such as ADC, DAC, and PWM channels, simplifies system design and implementation.

ROM Programmability: FLASH

Flash ROM programmability enables easy and flexible updates to the firmware and software of the microcontroller without the need for specialized equipment.

Moisture Sensitivity Level (MSL): 2

Moisture sensitivity level of 2 indicates the microcontroller's resistance to moisture during storage, handling, and assembly processes.

No. of I/O Lines: 22

Ample number of input/output lines (22) allow for versatile connectivity and interfacing with external devices, sensors, and peripherals.

Technical Specifications

Microcontrollers TMS320F280200PTS attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

TMS320

Maximum Clock Frequency:

30 MHz

DAC Channels:

YES

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

2

No. of I/O Lines:

22

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Bytes:

4096

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

40 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.995 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Trade Compliance

TMS320F280200PTS Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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