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TMS320C28341ZAYT

Texas Instruments

TMS320C28341ZAYT by Texas Instruments

TMS320C28341ZAYT by Texas Instruments is a 32-bit microcontroller with 179 terminals, operating at up to 150 MHz. It features 18 timers, CAN connectivity, and DMA channels for high-speed data transfer. Ideal for industrial applications requiring high processing speeds and multiple peripherals.

Median Price

$23.230

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 157 parts In-Stock

1+ parts

$23.230

100+ parts

$15.850

1k+ parts

$13.810

10k+ parts

-

157

$23.230

$15.850

$13.810

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,760 parts In-Stock

1+ parts

$14.668

100+ parts

-

1k+ parts

-

10k+ parts

-

2,760

$14.668

-

-

-

Vyrian

USA . 8,643 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,643

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 107 parts In-Stock

1+ parts

$13.896

100+ parts

-

1k+ parts

-

10k+ parts

-

107

$13.896

-

-

-

Microchip USA

USA . 1,649 parts In-Stock

1+ parts

$33.560

100+ parts

$33.080

1k+ parts

$32.840

10k+ parts

$32.600

1,649

$33.560

$33.080

$32.840

$32.600

Parana Technologies

USA . 1,183 parts In-Stock

1+ parts

$75.749

100+ parts

$7,034.424

1k+ parts

$68.174

10k+ parts

-

1,183

$75.749

$7,034.424

$68.174

-

DigiPath Technology Company

USA . 2,344 parts In-Stock

1+ parts

$83.409

100+ parts

$76.736

1k+ parts

-

10k+ parts

-

2,344

$83.409

$76.736

-

-

ChromeModa Solutions

Germany . 5,667 parts In-Stock

1+ parts

$85.111

100+ parts

$69.791

1k+ parts

-

10k+ parts

-

5,667

$85.111

$69.791

-

-

IDEA Electronic Components Group

UK . 750 parts In-Stock

1+ parts

$85.111

100+ parts

$80.855

1k+ parts

$76.600

10k+ parts

-

750

$85.111

$80.855

$76.600

-

Overview

Elevate your projects with the cutting-edge TMS320C28341ZAYT microcontroller by Texas Instruments. As a leader in the industry, Texas Instruments guarantees top-quality products that deliver exceptional performance. Ideal for a wide range of applications, this microcontroller offers unparalleled value with its advanced features and benefits. Experience seamless connectivity, efficient power consumption, and enhanced processing speed with the TMS320C28341ZAYT. Upgrade your designs and unlock endless possibilities with this innovative solution from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good durability and protection for the microcontroller.

Maximum Supply Voltage: 1.16 V

Higher maximum supply voltage allows for flexibility in power supply options.

ROM Words: 8192

Large ROM capacity allows for storing more program data.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy efficient.

Connectivity: CAN, I2C(2), SCI(3), SPI(3)

Multiple connectivity options make it versatile and compatible with various communication protocols.

Technical Specifications

Microcontrollers TMS320C28341ZAYT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES AT 3.3V

Address Bus Width:

20

Bit Size:

32

Boundary Scan:

YES

CPU Family:

TMS320

Maximum Clock Frequency:

150 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B179

JESD-609 Code:

e1

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

8

No. of I/O Lines:

88

No. of Terminals:

179

No. of Timers:

18

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA179,14X14,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

200704

ROM Words:

8192

ROM Programmability:

MROM

Maximum Seated Height:

1.4 mm

Speed:

200 rpm

Maximum Supply Voltage:

1.16 V

Minimum Supply Voltage:

1.05 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Connectivity:

CAN, I2C(2), SCI(3), SPI(3)

Peripherals:

DMA(6), POR, PWM(12), TIMER(18), QEP(2), WDT

Trade Compliance

TMS320C28341ZAYT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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