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TMP122AIDBVT

Texas Instruments

TMP122AIDBVT by Texas Instruments

TMP122AIDBVT by Texas Instruments is a 12-bit temperature sensor with SPI interface. It operates b/w -40 to 125°C, offering ±1.5°C accuracy. Ideal for applications requiring digital output and surface mounting feature.

Median Price

$2.502

Lifecycle Status

Suppliers In-Stock

18

In-Stock Inventory

1k+

Distributors (Authorized)

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Arrow

USA . 12 parts In-Stock

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$2.374

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DigiKey

USA . 629 parts In-Stock

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$2.820

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$2.090

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$1.920

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629

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Farnell

UK . 116 parts In-Stock

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$2.960

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$1.440

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$1.080

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Mouser Electronics

USA . 265 parts In-Stock

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RS (Exports)

UK . 40 parts In-Stock

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$1.494

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Element14

Singapore . 24 parts In-Stock

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Verical

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Digiode

USA . 3,914 parts In-Stock

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$2.255

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Chip Stock

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Vyrian

USA . 8,589 parts In-Stock

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Bristol Electronics

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Atlantic Semiconductor

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Sogenti Electronics

Canada . 250 parts In-Stock

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Cyclops Electronics Ltd

UK . 237 parts In-Stock

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Inventory MP

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Prism Electronics

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Nova Conductors

Japan . 50 parts In-Stock

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LWI Electronics Inc

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Distributors (Availability)

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Corphita

USA . 3,721 parts In-Stock

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$2.137

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Corohmni

South Africa . 370 parts In-Stock

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$2.571

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Parana Technologies

USA . 1,909 parts In-Stock

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$2.806

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$3.291

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$2.806

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DigiPath Technology Company

USA . 2,342 parts In-Stock

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$3.090

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ChromeModa Solutions

Germany . 5,358 parts In-Stock

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$3.153

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$2.585

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IDEA Electronic Components Group

UK . 1,497 parts In-Stock

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Ampacity Inc.

Singapore . 200 parts In-Stock

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$3.220

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Continental Prestige Electronics

USA . 67 parts In-Stock

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$1.830

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$1.450

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AZTECH Wire

Italy . 647 parts In-Stock

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Perfect Parts

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Kepictronics

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A-Z Elektronik GmbH

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Authorized Procurement Solutions

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Argo Parts USA

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Aranea Global

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Assy Fe

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Overview

Experience precise and reliable temperature sensing with the TMP122AIDBVT by Texas Instruments. Crafted with superior quality materials and cutting-edge technology, this temperature sensor offers unparalleled accuracy and efficiency. Ideal for a wide range of applications, from automotive to industrial settings, this product guarantees top-notch performance and durability. Trust in Texas Instruments to deliver innovative solutions that exceed your expectations. Elevate your projects with the TMP122AIDBVT today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material makes the sensor durable and resistant to environmental factors.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage allows for flexibility in power supply options.

No. of Bits: 12

Having 12 bits ensures high resolution and accuracy in temperature readings.

Body Width: 1.6 inch

The compact body width makes it easy to integrate this sensor into various applications.

Power Supplies (V): 3/5

The dual power supply options of 3V or 5V make this sensor versatile and compatible with different systems.

Sensors or Transducers Type: TEMPERATURE SENSOR, SWITCH/DIGITAL OUTPUT, SERIAL

This sensor offers multiple outputs and communication options for enhanced connectivity and functionality.

No. of Terminals: 6

The 6 terminals provide ample connectivity options for various configurations.

Body Height: 1.45 mm

The low profile body height allows for easy installation in tight spaces.

Package Shape or Style: RECTANGULAR

The rectangular package shape offers a standardized form factor for easy integration with other components.

Minimum Supply Voltage: 2.7 V

The low minimum supply voltage ensures efficient power consumption and operation.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this sensor can withstand extreme conditions.

Minimum Operating Temperature: -40 °C

The wide range of operating temperatures allows this sensor to be used in various environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The high-quality terminal finish ensures reliable and durable connections.

Maximum Operating Current: 0.075 mA

The low operating current helps in efficient energy usage for long-term operation.

Maximum Accuracy °C: 1.5

The high accuracy of 1.5°C ensures precise temperature measurements.

Body Length/Diameter: 2.9 mm

The small body length/diameter makes this sensor suitable for compact designs.

Termination Type: SOLDER

The solder termination type provides secure and reliable connections for stable performance.

Output Interface Type: SPI INTERFACE

The SPI interface enables fast and efficient communication with other devices.

Mounting Feature: SURFACE MOUNT

The surface mount feature allows for easy and secure installation on circuit boards.

Technical Specifications

Temperature Sensors TMP122AIDBVT attributes and parameters. Explore more Temperature Sensors devices from Texas Instruments

Specs

Maximum Accuracy (Cel):

1.5

Body Width:

1.6 inch

Body Height:

1.45 mm

Body Length/Diameter:

2.9 mm

Housing:

PLASTIC

JESD-609 Code:

e4

Mounting Feature:

No. of Bits:

12

No. of Terminals:

6

Maximum Operating Current:

.075 mA

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Interface Type:

SPI INTERFACE

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

TSOP6,.11,37

Package Shape or Style:

Power Supplies (V):

3/5

Sub-Category:

Other Sensors/Transducers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.7 V

Terminal Finish:

NICKEL PALLADIUM GOLD

Termination Type:

SOLDER

Trade Compliance

TMP122AIDBVT Sensors & Transducers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-629-7160, 5962016297160

NIIN

016297160

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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