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TLVH432IDBZT

Texas Instruments

TLVH432IDBZT by Texas Instruments

TLVH432IDBZT by Texas Instruments is a voltage reference IC with adjustable output (1.222-1.258V) and max output current of 0.08A, suitable for industrial applications. It operates b/w -40 to 85°C, has a small outline package style, and can handle up to 18V supply voltage.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,121 parts In-Stock

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Digiode

USA . 1,147 parts In-Stock

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1,147

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Distributors (Availability)

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One Stop Electronics

USA . 1,202 parts In-Stock

1+ parts

$1.500

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$1.500

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Ampacity Inc.

Singapore . 1,120 parts In-Stock

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$1.500

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$1.500

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Semicontronic

India . 195 parts In-Stock

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$5.500

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$5.362

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$5.335

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195

$5.500

$5.362

$5.335

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AZTECH Wire

Italy . 228 parts In-Stock

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$19.783

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228

$19.783

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Parana Technologies

USA . 1,109 parts In-Stock

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$21.047

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$21.285

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$21.047

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$21.285

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DigiPath Technology Company

USA . 1,948 parts In-Stock

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$23.175

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1,948

$23.175

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ChromeModa Solutions

Germany . 6,821 parts In-Stock

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$23.648

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$19.391

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$23.648

$19.391

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IDEA Electronic Components Group

UK . 359 parts In-Stock

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$23.648

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$22.466

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$21.283

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359

$23.648

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$21.283

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Corphita

USA . 4,004 parts In-Stock

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Corohmni

South Africa . 464 parts In-Stock

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Microchip USA

USA . 315 parts In-Stock

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Overview

Experience superior quality and reliability with the TLVH432IDBZT voltage reference by Texas Instruments. As a leading manufacturer, Texas Instruments delivers cutting-edge solutions for various applications in the electronics industry. With its trimmable output and small package design, this product offers unmatched precision and efficiency. Trust Texas Instruments to provide you with the advanced technology you need to enhance your projects, all while ensuring top-notch performance and value for your investment.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and reliability to the product, making it suitable for various operating environments.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto circuit boards, saving time and effort during the manufacturing process.

Minimum Output Voltage: 1.222 V

The low minimum output voltage ensures precise and accurate voltage references, making this product ideal for applications that require stable voltage levels.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this voltage reference can withstand harsh conditions and maintain stability in industrial settings.

Technology: BIPOLAR

The use of bipolar technology ensures consistent and reliable performance, making this voltage reference suitable for critical applications where accuracy is paramount.

Technical Specifications

Voltage References TLVH432IDBZT attributes and parameters. Explore more Voltage References devices from Texas Instruments

Specs

Additional Features:

OUTPUT VOLTAGE ADJUSTABLE FROM 1.24V TO 18V

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e4

Length:

2.92 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

3

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

.08 A

Maximum Output Voltage:

1.258 V

Minimum Output Voltage:

1.222 V

Nominal Output Voltage:

1.24 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TO-236

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.12 mm

Sub-Category:

Voltage References

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

1.24 V

Surface Mount:

YES

Technology:

BIPOLAR

Max Voltage Temp Coef:

129.032 ppm/Cel

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trim or Adjustable Output (V):

YES

Width (mm):

1.3 mm

Trade Compliance

TLVH432IDBZT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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