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TLV3201AIDCK

Texas Instruments

TLV3201AIDCK by Texas Instruments

TLV3201AIDCK by Texas Instruments is a comparator with 6000uV max input offset voltage, 0.005uA max average bias current, and 47ns nominal response time. Ideal for automotive applications due to its push-pull output type and -40 to 125 °C operating temperature range.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,218 parts In-Stock

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Digiode

USA . 424 parts In-Stock

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ComSIT Distribution GmbH

Germany . 149 parts In-Stock

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149

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Nova Conductors

Japan . 50 parts In-Stock

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50

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EPE Components Inc.

USA . 41 parts In-Stock

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Bristol Electronics

USA . 41 parts In-Stock

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One Stop Electronics

USA . 719 parts In-Stock

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$0.410

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Parana Technologies

USA . 1,937 parts In-Stock

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$1.133

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$1.955

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ChromeModa Solutions

Germany . 1,875 parts In-Stock

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$1.273

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$1.044

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$1.273

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IDEA Electronic Components Group

UK . 26 parts In-Stock

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$1.273

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$1.146

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Corohmni

South Africa . 60 parts In-Stock

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$2.241

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Semicontronic

India . 410 parts In-Stock

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$7.410

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$7.225

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Ampacity Inc.

Singapore . 223 parts In-Stock

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AZTECH Wire

Italy . 557 parts In-Stock

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Continental Prestige Electronics

USA . 3,988 parts In-Stock

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Argo Parts USA

USA . 1,147 parts In-Stock

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Bastille Electronics

Australia . 1,000 parts In-Stock

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Corphita

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DigiPath Technology Company

USA . 632 parts In-Stock

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Advanced Electronics

New Zealand . 550 parts In-Stock

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S.R.D Solutions

India . 300 parts In-Stock

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Lixinc

USA . 70 parts In-Stock

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Overview

Unlock precision and reliability with the TLV3201AIDCK by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments excels in delivering top-quality comparators designed for various applications. The TLV3201AIDCK offers unparalleled performance and value, with its compact design and low power consumption making it ideal for automotive and industrial use. Experience fast response times and accurate results with this innovative product, setting new standards in efficiency and functionality. Choose Texas Instruments for unmatched quality and performance in your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials make the package lightweight and durable, ideal for portable or rugged applications.

Maximum Input Offset Voltage: 6000 uV

Low input offset voltage ensures accurate comparison between input signals, resulting in precise output.

Maximum Average Bias Current (IIB): 0.005 uA

Low bias current helps in minimizing power consumption and improving efficiency of the comparator.

Surface Mount: YES

Surface mount capability makes installation easier and saves space on the PCB, suitable for compact designs.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient PCB layout and space utilization, making it versatile for various applications.

Nominal Supply Voltage / Vsup (V): 5

Stable nominal supply voltage of 5V ensures consistent performance and compatibility with standard power sources.

No. of Terminals: 5

Minimal number of terminals simplifies the connection process and reduces chances of error during installation.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact package style with thin profile and shrink pitch design saves space on the PCB and allows for high-density mounting.

Maximum Supply Voltage Limit: 7 V

High supply voltage limit of 7V provides flexibility in power source selection and operation in different voltage environments.

Maximum Operating Temperature: 125 °C

Wide operating temperature range up to 125°C ensures reliable performance in extreme temperature conditions, suitable for automotive applications.

Output Type: PUSH-PULL

Push-pull output configuration allows for both sinking and sourcing of current, offering versatility in signal processing and driving capabilities.

Nominal Response Time: 47 ns

Fast response time of 47ns enables quick decision-making and signal processing, essential for high-speed applications.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature of -40°C ensures reliable performance in cold environments, making it suitable for automotive and industrial use.

Terminal Position: DUAL

Dual terminal position provides flexibility in connection orientation, allowing for easier integration into different PCB layouts.

Maximum Seated Height: 1.1 mm

Low seated height of 1.1mm saves vertical space on the PCB and enables compact designs with limited height constraints.

Width: 1.25 mm

Narrow width of 1.25mm allows for close spacing between components on the PCB, improving overall layout efficiency.

Length: 2 mm

Short length of 2mm minimizes PCB footprint and ensures space-saving integration in compact electronic devices.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature rating ensures reliable performance in harsh automotive environments, meeting industry standards for quality and durability.

Terminal Form: GULL WING

Gull wing terminal form provides strong mechanical connection and easy soldering, enhancing reliability and ease of assembly.

Amplifier Type: COMPARATOR

Specifically designed as a comparator for precise signal comparison, ensuring accurate decision-making in various electronic circuits.

Terminal Pitch: 0.65 mm

Small terminal pitch of 0.65mm allows for high-density mounting and fine-pitch connections, suitable for compact electronic designs.

Technical Specifications

Comparators TLV3201AIDCK attributes and parameters. Explore more Comparators devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Total Functions:

1

Sub-Category:

Comparators

Output Type:

Push-Pull

Performance Specifications

Maximum Input Offset Voltage:

6 mV

Peak Bias Current:

5 nA

Operational Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

7 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Nominal Response Time:

47 ns

Physical Characteristics

Length:

0.079 in (2 mm)

Width:

0.049 in (1.25 mm)

Maximum Seated Height:

0.043 in (1.1 mm)

Total Terminals:

5

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Form:

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Standards

JESD-30 Code:

R-PDSO-G5

Packaging and Shipping

Package Code:

Package Shape:

Package Type:

Small Outline, Thin Profile, Shrink Pitch

Trade Compliance

TLV3201AIDCK Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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