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TLV3704CD

Texas Instruments

TLV3704CD by Texas Instruments

COMPARATOR; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR;

Median Price

$2.175

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 350 parts In-Stock

1+ parts

$5.440

100+ parts

$2.720

1k+ parts

$2.190

10k+ parts

$2.120

350

$5.440

$2.720

$2.190

$2.120

DigiKey

USA . 440 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.560

10k+ parts

-

440

-

-

$2.560

-

Rochester

USA . 440 parts In-Stock

1+ parts

-

100+ parts

$1.950

1k+ parts

$1.740

10k+ parts

$1.640

440

-

$1.950

$1.740

$1.640

Verical

USA . 320 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.175

10k+ parts

$2.050

320

-

-

$2.175

$2.050

RS (Exports)

UK . 25 parts In-Stock

1+ parts

-

100+ parts

$1.718

1k+ parts

-

10k+ parts

-

25

-

$1.718

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,962 parts In-Stock

1+ parts

$1.577

100+ parts

-

1k+ parts

-

10k+ parts

-

2,962

$1.577

-

-

-

Vyrian

USA . 8,320 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,320

-

-

-

-

DigiKey Marketplace

USA . 1,970 parts In-Stock

1+ parts

-

100+ parts

$1.380

1k+ parts

-

10k+ parts

-

1,970

-

$1.380

-

-

LIBRA Elektronik GmbH

Germany . 1,140 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,140

-

-

-

-

Prism Electronics

USA . 10 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,358 parts In-Stock

1+ parts

$1.494

100+ parts

-

1k+ parts

-

10k+ parts

-

1,358

$1.494

-

-

-

Parana Technologies

USA . 1,422 parts In-Stock

1+ parts

$5.742

100+ parts

$533.258

1k+ parts

$5.168

10k+ parts

-

1,422

$5.742

$533.258

$5.168

-

DigiPath Technology Company

USA . 883 parts In-Stock

1+ parts

$6.323

100+ parts

-

1k+ parts

-

10k+ parts

-

883

$6.323

-

-

-

ChromeModa Solutions

Germany . 1,416 parts In-Stock

1+ parts

$6.452

100+ parts

$5.291

1k+ parts

-

10k+ parts

-

1,416

$6.452

$5.291

-

-

IDEA Electronic Components Group

UK . 806 parts In-Stock

1+ parts

$6.452

100+ parts

-

1k+ parts

$5.807

10k+ parts

-

806

$6.452

-

$5.807

-

Microchip USA

USA . 1,278 parts In-Stock

1+ parts

$41.070

100+ parts

$40.490

1k+ parts

$40.190

10k+ parts

$39.900

1,278

$41.070

$40.490

$40.190

$39.900

Perfect Parts

USA . 682 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

682

-

-

-

-

Technical Specifications

Comparators TLV3704CD attributes and parameters. Explore more Comparators devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Technology:

CMOS

Power Supply:

±1.25/±8/2.5/16 V

Total Functions:

4

Sub-Category:

Comparators

Output Type:

Push-Pull

Performance Specifications

Maximum Input Offset Voltage:

7 mV

Peak Bias Current:

1.5 nA

Maximum Bias Current (IIB) @25 °C:

100 pA

Operational Characteristics

Maximum Supply Current:

3.2 μA

Nominal Supply Voltage:

2.7 V

Maximum Supply Voltage:

17 V

Nominal Negative Supply Voltage (Vsup):

0 V

Maximum Negative Supply Voltage:

0 V

Lowest Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Nominal Response Time:

240 µs

Physical Characteristics

Length:

0.341 in (8.65 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

14

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel/Palladium/Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tube

Package Code:

SOP

Package Shape:

Package Type:

Small Outline

Package Equivalence Code:

SOP14,.25

Trade Compliance

TLV3704CD Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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