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TMS320C28343ZAYT

Texas Instruments

TMS320C28343ZAYT by Texas Instruments

TMS320C28343ZAYT by Texas Instruments is a 32-bit microcontroller with 20-bit address bus, 16-bit data RAM, and 32-bit external data bus width. It features 18 PWM channels, CAN and I2C connectivity, and operates at a max frequency of 150 MHz. Ideal for industrial applications requiring high-speed processing and multiple peripherals.

Median Price

$14.991

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,107 parts In-Stock

1+ parts

$14.991

100+ parts

-

1k+ parts

-

10k+ parts

-

3,107

$14.991

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-

-

Vyrian

USA . 7,295 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,295

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 596 parts In-Stock

1+ parts

$14.202

100+ parts

-

1k+ parts

-

10k+ parts

-

596

$14.202

-

-

-

Parana Technologies

USA . 249 parts In-Stock

1+ parts

$18.426

100+ parts

-

1k+ parts

$18.548

10k+ parts

-

249

$18.426

-

$18.548

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ChromeModa Solutions

Germany . 3,794 parts In-Stock

1+ parts

$20.703

100+ parts

$16.976

1k+ parts

-

10k+ parts

-

3,794

$20.703

$16.976

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IDEA Electronic Components Group

UK . 1,760 parts In-Stock

1+ parts

$20.703

100+ parts

$19.668

1k+ parts

$18.633

10k+ parts

-

1,760

$20.703

$19.668

$18.633

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Microchip USA

USA . 1,083 parts In-Stock

1+ parts

$34.300

100+ parts

$33.810

1k+ parts

$33.560

10k+ parts

$33.320

1,083

$34.300

$33.810

$33.560

$33.320

DigiPath Technology Company

USA . 130 parts In-Stock

1+ parts

-

100+ parts

$18.666

1k+ parts

-

10k+ parts

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130

-

$18.666

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-

Overview

Elevate your projects with the TMS320C28343ZAYT microcontroller from Texas Instruments. Renowned for their high-quality products, Texas Instruments delivers cutting-edge technology in a compact package suitable for various applications. With features like DMA, PWM, and extensive connectivity options, this microcontroller offers unmatched value and performance. Take advantage of its low power mode and industrial-grade temperature range to optimize your designs. Upgrade your projects with the TMS320C28343ZAYT and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring a longer lifespan.

Maximum Supply Voltage: 1.16 V

Allows for a stable and reliable power supply for the microcontroller.

Bit Size: 32

High bit size allows for complex operations and calculations to be performed efficiently.

ADC Channels: YES

Supports analog to digital conversion, making it suitable for a wide range of sensor applications.

Temperature Grade: INDUSTRIAL

Can operate in industrial temperature range, suitable for harsh environments.

Peripheral IC Type: MICROCONTROLLER

Designed specifically for microcontroller applications, providing optimized performance.

Connectivity: CAN(2), I2C(2), SCI(3), SPI(4)

Offers various communication interfaces for seamless connectivity with other devices.

No. of I/O Lines: 88

Provides a high number of input/output lines for interfacing with external components.

Technical Specifications

Microcontrollers TMS320C28343ZAYT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES AT 3.3V

Address Bus Width:

20

Bit Size:

32

Boundary Scan:

YES

CPU Family:

TMS320

Maximum Clock Frequency:

150 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B179

JESD-609 Code:

e1

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

8

No. of I/O Lines:

88

No. of Terminals:

179

No. of Timers:

18

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA179,14X14,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

266240

ROM Words:

8192

ROM Programmability:

MROM

Maximum Seated Height:

1.4 mm

Speed:

200 rpm

Maximum Supply Voltage:

1.16 V

Minimum Supply Voltage:

1.05 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Connectivity:

CAN(2), I2C(2), SCI(3), SPI(4)

Peripherals:

DMA(6), POR, PWM(18), TIMER(18), QEP(3), WDT

Trade Compliance

TMS320C28343ZAYT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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