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TLV3402IDRG4

Texas Instruments

TLV3402IDRG4 by Texas Instruments

TLV3402IDRG4 by Texas Instruments is a comparator with 2 functions, featuring a max input offset voltage of 4400 uV and max average bias current of 0.0015 uA. It operates in automotive applications, with a nominal voltage of 5 V and open-drain output type.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,273 parts In-Stock

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Digiode

USA . 1,130 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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Corohmni

South Africa . 791 parts In-Stock

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$3.245

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One Stop Electronics

USA . 1,539 parts In-Stock

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$3.410

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Parana Technologies

USA . 861 parts In-Stock

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$3.514

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ChromeModa Solutions

Germany . 2,550 parts In-Stock

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$3.948

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IDEA Electronic Components Group

UK . 159 parts In-Stock

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$3.553

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Ampacity Inc.

Singapore . 518 parts In-Stock

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AZTECH Wire

Italy . 697 parts In-Stock

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Corphita

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Continental Prestige Electronics

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DigiPath Technology Company

USA . 1,676 parts In-Stock

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Microchip USA

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Argo Parts USA

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Aranea Global

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Overview

Enhance your electronic designs with the TLV3402IDRG4 by Texas Instruments, a top-notch comparator perfect for a wide range of applications. With Texas Instruments' reputation for quality and innovation, you can trust that this product offers exceptional performance and reliability. Whether you're working on automotive systems, industrial controls, or consumer electronics, this comparator delivers value, precision, and efficiency. Upgrade your projects with the TLV3402IDRG4 and experience the advantages of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy material provides durability and protection for the internal components of the comparator, ensuring a longer lifespan.

Maximum Input Offset Voltage: 4400 uV

Low input offset voltage ensures accurate and precise measurement results, making the comparator suitable for high-precision applications.

Maximum Average Bias Current (IIB): 0.0015 uA

Low bias current minimizes power consumption and reduces errors in the output signal, making the comparator energy-efficient and reliable.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on PCBs, saving space and simplifying the assembly process.

No. of Functions: 2

Having multiple functions in a single component increases versatility and functionality, making the comparator suitable for a variety of applications.

Nominal Supply Voltage / Vsup (V): 5

Stable nominal supply voltage of 5V ensures consistent performance and compatibility with a wide range of electronic systems.

Power Supplies (V): +-1.35/+-8/2.7/16

Versatile power supply options provide flexibility in operation and compatibility with various power sources, enhancing the overall usability of the comparator.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliability and stability of the comparator in extreme conditions, making it suitable for industrial and automotive applications.

Technical Specifications

Comparators TLV3402IDRG4 attributes and parameters. Explore more Comparators devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Power Supply:

±1.35/±8/2.7/16 V

Total Functions:

2

Sub-Category:

Comparators

Output Type:

Open-Drain

Performance Specifications

Maximum Input Offset Voltage:

4.4 mV

Peak Bias Current:

1.5 nA

Maximum Bias Current (IIB) @25 °C:

100 pA

Operational Characteristics

Maximum Supply Current:

1.28 μA

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

17 V

Nominal Negative Supply Voltage (Vsup):

0 V

Maximum Negative Supply Voltage:

0 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Nominal Response Time:

175 µs

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel/Palladium/Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

SOP

Package Shape:

Package Type:

Small Outline

Package Equivalence Code:

SOP8,.25

Trade Compliance

TLV3402IDRG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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