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TMS320C28346ZFEQ

Texas Instruments

TMS320C28346ZFEQ by Texas Instruments

TMS320C28346ZFEQ by Texas Instruments is a 32-bit microcontroller with a max clock frequency of 300 MHz. It features 516 RAM words, CAN and SPI connectivity, and is commonly used in automotive applications.

Median Price

$54.980

Lifecycle Status

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$27.696

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Mouser Electronics

USA . 185 parts In-Stock

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$39.310

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DigiKey

USA . 155 parts In-Stock

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$54.980

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$40.336

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$39.315

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Digiode

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Nova Conductors

Japan . 50 parts In-Stock

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Vyrian

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Bristol Electronics

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Ampacity Inc.

Singapore . 229 parts In-Stock

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Corphita

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$28.042

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Aranea Global

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$33.529

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$32.188

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Corohmni

South Africa . 368 parts In-Stock

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Continental Prestige Electronics

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Component Stockers USA

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$35.960

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$28.630

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Parana Technologies

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IDEA Electronic Components Group

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$41.454

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ChromeModa Solutions

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$43.636

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Microchip USA

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Lixinc

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DigiPath Technology Company

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Singapore . 810 parts In-Stock

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Overview

Discover the power and versatility of the TMS320C28346ZFEQ microcontroller by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers unparalleled quality and innovation. The TMS320C28346ZFEQ offers a wide range of applications for various industries, unlocking endless possibilities for developers and engineers. With its advanced features and state-of-the-art technology, this microcontroller provides exceptional value and benefits to customers. From its high-speed performance to its low power mode, the TMS320C28346ZFEQ is designed to meet the most demanding requirements. Experience the advantages of this remarkable product and take your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for electronic components as it provides good insulation and protection for the internal circuitry.

Surface Mount: YES

Surface mount technology allows for a more compact design and easy automated assembly, making the product suitable for modern electronics.

Maximum Supply Voltage: 1.26 V

Efficient power management with a low maximum supply voltage helps in reducing power consumption and heat generation.

On Chip Data RAM Width: 16

Having a wider data RAM width allows for faster data processing and multitasking capabilities.

Address Bus Width: 22

A wider address bus allows for larger memory addressing capabilities and more efficient data retrieval.

Bit Size: 32

A 32-bit architecture enables higher computational power and performance for complex tasks and applications.

DAC Channels: YES

Built-in DAC channels enable the microcontroller to convert digital signals to analog for various applications like audio processing or sensor interfacing.

Power Supplies (V): 1.2,1.8,3.3

Support for multiple power supply voltages allows compatibility with different voltage requirements of various components in a system.

No. of Terminals: 256

Having a large number of terminals provides flexibility for connection to external devices and peripherals in a system.

Package Style (Meter): GRID ARRAY

The grid array package style offers better mechanical stability and thermal dissipation for the microcontroller.

Minimum Supply Voltage: 1.14 V

A low minimum supply voltage ensures reliable operation even under low power conditions.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the microcontroller can withstand harsh environmental conditions without performance degradation.

CPU Family: TMS320

Being part of the TMS320 CPU family ensures compatibility with existing software and tools, simplifying the development process.

No. of External Interrupts: 8

Having multiple external interrupts allows the microcontroller to respond quickly to external events and ensure real-time operation.

Minimum Operating Temperature: -40 °C

The ability to operate at extremely low temperatures makes the microcontroller suitable for applications in harsh or cold environments.

Terminal Finish: TIN SILVER COPPER

This terminal finish provides good conductivity, corrosion resistance, and solderability for reliable connections.

ADC Channels: YES

Integrated ADC channels enable the microcontroller to measure analog signals from sensors or external devices accurately.

DMA Channels: YES

DMA channels enhance data transfer speeds and offload the CPU for more efficient data processing and handling.

Terminal Position: BOTTOM

Bottom terminal position facilitates easier PCB layout and routing for simplified design and assembly.

ROM Words: 8192

Ample ROM capacity allows for storing program code and data, essential for running applications smoothly.

Maximum Seated Height: 2.1 mm

A low seated height makes the microcontroller suitable for compact designs and space-constrained applications.

RAM Words: 516

Having sufficient RAM capacity enables the microcontroller to store and access data efficiently during operation.

Width: 17 mm

A compact width dimension allows for space-efficient integration of the microcontroller in various electronic devices.

Boundary Scan: YES

Boundary scan capability simplifies debugging and testing processes during product development and production.

External Data Bus Width: 32

A wide external data bus width facilitates high-speed data transfer with external memory and peripherals.

Peripherals: DMA(6), PWM(18), TIMER(18), WDT

A rich set of peripherals including DMA, PWM, timers, and watchdog timer enhances the microcontroller's versatility for various applications.

Maximum Clock Frequency: 300 MHz

A high maximum clock frequency enables fast execution of instructions and high-speed operation for demanding tasks.

Maximum Time At Peak Reflow Temperature (s): 30

With a short reflow time, the microcontroller can undergo the soldering process quickly without affecting its performance.

Peak Reflow Temperature °C: 260

The microcontroller's ability to withstand high reflow temperatures ensures robust solder joints and reliable connections.

Length: 17 mm

A compact length dimension enhances the microcontroller's compatibility with various PCB layouts and designs.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this microcontroller meets stringent temperature and performance requirements for automotive electronics.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, this product integrates various peripherals and processing capabilities in a single chip for enhanced system integration and efficiency.

No. of Timers: 18

A high number of timers allow for precise timing control and scheduling of tasks in the microcontroller's operation.

RAM Bytes: 528384

The large RAM capacity in bytes provides ample memory space for data storage and manipulation during program execution.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with various digital systems for efficient operation.

Terminal Form: BALL

Ball terminal form simplifies soldering and PCB mounting processes, ensuring reliable electrical connections in the system.

Nominal Supply Voltage: 1.2 V

A stable nominal supply voltage ensures consistent operation and performance of the microcontroller over a wide range of operating conditions.

No. of DMA Channels: 6

Multiple DMA channels enhance data transfer speeds and efficiency, particularly useful for high-throughput data processing applications.

No. of Serial I/Os: 2

Integrated serial I/O interfaces provide connectivity options for external communication and data exchange with other devices.

PWM Channels: YES

Having PWM channels allows the microcontroller to generate precise pulse-width-modulated signals for controlling various devices and systems.

Connectivity: CAN(2), I2C, SCI(3), SPI(4)

Support for various communication interfaces like CAN, I2C, SCI, and SPI enhances the microcontroller's connectivity and compatibility with external devices.

ROM Programmability: MROM

MROM (Mask ROM) programmability ensures secure and reliable storage of firmware and data without the risk of accidental erasure or corruption.

Terminal Pitch: 1 mm

A fine terminal pitch allows for dense packaging and reduced PCB footprint, ideal for compact and high-density electronic designs.

Format: FLOATING POINT

Support for floating-point format enables the microcontroller to perform complex mathematical computations with high precision and accuracy.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate sensitivity to moisture, which is important for proper handling and storage of the microcontroller during assembly and operation.

Speed: 300 rpm

A high speed rating ensures fast data processing and response times, making the microcontroller suitable for real-time applications.

Low Power Mode: YES

The availability of low-power modes helps in optimizing energy efficiency and extending battery life in battery-operated applications.

On Chip Program ROM Width: 16

Having a wide program ROM width allows for storing larger program code, essential for running complex software applications on the microcontroller.

Technical Specifications

Microcontrollers TMS320C28346ZFEQ attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES AT 3.3V

Address Bus Width:

22

Bit Size:

32

Boundary Scan:

YES

CPU Family:

TMS320

Maximum Clock Frequency:

300 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Length:

17 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

8

No. of I/O Lines:

88

No. of Serial I/Os:

2

No. of Terminals:

256

No. of Timers:

18

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA256,16X16,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8,3.3

Qualification:

Not Qualified

RAM Bytes:

528384

RAM Words:

516

ROM Words:

8192

ROM Programmability:

MROM

Maximum Seated Height:

2.1 mm

Speed:

300 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

17 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"CAN(2), I2C, SCI(3), SPI(4)"

Peripherals:

"DMA(6), PWM(18), TIMER(18), WDT"

Trade Compliance

TMS320C28346ZFEQ Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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