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TMDSEVM6472

Texas Instruments

TMDSEVM6472 by Texas Instruments

TMDSEVM6472 by Texas Instruments is an Evaluation Platform for the C6000™ series DSP. It features the TMS320C6472 IC, fixed mounting type, and includes boards, cables, and power supply. Ideal for evaluating embedded MCU and DSP applications with a moisture sensitivity level of 1 (Unlimited).

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,674 parts In-Stock

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Digiode

USA . 2,534 parts In-Stock

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2,534

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Distributors (Availability)

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Ampacity Inc.

Singapore . 875 parts In-Stock

1+ parts

$11.100

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875

$11.100

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AZTECH Wire

Italy . 680 parts In-Stock

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$12.089

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680

$12.089

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Semicontronic

India . 789 parts In-Stock

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$95.100

100+ parts

$92.722

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$92.247

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789

$95.100

$92.722

$92.247

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One Stop Electronics

USA . 638 parts In-Stock

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$110.100

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638

$110.100

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Corphita

USA . 4,075 parts In-Stock

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4,075

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DigiPath Technology Company

USA . 2,259 parts In-Stock

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ChromeModa Solutions

Germany . 629 parts In-Stock

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IDEA Electronic Components Group

UK . 592 parts In-Stock

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Parana Technologies

USA . 414 parts In-Stock

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$0.533

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414

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Corohmni

South Africa . 164 parts In-Stock

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Overview

Experience the power of innovation with the TMDSEVM6472 by Texas Instruments, a top-of-the-line evaluation board that offers exceptional quality and reliability. Designed for embedded MCU and DSP applications, this board is perfect for developers looking to push the boundaries of technology. With a user-friendly interface and comprehensive contents including boards, cables, and power supply, the TMDSEVM6472 provides unmatched value and versatility. Unleash your creativity and take your projects to the next level with this cutting-edge product from a trusted industry leader.

Feature Benefit Bullets

Other Names: 296-28221

Easy to identify and locate the product with this unique identifier.

Category: Development Boards, Kits, Programmers Evaluation Boards Embedded MCU, DSP Evaluation Boards

Designed for developing and testing embedded systems and digital signal processing applications.

Series: C6000™

Part of the C6000 series, known for high performance and efficiency in signal processing applications.

Package: Box

Packaged in a box for easy storage and transportation.

Type: DSP

Specifically designed for digital signal processing tasks.

Utilized IC / Part: TMS320C6472

Utilizes the TMS320C6472 processor known for high performance in DSP applications.

Mounting Type: Fixed

Stable and secure mounting for the board.

Contents: Board(s), Cable(s), Power Supply

Includes all necessary components for immediate setup and use.

Board Type: Evaluation Platform

Provides a platform for evaluating and testing the capabilities of the DSP processor.

Base Product Number: TMDS

Based on the TMDS platform known for its reliability and performance in embedded systems.

Moisture Sensitivity Level (MSL): 1 (Unlimited)

Can be safely stored and used in a variety of environments without risk of moisture damage.

Technical Specifications

Additional Parts TMDSEVM6472 attributes and parameters. Explore more Additional Parts devices from Texas Instruments

Technical Specifications

Other Names:

296-28221

Series:

C6000™

Type:

DSP

Category:

Development Boards, Kits, Programmers
Evaluation Boards Embedded MCU, DSP Evaluation Boards

Contents:

Board(s), Cable(s), Power Supply

Board Type:

Evaluation Platform

Utilized IC / Part:

TMS320C6472

Package:

Box

Mounting Type:

Fixed

Standard Package:

1

Base Product Number:

TMDS

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

TMDSEVM6472 Miscellaneous Components trade compliance attributes, and parameters.

ECCN

3A991A2

HTS

8473.30.1180

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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