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TMP006BIYZFT

Texas Instruments

TMP006BIYZFT by Texas Instruments

TMP006BIYZFT by Texas Instruments is a 16-bit temperature sensor with 2.5-5.5V supply voltage range, ideal for applications requiring precise temperature monitoring. With a compact square package and 8 terminals, it operates b/w -40 to 125°C with low current consumption of 0.24mA. The sensor features a positive temperature coefficient and utilizes a 2-wire interface for easy integration in surface mount setups.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 9,527 parts In-Stock

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Digiode

USA . 1,846 parts In-Stock

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Electronics Depot

USA . 500 parts In-Stock

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Parana Technologies

USA . 1,529 parts In-Stock

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$2.772

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$3.256

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DigiPath Technology Company

USA . 806 parts In-Stock

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$3.053

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$2.808

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806

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ChromeModa Solutions

Germany . 6,214 parts In-Stock

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$3.115

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$2.554

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IDEA Electronic Components Group

UK . 263 parts In-Stock

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$3.115

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$2.804

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AZTECH Wire

Italy . 839 parts In-Stock

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$9.742

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One Stop Electronics

USA . 175 parts In-Stock

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$52.750

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Lixinc

USA . 7,557 parts In-Stock

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Corphita

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Authorized Procurement Solutions

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Perfect Parts

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Overview

Enhance your temperature sensing capabilities with the TMP006BIYZFT by Texas Instruments. As a leader in the industry, Texas Instruments ensures top-notch quality and reliability in their products. This temperature sensor offers precise measurements and a wide operating temperature range, making it ideal for various applications. From automotive to industrial settings, this sensor provides valuable insights and control, ultimately improving efficiency and performance. Experience the benefits of accurate temperature monitoring with the TMP006BIYZFT.

Feature Benefit Bullets

Maximum Supply Voltage: 5.5 V

Higher voltage tolerance allows for flexibility in power supply options.

No. of Bits: 16

Higher number of bits provides more precise temperature readings.

Body Width: 1.53 inch

Compact size makes it suitable for small spaces or applications with limited room.

Power Supplies (V): 3.3

Standard power supply voltage for easy integration with existing systems.

Sensors or Transducers Type: TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL

Versatile functionality for multiple applications and sensor types.

No. of Terminals: 8

Sufficient number of terminals for connections and flexibility in wiring.

Body Height: 0.625 mm

Low profile design for minimal intrusion in installations.

Package Shape or Style: SQUARE

Square shape for easy mounting and alignment in circuit boards.

Minimum Supply Voltage: 2.5 V

Low minimum voltage requirement for energy-efficient operation.

Maximum Operating Temperature: 125 °C

High maximum operating temperature for reliable performance in various environments.

Minimum Operating Temperature: -40 °C

Wide temperature range for use in extreme hot or cold conditions.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

Durable terminal finish for longevity and reliable connections.

Body Length/Diameter: 1.53 mm

Compact size for easy integration and installation.

Temperature Coef (ppm/°C): POSITIVE

Positive temperature coefficient for accurate and consistent readings.

Termination Type: SOLDER

Solder termination for secure and stable connections.

Output Interface Type: 2-WIRE INTERFACE

Simple 2-wire interface for easy connection to data acquisition systems.

Mounting Feature: SURFACE MOUNT

Surface mount feature for easy and secure board mounting.

Technical Specifications

Temperature Sensors TMP006BIYZFT attributes and parameters. Explore more Temperature Sensors devices from Texas Instruments

Specs

Additional Features:

IT HAS HYSTERESIS 100 MV

Body Width:

1.53 inch

Body Height:

.625 mm

Body Length/Diameter:

1.53 mm

JESD-609 Code:

e1

Mounting Feature:

No. of Bits:

16

No. of Terminals:

8

Maximum Operating Current:

.24 mA

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Interface Type:

2-WIRE INTERFACE

Package Body Material:

UNSPECIFIED

Package Equivalence Code:

BGA8,3X3,20

Package Shape or Style:

Power Supplies (V):

3.3

Sub-Category:

Other Sensors/Transducers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.5 V

Temperature Coef (ppm/Cel):

POSITIVE

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Termination Type:

SOLDER

Trade Compliance

TMP006BIYZFT Sensors & Transducers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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