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TLV320AIC23EVM2

Texas Instruments

TLV320AIC23EVM2 by Texas Instruments

TLV320AIC23EVM2 by Texas Instruments is an Audio CODEC evaluation board supporting stereo, 16-32 bit, 8-96kHz sample rates. It includes a graphical user interface (GUI) and utilizes the TLV320AIC23 IC for audio applications. The package comes in bulk and is ideal for testing and demonstrating audio functionalities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,541 parts In-Stock

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2,541

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Digiode

USA . 1,543 parts In-Stock

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1,543

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 648 parts In-Stock

1+ parts

$8.748

100+ parts

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648

$8.748

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One Stop Electronics

USA . 597 parts In-Stock

1+ parts

$35.100

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597

$35.100

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Semicontronic

India . 181 parts In-Stock

1+ parts

$119.100

100+ parts

$116.122

1k+ parts

$115.527

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181

$119.100

$116.122

$115.527

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Ampacity Inc.

Singapore . 941 parts In-Stock

1+ parts

$120.100

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941

$120.100

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ChromeModa Solutions

Germany . 6,320 parts In-Stock

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6,320

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Corphita

USA . 3,548 parts In-Stock

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3,548

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Parana Technologies

USA . 1,599 parts In-Stock

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$0.499

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1,599

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$0.499

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IDEA Electronic Components Group

UK . 1,122 parts In-Stock

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1,122

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DigiPath Technology Company

USA . 245 parts In-Stock

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245

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Corohmni

South Africa . 63 parts In-Stock

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63

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Perfect Parts

USA . 4 parts In-Stock

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4

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Overview

Discover the unparalleled quality and innovation of Texas Instruments with the TLV320AIC23EVM2 Evaluation Board. This state-of-the-art audio CODEC board offers customers a seamless experience in developing and testing audio systems. Whether you're a seasoned engineer or a novice DIY enthusiast, this board provides an intuitive graphical user interface and supports a wide range of sample rates for superior audio performance. Unlock endless possibilities in your audio projects with the TLV320AIC23EVM2 Evaluation Board.

Feature Benefit Bullets

Package: Bulk

Bulk packaging allows for cost-effective mass production and easy handling and storage of multiple units.

Type: Audio

Designed specifically for audio applications, ensuring high-quality audio output.

Function: CODEC

Provides encoding and decoding of analog signals, essential for audio processing and communication.

Utilized IC / Part: TLV320AIC23

Utilizes the TLV320AIC23 integrated circuit for advanced audio processing capabilities and compatibility.

Primary Attributes: Stereo, 16 ~ 32-Bit, 8 ~ 96kHz Sample Rates

Supports stereo audio output with a wide range of bit depths and sample rates for versatile audio processing.

Supplied Contents: Board(s)

Includes necessary board components for easy implementation and testing of audio functionalities.

Secondary Attributes: Graphical User Interface (GUI)

Comes with a user-friendly GUI for convenient control and customization of audio settings.

Moisture Sensitivity Level (MSL): 1 (Unlimited)

With an MSL of 1, this product can be safely stored and used in various environments without moisture-related issues.

Technical Specifications

Additional Parts TLV320AIC23EVM2 attributes and parameters. Explore more Additional Parts devices from Texas Instruments

Technical Specifications

Function:

CODEC

Type:

Audio

Category:

Development Boards, Kits, Programmers
Evaluation Boards Evaluation and Demonstration Boards and Kits

Supplied Contents:

Board(s)

Secondary Attributes:

Graphical User Interface (GUI)

Utilized IC / Part:

TLV320AIC23

Package:

Bulk

Embedded:

No

Primary Attributes:

Stereo, 16 ~ 32-Bit, 8 ~ 96kHz Sample Rates

Standard Package:

1

Base Product Number:

TLV320

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

TLV320AIC23EVM2 Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

8473.30.1180

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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