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TLV320AIC3254EVM-U

Texas Instruments

TLV320AIC3254EVM-U by Texas Instruments

TLV320AIC3254EVM-U by Texas Instruments is an Audio CODEC evaluation board. It features TLV320AIC3254 IC, packaged in a box with MSL of 1. Ideal for developing and testing audio applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,621 parts In-Stock

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5,621

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Digiode

USA . 829 parts In-Stock

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829

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Distributors (Availability)

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AZTECH Wire

Italy . 685 parts In-Stock

1+ parts

$10.437

100+ parts

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685

$10.437

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Ampacity Inc.

Singapore . 1,347 parts In-Stock

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$11.100

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1,347

$11.100

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Semicontronic

India . 142 parts In-Stock

1+ parts

$65.100

100+ parts

$63.472

1k+ parts

$63.147

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142

$65.100

$63.472

$63.147

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One Stop Electronics

USA . 410 parts In-Stock

1+ parts

$77.100

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410

$77.100

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Corphita

USA . 4,544 parts In-Stock

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4,544

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ChromeModa Solutions

Germany . 2,000 parts In-Stock

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2,000

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DigiPath Technology Company

USA . 1,787 parts In-Stock

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1,787

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IDEA Electronic Components Group

UK . 692 parts In-Stock

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692

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Parana Technologies

USA . 597 parts In-Stock

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$0.824

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597

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$0.824

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Corohmni

South Africa . 278 parts In-Stock

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278

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Overview

Unlock the power of superior audio performance with the TLV320AIC3254EVM-U by Texas Instruments. This development board offers unparalleled quality and reliability, showcasing the expertise of its renowned manufacturer. Ideal for a wide range of applications in the audio industry, this board provides customers with exceptional value, benefits, and advantages. Elevate your audio projects to new heights with the TLV320AIC3254EVM-U and experience unparalleled sound quality like never before.

Feature Benefit Bullets

Other Names: 296-31041, TLV320AIC3254EVMU, TLV320AIC3254EVM-U-ND

These alternate names make it easy to identify and locate the product in the market.

Category: Development Boards, Kits, Programmers, Evaluation Boards, Evaluation and Demonstration Boards and Kits

This product falls under various categories, indicating its versatility and compatibility with different types of projects.

Package: Box

The product comes in a protective box packaging, ensuring safe transport and storage.

Type: Audio

Designed specifically for audio applications, ensuring high-quality sound output.

Function: CODEC

The product functions as a CODEC (Coder-Decoder), providing efficient encoding and decoding of audio signals.

Utilized IC / Part: TLV320AIC3254

Utilizes the TLV320AIC3254 IC/part, known for its performance and reliability in audio applications.

Supplied Contents: Board(s)

Comes with the necessary board(s) for immediate use and testing, making it convenient for the user.

Base Product Number: TLV320

Part of the TLV320 product line, known for its quality and wide range of audio solutions.

Moisture Sensitivity Level (MSL): 1 (Unlimited)

The product has a low moisture sensitivity level, ensuring durability and reliability in various environments.

Technical Specifications

Additional Parts TLV320AIC3254EVM-U attributes and parameters. Explore more Additional Parts devices from Texas Instruments

Technical Specifications

Other Names:

296-31041
TLV320AIC3254EVMU
TLV320AIC3254EVM-U-ND

Function:

CODEC

Type:

Audio

Category:

Development Boards, Kits, Programmers
Evaluation Boards Evaluation and Demonstration Boards and Kits

Supplied Contents:

Board(s)

Utilized IC / Part:

TLV320AIC3254

Package:

Box

Standard Package:

1

Base Product Number:

TLV320

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

TLV320AIC3254EVM-U Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

8473.30.1180

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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