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TLV3811YBGT

Texas Instruments

TLV3811YBGT by Texas Instruments

COMPARATOR; Terminal Form: BALL; No. of Terminals: 6; Package Code: VFBGA; Package Shape: RECTANGULAR; JESD-30 Code: R-XBGA-B6;

Median Price

$5.950

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,645 parts In-Stock

1+ parts

$3.974

100+ parts

$3.240

1k+ parts

$2.160

10k+ parts

-

1,645

$3.974

$3.240

$2.160

-

DigiKey

USA . 174 parts In-Stock

1+ parts

$5.950

100+ parts

$3.832

1k+ parts

$3.485

10k+ parts

$3.355

174

$5.950

$3.832

$3.485

$3.355

Mouser Electronics

USA . 125 parts In-Stock

1+ parts

$5.950

100+ parts

$3.840

1k+ parts

$3.380

10k+ parts

-

125

$5.950

$3.840

$3.380

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,372 parts In-Stock

1+ parts

$3.775

100+ parts

-

1k+ parts

-

10k+ parts

-

1,372

$3.775

-

-

-

Vyrian

USA . 4,163 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,163

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 638 parts In-Stock

1+ parts

$2.590

100+ parts

$2.525

1k+ parts

$2.512

10k+ parts

-

638

$2.590

$2.525

$2.512

-

Ampacity Inc.

Singapore . 278 parts In-Stock

1+ parts

$2.590

100+ parts

-

1k+ parts

-

10k+ parts

-

278

$2.590

-

-

-

Corohmni

South Africa . 112 parts In-Stock

1+ parts

$3.050

100+ parts

-

1k+ parts

-

10k+ parts

-

112

$3.050

-

-

-

Corphita

USA . 2,243 parts In-Stock

1+ parts

$3.577

100+ parts

-

1k+ parts

-

10k+ parts

-

2,243

$3.577

-

-

-

Component Stockers USA

USA . 254 parts In-Stock

1+ parts

$5.690

100+ parts

$4.190

1k+ parts

-

10k+ parts

-

254

$5.690

$4.190

-

-

Microchip USA

USA . 3,144 parts In-Stock

1+ parts

$26.230

100+ parts

$26.070

1k+ parts

$25.990

10k+ parts

$25.910

3,144

$26.230

$26.070

$25.990

$25.910

Technical Specifications

Comparators TLV3811YBGT attributes and parameters. Explore more Comparators devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Total Functions:

1

Performance Specifications

Maximum Input Offset Voltage:

5 mV

Peak Bias Current:

10 uA

Operational Characteristics

Maximum Supply Current:

23 mA

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage:

5.5 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Nominal Response Time:

0.225 ns

Physical Characteristics

Length:

0.048 in (1.218 mm)

Width:

0.032 in (0.818 mm)

Maximum Seated Height:

0.02 in (0.5 mm)

Total Terminals:

6

Terminal Pitch:

0.016 in (0.4 mm)

Terminal Position:

Bottom

Terminal Form:

Terminal Finish:

Tin Silver Copper

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Standards

JESD-30 Code:

R-XBGA-B6

JESD-609 Code:

e1

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

Package Shape:

Package Type:

Grid Array, Very Thin Profile, Fine Pitch

Package Equivalence Code:

BGA6,2X3,16

Trade Compliance

TLV3811YBGT Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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