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TMDXEVM1707

Texas Instruments

TMDXEVM1707 by Texas Instruments

TMDXEVM1707 by Texas Instruments is an ARM9-based MCU evaluation board in the Sitara™ series. It features AM1705 and AM1707 ICs, a 32-bit core processor, and comes with boards, cables, and LCD for development. This evaluation platform is fixed-mounting type suitable for embedded system prototyping and DSP applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 3,373 parts In-Stock

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Digiode

USA . 1,235 parts In-Stock

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AZTECH Wire

Italy . 572 parts In-Stock

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$13.924

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Semicontronic

India . 434 parts In-Stock

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$57.100

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$55.672

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$55.387

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One Stop Electronics

USA . 295 parts In-Stock

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$185.100

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295

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Ampacity Inc.

Singapore . 427 parts In-Stock

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$240.100

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Corphita

USA . 2,128 parts In-Stock

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IDEA Electronic Components Group

UK . 2,074 parts In-Stock

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DigiPath Technology Company

USA . 1,357 parts In-Stock

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ChromeModa Solutions

Germany . 740 parts In-Stock

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Parana Technologies

USA . 462 parts In-Stock

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$0.417

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Corohmni

South Africa . 181 parts In-Stock

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Overview

Discover the power and innovation of the TMDXEVM1707 by Texas Instruments, a top-of-the-line development board designed for embedded MCU and DSP evaluation. This high-quality product offers unmatched performance and reliability, making it the perfect choice for a wide range of applications in the Sitara™ series. With its comprehensive contents including boards, cables, and an LCD, this evaluation platform provides immense value and benefits to customers seeking cutting-edge solutions. Experience the advantages of the TMDXEVM1707 and elevate your projects to new heights with Texas Instruments.

Feature Benefit Bullets

Other Names: 296-27530

Easy to identify and search for in catalogs or online stores.

Category: Development Boards, Kits, Programmers, Evaluation Boards, Embedded MCU, DSP Evaluation Boards

Versatile for various development and evaluation purposes in the embedded systems field.

Series: Sitara™

Utilizes Sitara™ series technology for enhanced performance and efficiency.

Package: Box

Provides a convenient and secure packaging for the product.

Type: MCU 32-Bit

Features a powerful 32-bit microcontroller unit for advanced processing capabilities.

Core Processor: ARM9

Utilizes ARM9 core processor for efficient and reliable computing performance.

Utilized IC / Part: AM1705, AM1707

Incorporates high-quality AM1705 and AM1707 integrated circuits for optimal functionality.

Mounting Type: Fixed

Stable and secure mounting type ensures durability and reliability during operation.

Contents: Board(s), Cable(s), LCD

Comes with essential components such as boards, cables, and LCD for a comprehensive evaluation platform.

Board Type: Evaluation Platform

Specifically designed as an evaluation platform for testing and assessing embedded systems.

Base Product Number: TMDX

Part of the TMDX product series for seamless integration with other compatible products.

Moisture Sensitivity Level (MSL): 1 (Unlimited)

Can be stored and used in various environmental conditions without limitations due to its high moisture sensitivity level rating.

Technical Specifications

Additional Parts TMDXEVM1707 attributes and parameters. Explore more Additional Parts devices from Texas Instruments

Technical Specifications

Core Processor:

ARM9

Other Names:

296-27530

Category:

Development Boards, Kits, Programmers
Evaluation Boards Embedded MCU, DSP Evaluation Boards

Mounting Type:

Fixed

Standard Package:

1

Series:

Sitara™

Type:

MCU 32-Bit

Contents:

Board(s), Cable(s), LCD

Board Type:

Evaluation Platform

Utilized IC / Part:

AM1705, AM1707

Package:

Box

Base Product Number:

TMDX

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

TMDXEVM1707 Miscellaneous Components trade compliance attributes, and parameters.

ECCN

3A991A2

HTS

8473.30.1180

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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