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TMP141AIDBVTG4

Texas Instruments

TMP141AIDBVTG4 by Texas Instruments

TMP141AIDBVTG4 by Texas Instruments is a 10-bit temperature sensor with 1-Wire interface. It operates b/w -40 to 125°C, with ±2°C accuracy. Suitable for applications requiring digital output and surface mounting feature.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 4,061 parts In-Stock

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Digiode

USA . 2,005 parts In-Stock

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Parana Technologies

USA . 1,580 parts In-Stock

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$2.987

100+ parts

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$3.491

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1,580

$2.987

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$3.491

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DigiPath Technology Company

USA . 247 parts In-Stock

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$3.289

100+ parts

$3.026

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247

$3.289

$3.026

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ChromeModa Solutions

Germany . 4,264 parts In-Stock

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$3.356

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$2.752

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$3.356

$2.752

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IDEA Electronic Components Group

UK . 2,146 parts In-Stock

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$3.356

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$3.020

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$3.356

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AZTECH Wire

Italy . 862 parts In-Stock

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$6.736

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862

$6.736

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Semicontronic

India . 187 parts In-Stock

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$35.750

100+ parts

$34.856

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$34.678

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187

$35.750

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$34.678

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One Stop Electronics

USA . 1,322 parts In-Stock

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$47.750

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Ampacity Inc.

Singapore . 1,051 parts In-Stock

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$49.750

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Corphita

USA . 4,961 parts In-Stock

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Corohmni

South Africa . 150 parts In-Stock

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Overview

Elevate your temperature sensing capabilities with the TMP141AIDBVTG4 by Texas Instruments. Crafted with precision and quality, this temperature sensor offers unmatched accuracy and reliability for a wide range of applications. From industrial to consumer electronics, this sensor provides valuable insights and control over temperature variations. Trust in Texas Instruments' reputation for excellence and innovation, and experience the benefits of advanced temperature monitoring with the TMP141AIDBVTG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes the temperature sensor lightweight and durable, suitable for various applications.

Maximum Supply Voltage: 5.5 V

The higher maximum supply voltage allows for flexibility in power supply options and ensures reliable operation within the specified range.

No. of Bits: 10

Having 10 bits provides a high level of resolution and accuracy in temperature measurement, making the sensor ideal for precise monitoring and control.

Body Width: 1.6 inch

A compact body width of 1.6 inches allows for easy integration and installation of the temperature sensor in various equipment or devices.

Power Supplies (V): 3.3

The sensor's power supply requirement of 3.3V is common and readily available, making it convenient to use in different systems without the need for complex power sources.

Sensors or Transducers Type: TEMPERATURE SENSOR, SWITCH/DIGITAL OUTPUT, SERIAL

With multiple sensor types and output options, this temperature sensor provides versatility and compatibility with different devices and communication protocols.

No. of Terminals: 6

Having 6 terminals allows for easy connections and ensures secure interfacing with other components, simplifying the installation process.

Body Height: 1.45 mm

The low body height of 1.45 mm contributes to a compact and space-saving design, making the sensor suitable for applications with limited mounting space.

Package Shape or Style: RECTANGULAR

The rectangular package shape offers a standardized form factor that is easy to handle and mount, enhancing compatibility with various mounting configurations.

Minimum Supply Voltage: 2.7 V

The lower minimum supply voltage of 2.7V ensures energy efficiency and compatibility with a wide range of power sources, making the sensor versatile in different applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C allows the sensor to withstand elevated temperatures without compromising performance, ensuring reliable operation in harsh environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C enables the sensor to function effectively in cold conditions, making it suitable for applications that require temperature monitoring in extreme environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The use of nickel/palladium/gold terminal finish enhances the sensor's durability and resistance to corrosion, ensuring long-term reliability in varying operating conditions.

Maximum Operating Current: 10 mA

The maximum operating current of 10mA indicates the sensor's low power consumption, making it energy-efficient and suitable for battery-powered applications.

Housing: PLASTIC

Being housed in plastic material provides insulation and protection to the sensor components, enhancing its reliability and longevity in different operating environments.

Maximum Accuracy °C: 2

With a maximum accuracy of 2°C, this sensor offers precise temperature measurement, making it ideal for applications that require high accuracy and consistency in data monitoring.

Body Length/Diameter: 2.9 mm

The small body length/diameter of 2.9 mm contributes to the sensor's compact size and lightweight design, facilitating easy integration and installation in various systems.

Termination Type: SOLDER

The use of solder termination ensures secure and reliable connections, minimizing the risk of loose connections or signal interruptions for stable temperature sensing.

Output Interface Type: 1-WIRE INTERFACE

The 1-wire interface simplifies communication and integration with other devices, enabling easy data exchange and control for seamless operation in different networked systems.

Mounting Feature: SURFACE MOUNT

The surface mounting feature offers easy and secure attachment to PCBs or other surfaces, allowing for flexible installation and integration of the temperature sensor in various applications.

Technical Specifications

Temperature Sensors TMP141AIDBVTG4 attributes and parameters. Explore more Temperature Sensors devices from Texas Instruments

Specs

Maximum Accuracy (Cel):

2

Additional Features:

HYSTERESIS 300 MV

Body Width:

1.6 inch

Body Height:

1.45 mm

Body Length/Diameter:

2.9 mm

Housing:

PLASTIC

JESD-609 Code:

e4

Mounting Feature:

No. of Bits:

10

No. of Terminals:

6

Maximum Operating Current:

10 mA

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Interface Type:

1-WIRE INTERFACE

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

TSOP6,.11,37

Package Shape or Style:

Power Supplies (V):

3.3

Sub-Category:

Other Sensors

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.7 V

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Termination Type:

SOLDER

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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