Loading...

TMS320C28342ZFEQ

Texas Instruments

TMS320C28342ZFEQ by Texas Instruments

TMS320C28342ZFEQ by Texas Instruments is a 32-bit microcontroller with 22-bit address bus width, 32-bit external data bus width, and max clock frequency of 300 MHz. Ideal for automotive applications due to its temperature grade and features like DAC, ADC, PWM channels.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,552 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,552

-

-

-

-

Digiode

USA . 3,113 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,113

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 192 parts In-Stock

1+ parts

$5.558

100+ parts

-

1k+ parts

-

10k+ parts

-

192

$5.558

-

-

-

One Stop Electronics

USA . 835 parts In-Stock

1+ parts

$35.000

100+ parts

-

1k+ parts

-

10k+ parts

-

835

$35.000

-

-

-

Parana Technologies

USA . 167 parts In-Stock

1+ parts

$69.274

100+ parts

-

1k+ parts

-

10k+ parts

-

167

$69.274

-

-

-

DigiPath Technology Company

USA . 754 parts In-Stock

1+ parts

$76.279

100+ parts

$70.177

1k+ parts

-

10k+ parts

-

754

$76.279

$70.177

-

-

ChromeModa Solutions

Germany . 6,472 parts In-Stock

1+ parts

$77.836

100+ parts

$63.826

1k+ parts

-

10k+ parts

-

6,472

$77.836

$63.826

-

-

IDEA Electronic Components Group

UK . 484 parts In-Stock

1+ parts

$77.836

100+ parts

$73.944

1k+ parts

$70.052

10k+ parts

-

484

$77.836

$73.944

$70.052

-

Corphita

USA . 1,063 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,063

-

-

-

-

Microchip USA

USA . 120 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

120

-

-

-

-

Overview

Unlock the power of innovation with the TMS320C28342ZFEQ by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality microcontrollers that are versatile and reliable. Ideal for a wide range of applications, this microcontroller offers customers the value of high performance and efficiency. With advanced features and capabilities, the TMS320C28342ZFEQ provides countless benefits to help you bring your projects to life. Experience the advantage of cutting-edge technology and unleash your creativity with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes this microcontroller lightweight and durable, making it suitable for various applications.

Surface Mount: YES

Being surface mountable allows for easy integration into circuit boards, saving space and simplifying the assembly process.

Maximum Supply Voltage: 1.26 V

The low maximum supply voltage helps in reducing power consumption and heat dissipation, improving energy efficiency.

Address Bus Width: 22

A wide address bus width of 22 enhances the microcontroller's memory addressing capabilities, allowing for efficient data access.

Package Shape: SQUARE

The square package shape offers uniformity and ease of mounting, ensuring a secure fit within electronic devices.

Bit Size: 32

With a bit size of 32, this microcontroller can handle complex data processing tasks, making it suitable for advanced applications.

DAC Channels: YES

The presence of DAC channels allows for analog signal output, enabling the microcontroller to interface with analog components or devices.

Power Supplies (V): 1.2,1.8,3.3

Support for multiple power supply voltages offers flexibility in system design and compatibility with various power sources.

No. of Terminals: 256

The abundance of terminals provides ample connectivity options for interfacing with external components, expanding the microcontroller's capabilities.

Package Style (Meter): GRID ARRAY

The grid array package style allows for high density mounting of terminals, leading to compact circuit designs and optimized space utilization.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage ensures stable operation even under low power conditions, enhancing the reliability of the microcontroller.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature makes this microcontroller suitable for use in harsh environments or industrial applications with elevated temperatures.

CPU Family: TMS320

Belonging to the TMS320 CPU family indicates a legacy of quality and performance, making this microcontroller a trusted choice for demanding tasks.

Minimum Operating Temperature: -40 °C

The wide temperature range from -40°C ensures reliable operation in cold environments, making it suitable for automotive or outdoor applications.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin silver copper provides excellent conductivity, corrosion resistance, and solderability, ensuring robust connections.

ADC Channels: YES

Having ADC channels allows the microcontroller to convert analog signals to digital data, enabling precise measurements or sensor interfacing.

DMA Channels: YES

The presence of DMA channels enables direct memory access, enhancing data transfer speeds and freeing up the CPU for other critical tasks.

Terminal Position: BOTTOM

The bottom terminal position facilitates easier PCB layout and routing, simplifying the integration of the microcontroller into electronic systems.

ROM Words: 8192

The generous ROM size of 8192 words provides ample storage for program code or data, allowing for more sophisticated applications to be run.

Maximum Seated Height: 2.1 mm

The low seated height of 2.1 mm enables slim and compact device designs, ideal for space-constrained applications or portable devices.

Width: 17 mm

The compact width of 17 mm allows for easy integration into various electronic devices without occupying excessive space.

External Data Bus Width: 32

With an external data bus width of 32, this microcontroller can efficiently process large amounts of data, making it suitable for data-intensive tasks.

Maximum Clock Frequency: 300 MHz

The high maximum clock frequency of 300 MHz enables rapid data processing and execution of instructions, enhancing overall system performance.

Maximum Time At Peak Reflow Temperature (s): 30

The specified maximum time at peak reflow temperature ensures proper soldering and reflow processes, leading to reliable connections and device performance.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C allows for proper solder reflow during assembly, ensuring secure component attachment to the PCB.

Length: 17 mm

The length of 17 mm complements the compact width, making this microcontroller suitable for space-constrained applications without compromising performance.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade signifies reliability and resilience to extreme temperature conditions, making this microcontroller suitable for automotive electronics.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller with various built-in peripherals, it offers a comprehensive solution for embedded system design, reducing external component count and complexity.

RAM Bytes: 100352

With a sizable RAM capacity of 100352 bytes, this microcontroller can efficiently store and manipulate data during program execution, enhancing its processing capabilities.

Technology: CMOS

The CMOS technology employed in this microcontroller offers low power consumption, high noise immunity, and high-speed operation, making it suitable for a wide range of applications.

Terminal Form: BALL

The ball terminal form facilitates reliable soldering connections, ensuring secure and robust connections for improved performance and longevity.

Nominal Supply Voltage: 1.2 V

The nominal supply voltage of 1.2 V provides a stable operating voltage for the microcontroller, ensuring consistent and reliable performance.

PWM Channels: YES

The availability of PWM channels allows for precise control of connected devices or components through pulse-width modulation, enabling varied functionality and applications.

ROM Programmability: MROM

The ROM programmability as Mask ROM (MROM) ensures secure and permanent storage of critical system software or data, protecting against accidental erasure or manipulation.

Terminal Pitch: 1 mm

The tight terminal pitch of 1 mm enables high-density mounting and compact PCB designs, ideal for applications where space efficiency is crucial.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 indicates the microcontroller's tolerance to moisture exposure during assembly or operation, ensuring reliable performance in various environments.

Speed: 300 rpm

The high speed of 300 rpm indicates the microcontroller's fast processing capabilities, suitable for time-sensitive applications or tasks requiring quick response times.

No. of I/O Lines: 88

The abundance of I/O lines (88) provides extensive connectivity options for interfacing with external devices, sensors, or peripherals, enhancing the microcontroller's versatility.

Technical Specifications

Microcontrollers TMS320C28342ZFEQ attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES AT 3.3V

Address Bus Width:

22

Bit Size:

32

CPU Family:

TMS320

Maximum Clock Frequency:

300 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Length:

17 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

88

No. of Terminals:

256

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA256,16X16,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8,3.3

Qualification:

Not Qualified

RAM Bytes:

100352

ROM Words:

8192

ROM Programmability:

MROM

Maximum Seated Height:

2.1 mm

Speed:

300 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

17 mm

Peripheral IC Type:

Trade Compliance

TMS320C28342ZFEQ Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20