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TLK100INTEVM

Texas Instruments

TLK100INTEVM by Texas Instruments

TLK100INTEVM by Texas Instruments is an Ethernet PHY interface evaluation board. It features TLK100 IC, MSL level 1, and comes in a box package. Ideal for evaluating and demonstrating Ethernet PHY functionality in various applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 4,530 parts In-Stock

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4,530

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Vyrian

USA . 3,724 parts In-Stock

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3,724

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Distributors (Availability)

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AZTECH Wire

Italy . 372 parts In-Stock

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$8.970

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372

$8.970

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One Stop Electronics

USA . 919 parts In-Stock

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$23.100

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919

$23.100

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Ampacity Inc.

Singapore . 834 parts In-Stock

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$111.100

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834

$111.100

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Semicontronic

India . 451 parts In-Stock

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$115.100

100+ parts

$112.222

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$111.647

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451

$115.100

$112.222

$111.647

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ChromeModa Solutions

Germany . 6,750 parts In-Stock

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6,750

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Corphita

USA . 3,041 parts In-Stock

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3,041

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Parana Technologies

USA . 2,211 parts In-Stock

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$1.155

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$1.155

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IDEA Electronic Components Group

UK . 1,170 parts In-Stock

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1,170

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DigiPath Technology Company

USA . 813 parts In-Stock

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813

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Corohmni

South Africa . 490 parts In-Stock

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490

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Overview

Unleash the power of connectivity with the TLK100INTEVM by Texas Instruments. This top-tier evaluation board offers unparalleled quality and reliability, backed by the trusted name of Texas Instruments. Perfect for development projects in need of a high-performance Ethernet PHY interface, this versatile tool opens up a world of possibilities for networking applications. Experience seamless integration, enhanced functionality, and effortless design with the TLK100INTEVM - your gateway to cutting-edge technology.

Feature Benefit Bullets

Other Names: TLK100INTEVM-ND / 296-31026

Having multiple names makes it easier to identify and order the product through different channels.

Category: Development Boards, Kits, Programmers / Evaluation Boards / Evaluation and Demonstration Boards and Kits

This product falls under multiple categories, indicating its versatility and wide range of applications in the field of development and evaluation.

Package: Box

The product comes in a box package, providing protection during shipping and storage.

Type: Interface

Being an interface type product, it facilitates communication between different devices or components.

Function: Ethernet PHY

The product serves the function of an Ethernet PHY, making it suitable for applications requiring Ethernet connectivity.

Utilized IC / Part: TLK100

The product is based on the TLK100 IC, known for its reliability and performance in Ethernet applications.

Supplied Contents: Board(s)

The product includes the necessary board(s) needed for evaluation and demonstration, making it a comprehensive solution.

Base Product Number: TLK100

The product is part of the TLK100 series, ensuring compatibility and integration with other TLK100 products.

Moisture Sensitivity Level (MSL): 1 (Unlimited)

With MSL level 1, the product can be stored and used in various environmental conditions without the risk of moisture damage.

Technical Specifications

Additional Parts TLK100INTEVM attributes and parameters. Explore more Additional Parts devices from Texas Instruments

Technical Specifications

Other Names:

TLK100INTEVM-ND
296-31026

Function:

Ethernet PHY

Type:

Interface

Category:

Development Boards, Kits, Programmers
Evaluation Boards Evaluation and Demonstration Boards and Kits

Supplied Contents:

Board(s)

Utilized IC / Part:

TLK100

Package:

Box

Standard Package:

1

Base Product Number:

TLK100

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

TLK100INTEVM Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

8473.30.1180

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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