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TMP006AIYZFT

Texas Instruments

TMP006AIYZFT by Texas Instruments

TMP006AIYZFT by Texas Instruments is a 16-bit temperature sensor with 2.5-5.5V supply voltage range, ideal for applications requiring precise temperature monitoring. With a compact square package and 8 terminals, it operates b/w -40 to 125°C with low power consumption of 0.24mA. Suitable for surface mount installations, it features a 2-wire interface for digital output signal transmission.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

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Chip Stock

USA . 8,460 parts In-Stock

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Vyrian

USA . 5,516 parts In-Stock

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Inland Empire Components Inc.

USA . 3,000 parts In-Stock

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Digiode

USA . 1,672 parts In-Stock

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Connector Distribution Corp

USA . 440 parts In-Stock

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Right Parts Inc.

USA . 337 parts In-Stock

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337

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LIBRA Elektronik GmbH

Germany . 216 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 1,194 parts In-Stock

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$2.571

100+ parts

$238.776

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$2.314

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DigiPath Technology Company

USA . 2,206 parts In-Stock

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$2.831

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$2.831

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ChromeModa Solutions

Germany . 6,304 parts In-Stock

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$2.889

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$2.369

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IDEA Electronic Components Group

UK . 1,590 parts In-Stock

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$2.889

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$2.600

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AZTECH Wire

Italy . 320 parts In-Stock

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$15.542

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One Stop Electronics

USA . 1,465 parts In-Stock

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$48.750

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Corphita

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Lixinc

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Perfect Parts

USA . 2,882 parts In-Stock

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A-Z Elektronik GmbH

Germany . 510 parts In-Stock

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Overview

Upgrade your temperature sensing capabilities with the TMP006AIYZFT by Texas Instruments. As a leader in the industry, Texas Instruments ensures top-notch quality and precision in their temperature sensors. Ideal for a wide range of applications, this sensor provides reliable and accurate temperature readings with minimal power consumption. Say goodbye to guesswork and hello to precise temperature monitoring with the TMP006AIYZFT. Trust Texas Instruments for all your temperature sensing needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection, making it suitable for various environments.

Maximum Supply Voltage: 5.5 V

Can handle higher supply voltages, ensuring reliable operation.

No. of Bits: 16

Offers high resolution for accurate temperature readings.

Body Width: 1.53 inch

Compact size for easy integration into different systems.

Power Supplies (V): 3.3

Efficient power consumption for energy savings.

Sensors or Transducer Type: TEMPERATURE SENSOR, SWITCH/DIGITAL OUTPUT, SERIAL

Versatile functionality for various applications.

No. of Terminals: 8

Sufficient terminals for connectivity options.

Body Height: 0.625 mm

Low profile design for space-constrained installations.

Package Shape or Style: SQUARE

Modern and versatile design for easy placement.

Minimum Supply Voltage: 2.5 V

Works with lower supply voltages to accommodate different systems.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Operational in extreme cold conditions, expanding its utility.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

High-quality finish for reliable connections.

Maximum Operating Current: 0.24 mA

Low operating current for energy efficiency.

Body Length/Diameter: 1.53 mm

Balanced dimensions for efficient heat dissipation.

Temperature Coef (ppm/°C): POSITIVE

Stable temperature coefficient for accurate readings.

Termination Type: SOLDER

Secure termination method for stable connections.

Output Interface Type: 2-WIRE INTERFACE

Standard interface for easy integration with existing systems.

Mounting Feature: SURFACE MOUNT

Effortless installation on PCBs for quick setup.

Technical Specifications

Temperature Sensors TMP006AIYZFT attributes and parameters. Explore more Temperature Sensors devices from Texas Instruments

Specs

Body Width:

1.53 inch

Body Height:

.625 mm

Body Length/Diameter:

1.53 mm

JESD-609 Code:

e1

Mounting Feature:

No. of Bits:

16

No. of Terminals:

8

Maximum Operating Current:

.24 mA

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Interface Type:

2-WIRE INTERFACE

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

BGA8,3X3,20

Package Shape or Style:

Power Supplies (V):

3.3

Sub-Category:

Other Sensors/Transducers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.5 V

Temperature Coef (ppm/Cel):

POSITIVE

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Termination Type:

SOLDER

Trade Compliance

TMP006AIYZFT Sensors & Transducers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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