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TMS320C28341ZHHT

Texas Instruments

TMS320C28341ZHHT by Texas Instruments

TMS320C28341ZHHT by Texas Instruments is a 32-bit microcontroller with 179 terminals, operating at up to 300 MHz. It features 196 RAM words and peripherals like DMA(6), PWM(18), TIMER(18). Ideal for industrial applications requiring high-speed processing and extensive I/O capabilities.

Median Price

$10.540

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2 parts In-Stock

1+ parts

-

100+ parts

$10.540

1k+ parts

$9.430

10k+ parts

$8.870

2

-

$10.540

$9.430

$8.870

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,582 parts In-Stock

1+ parts

$11.124

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1,582

$11.124

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Vyrian

USA . 8,172 parts In-Stock

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8,172

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ACDS - Activité Composants Distribution Service

France . 132 parts In-Stock

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132

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Bristol Electronics

USA . 129 parts In-Stock

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129

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Dan-Mar Components

USA . 129 parts In-Stock

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129

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,314 parts In-Stock

1+ parts

$10.539

100+ parts

-

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2,314

$10.539

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AZTECH Wire

Italy . 614 parts In-Stock

1+ parts

$18.750

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614

$18.750

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Parana Technologies

USA . 2,180 parts In-Stock

1+ parts

$65.304

100+ parts

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2,180

$65.304

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DigiPath Technology Company

USA . 1,135 parts In-Stock

1+ parts

$71.908

100+ parts

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1,135

$71.908

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IDEA Electronic Components Group

UK . 1,739 parts In-Stock

1+ parts

$73.375

100+ parts

$69.706

1k+ parts

$66.038

10k+ parts

-

1,739

$73.375

$69.706

$66.038

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ChromeModa Solutions

Germany . 769 parts In-Stock

1+ parts

$73.375

100+ parts

$60.168

1k+ parts

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769

$73.375

$60.168

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QUARKTWIN TECHNOLOGY LTD

USA . 25,125 parts In-Stock

1+ parts

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25,125

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Microchip USA

USA . 4,646 parts In-Stock

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4,646

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Overview

Elevate your projects with the TMS320C28341ZHHT microcontroller by Texas Instruments, a top-tier manufacturer known for cutting-edge technology. This powerful device offers unparalleled performance and reliability in a variety of applications. Whether you're working on industrial automation, motor control, or power management systems, this microcontroller delivers exceptional value with its advanced features and robust design. Trust Texas Instruments to provide you with the quality and innovation you need to take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring reliable performance in various environments.

Surface Mount: YES

Allows for easy installation and integration onto circuit boards, saving time and effort in assembly.

Maximum Supply Voltage: 1.26 V

Supports a wide range of power supply options, making the microcontroller versatile for different applications.

On Chip Data RAM Width: 16

Offers sufficient memory capacity for processing data efficiently and quickly.

Address Bus Width: 16

Enables efficient memory addressing, enhancing the overall performance of the microcontroller.

Package Shape: SQUARE

Allows for easier placement on circuit boards and saves space in compact designs.

Bit Size: 32

Provides a higher processing capability and efficiency for handling complex tasks and computations.

Power Supplies (V): 1.1,1.8,3.3

Supports multiple voltage inputs, offering flexibility in power requirements for different applications.

No. of Terminals: 179

Provides ample connection points for interfacing with external components and peripherals.

Package Style (Meter): GRID ARRAY

Enhances thermal performance and reliability of the microcontroller's package with better heat dissipation.

Minimum Supply Voltage: 1.14 V

Ensures stable operation even at lower voltage levels, increasing the microcontroller's reliability.

Maximum Operating Temperature: 105 °C

Suitable for industrial environments with varying temperature conditions, ensuring consistent performance.

CPU Family: TMS320

Features a renowned and reliable CPU family known for high performance, making it a trusted choice for microcontrollers.

No. of External Interrupts: 8

Enables efficient handling of external events and interrupts, improving the microcontroller's responsiveness.

Minimum Operating Temperature: -40 °C

Operates reliably in extreme cold conditions, making it suitable for a wide range of applications.

Terminal Finish: TIN SILVER COPPER

Provides good conductivity and corrosion resistance for the terminal connections, ensuring reliable performance.

ADC Channels: YES

Allows for analog-to-digital conversion, enabling the microcontroller to interface with sensors and analog devices.

DMA Channels: YES

Supports Direct Memory Access for efficient data transfer, improving overall system performance.

Terminal Position: BOTTOM

Facilitates easy installation and soldering onto circuit boards, enhancing usability and connectivity.

ROM Words: 8192

Provides ample storage for program instructions, allowing for complex applications to be executed efficiently.

Maximum Seated Height: 1.4 mm

Ensures a compact form factor for space-constrained designs, offering versatility in product integration.

RAM Words: 196

Offers sufficient memory for temporary data storage and processing, enhancing the microcontroller's performance.

Width: 12 mm

Compact size allows for flexible integration in various applications, saving space and simplifying design layouts.

Boundary Scan: YES

Facilitates testing and debugging of the microcontroller during production, ensuring product quality and reliability.

External Data Bus Width: 32

Provides a high-speed data interface for efficient communication with external devices and peripherals.

Peripherals: DMA(6), PWM(18), TIMER(18), WDT

Offers a wide range of peripherals for enhanced functionality and control in various applications.

Maximum Clock Frequency: 300 MHz

Delivers high processing speed and performance capabilities for demanding applications.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures reliable soldering and assembly of the microcontroller onto circuit boards, maintaining product quality.

Peak Reflow Temperature °C: 260

Withstands high-temperature reflow processes during assembly, ensuring the microcontroller's reliability and durability.

Length: 12 mm

Compact size enables versatile integration in various devices and systems, optimizing space utilization.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications with robust temperature requirements, ensuring reliable operation in harsh environments.

Peripheral IC Type: MICROCONTROLLER

Designed specifically for microcontroller applications, providing optimized performance and functionality.

No. of Timers: 18

Offers a wide range of timing functions for precise control and coordination in diverse applications.

RAM Bytes: 200704

Provides ample memory capacity for data storage and processing, enhancing the microcontroller's performance.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high-speed operation, improving efficiency and battery life.

Terminal Form: BALL

Facilitates easy connection and soldering onto circuit boards, ensuring reliable electrical connections.

Nominal Supply Voltage: 1.2 V

Optimal voltage level for efficient operation and performance, ensuring stable and reliable functionality.

No. of DMA Channels: 6

Multiple DMA channels for efficient data transfer and processing, improving system performance and responsiveness.

No. of Serial I/Os: 2

Supports serial communication interfaces for connection to external devices and peripherals, enhancing versatility.

PWM Channels: YES

Allows for pulse-width modulation for precise control and efficient power management in various applications.

Connectivity: CAN(2), I2C, SCI(3), SPI(4)

Supports a variety of communication protocols for seamless integration with external devices and systems.

ROM Programmability: MROM

Offers non-volatile memory storage for program instructions, ensuring data retention even when power is disconnected.

Terminal Pitch: 0.8 mm

Compact terminal pitch for space-saving design layouts and easy integration onto circuit boards.

Format: FLOATING POINT

Supports floating-point arithmetic for precise calculations and data processing tasks, enhancing computational capabilities.

Moisture Sensitivity Level (MSL): 3

Designed to withstand moderate levels of moisture exposure, ensuring long-term reliability in various environments.

Speed: 300 rpm

High processing speed for quick and efficient execution of tasks, suitable for real-time applications and high-performance computing.

Low Power Mode: YES

Includes low power mode for energy-efficient operation, extending battery life and reducing power consumption.

On Chip Program ROM Width: 16

Sufficient storage for program instructions on-chip, enabling fast and efficient execution of code.

No. of I/O Lines: 88

Provides ample input/output lines for connecting to external devices and peripherals, enhancing the microcontroller's versatility.

Technical Specifications

Microcontrollers TMS320C28341ZHHT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES AT 3.3V

Address Bus Width:

16

Bit Size:

32

Boundary Scan:

YES

CPU Family:

TMS320

Maximum Clock Frequency:

300 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B179

JESD-609 Code:

e1

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

8

No. of I/O Lines:

88

No. of Serial I/Os:

2

No. of Terminals:

179

No. of Timers:

18

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA179,14X14,32

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.1,1.8,3.3

Qualification:

Not Qualified

RAM Bytes:

200704

RAM Words:

196

ROM Words:

8192

ROM Programmability:

MROM

Maximum Seated Height:

1.4 mm

Speed:

300 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"CAN(2), I2C, SCI(3), SPI(4)"

Peripherals:

"DMA(6), PWM(18), TIMER(18), WDT"

Trade Compliance

TMS320C28341ZHHT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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