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TMS320C28343ZFET

Texas Instruments

TMS320C28343ZFET by Texas Instruments

TMS320C28343ZFET by Texas Instruments is a 32-bit microcontroller with 16-bit address bus, 32-bit external data bus, and max clock frequency of 300 MHz. It features ADC and DMA channels, suitable for industrial applications requiring high-speed processing and multiple I/O lines.

Median Price

$14.938

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 332 parts In-Stock

1+ parts

-

100+ parts

$11.950

1k+ parts

$10.690

10k+ parts

$10.060

332

-

$11.950

$10.690

$10.060

DigiKey

USA . 332 parts In-Stock

1+ parts

-

100+ parts

$15.730

1k+ parts

-

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-

332

-

$15.730

-

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Verical

USA . 332 parts In-Stock

1+ parts

-

100+ parts

$14.938

1k+ parts

$13.363

10k+ parts

$12.575

332

-

$14.938

$13.363

$12.575

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,798 parts In-Stock

1+ parts

$12.616

100+ parts

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4,798

$12.616

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Vyrian

USA . 2,686 parts In-Stock

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-

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2,686

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DigiKey Marketplace

USA . 242 parts In-Stock

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242

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,816 parts In-Stock

1+ parts

$11.952

100+ parts

-

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3,816

$11.952

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Parana Technologies

USA . 506 parts In-Stock

1+ parts

$35.320

100+ parts

-

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506

$35.320

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DigiPath Technology Company

USA . 1,474 parts In-Stock

1+ parts

$38.891

100+ parts

$35.780

1k+ parts

-

10k+ parts

-

1,474

$38.891

$35.780

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ChromeModa Solutions

Germany . 3,024 parts In-Stock

1+ parts

$39.685

100+ parts

$32.542

1k+ parts

-

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3,024

$39.685

$32.542

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IDEA Electronic Components Group

UK . 1,678 parts In-Stock

1+ parts

$39.685

100+ parts

$37.701

1k+ parts

$35.716

10k+ parts

-

1,678

$39.685

$37.701

$35.716

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Microchip USA

USA . 132 parts In-Stock

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Overview

Experience the cutting-edge technology of Texas Instruments with the TMS320C28343ZFET microcontroller. This powerful device offers unparalleled performance and reliability, making it ideal for a wide range of applications. From industrial automation to automotive systems, this microcontroller provides exceptional value and benefits to customers looking for high-quality solutions. Trust in Texas Instruments to deliver superior products that exceed expectations, and unlock endless possibilities with the TMS320C28343ZFET.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the product suitable for various applications while ensuring longevity.

Maximum Supply Voltage: 1.26 V

This low maximum supply voltage helps in reducing power consumption and heat dissipation, making the product energy-efficient.

ADC Channels: YES

Having ADC channels allows the microcontroller to efficiently convert analog signals into digital data, enabling a wider range of sensor connectivity.

RAM Bytes: 133120

With a large RAM capacity, the microcontroller can handle complex tasks and store a significant amount of data, enhancing its performance.

Maximum Clock Frequency: 300 MHz

The high maximum clock frequency enables fast processing speed, making the microcontroller suitable for applications that require real-time data processing.

Technical Specifications

Microcontrollers TMS320C28343ZFET attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES AT 3.3V

Address Bus Width:

16

Bit Size:

32

CPU Family:

TMS320

Maximum Clock Frequency:

300 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Length:

17 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

88

No. of Terminals:

256

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA256,16X16,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.1,1.8,3.3

Qualification:

Not Qualified

RAM Bytes:

133120

ROM Words:

8192

ROM Programmability:

MROM

Maximum Seated Height:

2.1 mm

Speed:

300 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

17 mm

Peripheral IC Type:

Trade Compliance

TMS320C28343ZFET Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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