Loading...

TMS320C28344ZFET

Texas Instruments

TMS320C28344ZFET by Texas Instruments

TMS320C28344ZFET by Texas Instruments is a 32-bit microcontroller with 300 MHz clock frequency, 88 I/O lines, and 18 timers. It features CAN, I2C, SCI, SPI connectivity for industrial applications requiring high-speed processing and low power mode. With DMA and PWM channels, it offers versatile peripheral support in a compact square package ideal for embedded systems.

Median Price

$15.042

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,740 parts In-Stock

1+ parts

$13.800

100+ parts

$13.520

1k+ parts

$13.250

10k+ parts

-

1,740

$13.800

$13.520

$13.250

-

Texas Instruments

USA . 116,975 parts In-Stock

1+ parts

$16.285

100+ parts

$14.225

1k+ parts

$9.810

10k+ parts

-

116,975

$16.285

$14.225

$9.810

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,694 parts In-Stock

1+ parts

$15.471

100+ parts

-

1k+ parts

-

10k+ parts

-

2,694

$15.471

-

-

-

Vyrian

USA . 3,644 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,644

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 329 parts In-Stock

1+ parts

$11.720

100+ parts

-

1k+ parts

-

10k+ parts

-

329

$11.720

-

-

-

Corphita

USA . 1,862 parts In-Stock

1+ parts

$14.656

100+ parts

-

1k+ parts

-

10k+ parts

-

1,862

$14.656

-

-

-

Parana Technologies

USA . 775 parts In-Stock

1+ parts

$38.784

100+ parts

-

1k+ parts

-

10k+ parts

-

775

$38.784

-

-

-

DigiPath Technology Company

USA . 1,152 parts In-Stock

1+ parts

$42.706

100+ parts

$39.290

1k+ parts

-

10k+ parts

-

1,152

$42.706

$39.290

-

-

ChromeModa Solutions

Germany . 6,850 parts In-Stock

1+ parts

$43.578

100+ parts

$35.734

1k+ parts

-

10k+ parts

-

6,850

$43.578

$35.734

-

-

IDEA Electronic Components Group

UK . 1,387 parts In-Stock

1+ parts

$43.578

100+ parts

$41.399

1k+ parts

$39.220

10k+ parts

-

1,387

$43.578

$41.399

$39.220

-

Microchip USA

USA . 1,369 parts In-Stock

1+ parts

$45.220

100+ parts

$44.570

1k+ parts

$44.250

10k+ parts

$43.930

1,369

$45.220

$44.570

$44.250

$43.930

Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,000

-

-

-

-

Perfect Parts

USA . 560 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

560

-

-

-

-

Overview

Unleash the power of innovation with the Texas Instruments TMS320C28344ZFET microcontroller. Designed with precision and quality in mind, this product offers a wide range of applications in various industries. With advanced features like DMA channels, PWM capabilities, and high-speed connectivity options, this microcontroller provides unmatched value and benefits to customers looking to elevate their projects to the next level. Trust in Texas Instruments for cutting-edge technology that delivers exceptional performance and reliability every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the product reliable for long-term use.

Surface Mount: YES

Surface mount technology simplifies the assembly process and saves space on a PCB.

Maximum Supply Voltage: 1.26 V

Efficient power management with a low maximum supply voltage.

On Chip Data RAM Width: 16

Wide data RAM width allows for efficient data processing and storage on the chip.

Address Bus Width: 16

The 16-bit address bus allows for a larger memory space and efficient address handling.

Package Shape: SQUARE

Square shape is space-saving and ensures efficient PCB layout.

Bit Size: 32

32-bit processing capability offers high-performance computing.

Power Supplies (V): 1.2,1.8,3.3

Multiple power supply options for flexibility in different voltage requirements.

No. of Terminals: 256

High number of terminals for versatile connectivity options.

Package Style (Meter): GRID ARRAY

Grid array package style ensures reliability and robustness in mechanical connections.

Minimum Supply Voltage: 1.14 V

Efficient power management with a low minimum supply voltage.

Maximum Operating Temperature: 105 °C

Wide temperature range allows for use in various industrial environments.

CPU Family: TMS320

TMS320 CPU family is known for its high performance and efficiency in embedded applications.

No. of External Interrupts: 8

Multiple external interrupt options for handling real-time events efficiently.

Minimum Operating Temperature: -40 °C

Wide temperature range ensures reliable operation even in extreme cold environments.

Terminal Finish: TIN SILVER COPPER

High-quality terminal finish for reliable electrical connections.

ADC Channels: YES

Built-in ADC channels for analog signal processing capability.

DMA Channels: YES

Integrated DMA channels for efficient data transfer without CPU intervention.

Terminal Position: BOTTOM

Bottom terminal position for easy PCB mounting and space-saving design.

ROM Words: 8192

Large ROM capacity for storing program instructions.

Maximum Seated Height: 2.1 mm

Low profile design with a maximum seated height of 2.1 mm for compact applications.

RAM Words: 260

Sufficient RAM capacity for data storage and manipulation.

Width: 17 mm

Compact width of 17 mm for space-constrained designs.

Boundary Scan: YES

Boundary scan feature for testing and debugging PCB assemblies.

External Data Bus Width: 32

Wide data bus width of 32 bits for high-speed data transfer.

Peripherals: DMA(6), PWM(18), TIMER(18), WDT

A variety of peripherals for enhanced functionality and control options.

Maximum Clock Frequency: 300 MHz

High clock frequency for fast processing and real-time applications.

Maximum Time At Peak Reflow Temperature (s): 30

Optimal reflow parameters for reliable soldering and assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature for lead-free soldering applications.

Length: 17 mm

Compact length of 17 mm for space-efficient PCB layout.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range for reliable operation in harsh environments.

Peripheral IC Type: MICROCONTROLLER

Microcontroller IC type for embedded control and processing capabilities.

No. of Timers: 18

Multiple timers for task scheduling and time-based operations.

RAM Bytes: 266240

Large RAM capacity in bytes for data storage and processing.

Technology: CMOS

CMOS technology for low power consumption and high noise immunity.

Terminal Form: BALL

Ball terminal form for reliable solder connections and mechanical strength.

Nominal Supply Voltage: 1.2 V

Stable and reliable nominal supply voltage for consistent performance.

No. of DMA Channels: 6

Multiple DMA channels for efficient data transfer and processing.

No. of Serial I/Os: 2

Multiple serial I/Os for communication with external devices.

PWM Channels: YES

PWM channels for precise control of output signals and power management.

Connectivity: CAN(2), I2C, SCI(3), SPI(4)

Versatile connectivity options for communication with various devices and protocols.

ROM Programmability: MROM

MROM programmability for secure and permanent storage of program code.

Terminal Pitch: 1 mm

Close terminal pitch of 1 mm for high-density PCB designs.

Format: FLOATING POINT

Floating-point format for accurate mathematical calculations and data processing.

Moisture Sensitivity Level (MSL): 3

MSL level 3 for moderate exposure to moisture during storage or assembly.

Speed: 300 rpm

High speed of 300 rpm for fast data processing and execution.

Low Power Mode: YES

Low power mode for energy-efficient operation and extended battery life.

On Chip Program ROM Width: 16

On-chip program ROM width of 16 bits for efficient program storage and execution.

No. of I/O Lines: 88

High number of I/O lines for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers TMS320C28344ZFET attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES AT 3.3V

Address Bus Width:

16

Bit Size:

32

Boundary Scan:

YES

CPU Family:

TMS320

Maximum Clock Frequency:

300 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Length:

17 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

8

No. of I/O Lines:

88

No. of Serial I/Os:

2

No. of Terminals:

256

No. of Timers:

18

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA256,16X16,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8,3.3

Qualification:

Not Qualified

RAM Bytes:

266240

RAM Words:

260

ROM Words:

8192

ROM Programmability:

MROM

Maximum Seated Height:

2.1 mm

Speed:

300 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

17 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"CAN(2), I2C, SCI(3), SPI(4)"

Peripherals:

"DMA(6), PWM(18), TIMER(18), WDT"

Trade Compliance

TMS320C28344ZFET Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20