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TMP5704357AZWTQQ1

Texas Instruments

TMP5704357AZWTQQ1 by Texas Instruments

TMP5704357AZWTQQ1 by Texas Instruments is a 32-bit microcontroller with 13-bit address bus width, 524288 RAM bytes, and 80 MHz max clock frequency. Ideal for automotive applications, it features 41-Ch 12-Bit ADC channels, CAN(4), I2C(2), LIN(2), SCI(4), SPI(5) connectivity, and AEC-Q100 screening level.

Median Price

$45.500

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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DF Sales Co.

USA . 606 parts In-Stock

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DF Sales Co.

USA . 362 parts In-Stock

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Vyrian

USA . 3,951 parts In-Stock

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Digiode

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LIBRA Elektronik GmbH

Germany . 5 parts In-Stock

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Prism Electronics

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One Stop Electronics

USA . 1,592 parts In-Stock

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$13.000

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AZTECH Wire

Italy . 872 parts In-Stock

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Parana Technologies

USA . 1,069 parts In-Stock

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$50.952

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$4,731.630

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$45.856

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DigiPath Technology Company

USA . 813 parts In-Stock

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$56.104

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ChromeModa Solutions

Germany . 4,067 parts In-Stock

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IDEA Electronic Components Group

UK . 1,361 parts In-Stock

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$54.387

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$51.524

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Component Stockers USA

USA . 428 parts In-Stock

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Corphita

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Microchip USA

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Overview

Experience the power of cutting-edge technology with the TMP5704357AZWTQQ1 by Texas Instruments. As a leader in microcontrollers, Texas Instruments delivers top-quality products that are designed to meet the demands of various applications. This microcontroller offers unmatched performance and reliability, making it an ideal choice for automotive and industrial projects. With a wide range of peripherals, including ADC and DMA channels, PWM channels, and connectivity options like CAN and SPI, this product provides exceptional value and versatility. Trust Texas Instruments to provide you with the innovative solutions you need to bring your designs to life.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microcontroller, making it suitable for various environments.

Surface Mount: YES

Surface mounting allows for easier and more efficient assembly of electronic circuits, saving time and space.

Maximum Supply Voltage: 1.32 V

The higher maximum supply voltage allows for flexibility in power requirements and compatibility with various power sources.

Address Bus Width: 13

Having a wider address bus allows for more memory addresses to be accessed, increasing the capabilities of the microcontroller.

Screening Level: AEC-Q100

This screening level ensures high reliability and quality, making it suitable for automotive applications where durability is crucial.

Package Shape: SQUARE

The square package shape helps in efficient use of PCB space and makes it easier for automated assembly processes.

Bit Size: 32

A larger bit size allows for processing more data at a time, improving the overall performance of the microcontroller.

No. of Terminals: 337

Having a higher number of terminals enables more connectivity options and interfaces with other components, enhancing the functionality of the microcontroller.

Minimum Supply Voltage: 1.14 V

The lower minimum supply voltage allows for efficient power consumption and operation at lower voltage levels.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature makes the microcontroller suitable for use in harsh environments with elevated temperatures.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable performance even in extremely cold conditions.

ADC Channels: YES

Having Analog to Digital Converter channels allows the microcontroller to interface with analog sensors and signals, expanding its applicability.

DMA Channels: YES

Direct Memory Access channels help improve data transfer speeds and reduce CPU load, enhancing the efficiency of the microcontroller.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and assembly processes, making it easier to integrate the microcontroller into a system.

ROM Words: 4194304

Having a large amount of read-only memory allows for storing a significant amount of program code and data, increasing the versatility of the microcontroller.

Maximum Seated Height: 1.4 mm

The low seated height of the package enables compact and slim designs, suitable for applications with space constraints.

Width: 16 mm

The compact width of the microcontroller makes it easy to integrate into various PCB layouts and designs.

Data EEPROM Size: 128K

A large EEPROM size allows for storing and retrieving data even when the power is turned off, making the microcontroller suitable for data logging and retention applications.

External Data Bus Width: 16

Having a wider external data bus width enables faster data transfer between the microcontroller and external devices, improving overall system performance.

Peripherals: DMA(32), POR, TIMER(3), WDT

The various peripherals like DMA, Power-On Reset, Timers, and Watchdog Timer enhance the functionality and capability of the microcontroller for different applications.

Maximum Clock Frequency: 80 MHz

The high maximum clock frequency enables fast data processing and execution of instructions, making the microcontroller suitable for high-speed applications.

Length: 16 mm

The compact length of the microcontroller contributes to space-saving designs and ease of integration into different electronic systems.

Temperature Grade: AUTOMOTIVE

Being automotive grade means the microcontroller meets stringent requirements for reliability and durability in automotive applications, ensuring high performance in challenging environments.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture and microcontroller type make it suitable for embedded applications that require efficient processing of instructions and low power consumption.

RAM Bytes: 524288

Having a large RAM size allows for temporary storage of data and variables during program execution, enhancing the microcontroller's performance in complex applications.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor technology offers low power consumption, high noise immunity, and fast switching speeds, making it ideal for efficient operation of the microcontroller.

Terminal Form: BALL

The ball terminal form facilitates reliable soldering connections and better thermal performance, ensuring the overall durability and longevity of the microcontroller.

Analog To Digital Convertors: 41-Ch 12-Bit

Having multiple ADC channels with 12-bit resolution allows for accurate conversion of analog signals to digital data, enabling precise measurement and control applications.

Nominal Supply Voltage: 1.2 V

The nominal supply voltage provides stable power supply to the microcontroller, ensuring consistent performance and reliability in different operating conditions.

PWM Channels: YES

Pulse Width Modulation channels enable the microcontroller to generate precise analog outputs and control signals, essential for motor control, lighting, and other applications.

Connectivity: CAN(4), I2C(2), LIN(2), SCI(4), SPI(5)

The multiple connectivity options like CAN, I2C, LIN, SCI, and SPI interfaces offer versatile communication capabilities for the microcontroller, allowing it to interact with diverse external devices and systems.

ROM Programmability: FLASH

The use of Flash memory for ROM programmability allows for easy and fast reprogramming of the microcontroller, making it ideal for rapid prototyping and development cycles.

Terminal Pitch: 0.8 mm

The fine terminal pitch facilitates compact PCB layout and assembly, enabling high-density designs and efficient use of space.

Speed: 300 rpm

The high speed of 300 rpm ensures rapid data processing and execution of instructions, making the microcontroller suitable for real-time applications and high-performance tasks.

On Chip Program ROM Width: 8

The on-chip ROM width of 8 bits allows for storing program code directly on the microcontroller, reducing external memory requirements and simplifying the design.

No. of I/O Lines: 145

Having a high number of I/O lines provides ample interfacing possibilities and flexibility for connecting peripherals and external devices to the microcontroller, enhancing its functionality.

Technical Specifications

Microcontrollers TMP5704357AZWTQQ1 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

13

Bit Size:

32

Maximum Clock Frequency:

80 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

16

JESD-30 Code:

S-PBGA-B337

Length:

16 mm

No. of I/O Lines:

145

No. of Terminals:

337

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

RAM Bytes:

524288

ROM Words:

4194304

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.4 mm

Speed:

300 rpm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

16 mm

Peripheral IC Type:

Data EEPROM Size:

128K

Connectivity:

CAN(4), I2C(2), LIN(2), SCI(4), SPI(5)

Peripherals:

DMA(32), POR, TIMER(3), WDT

Analog To Digital Convertors:

41-Ch 12-Bit

Trade Compliance

TMP5704357AZWTQQ1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

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