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TLK100EXTEVM

Texas Instruments

TLK100EXTEVM by Texas Instruments

TLK100EXTEVM by Texas Instruments is an Ethernet PHY interface evaluation board. It features TLK100 IC, MSL level 1, and comes in a box package. Ideal for testing and demonstrating Ethernet connectivity applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 5,989 parts In-Stock

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Digiode

USA . 1,437 parts In-Stock

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Ampacity Inc.

Singapore . 394 parts In-Stock

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$11.100

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394

$11.100

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AZTECH Wire

Italy . 708 parts In-Stock

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$15.453

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One Stop Electronics

USA . 1,340 parts In-Stock

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$172.100

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$172.100

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Semicontronic

India . 207 parts In-Stock

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$237.100

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$231.172

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$229.987

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207

$237.100

$231.172

$229.987

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Corphita

USA . 3,564 parts In-Stock

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ChromeModa Solutions

Germany . 3,245 parts In-Stock

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Advanced Electronics

New Zealand . 2,495 parts In-Stock

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IDEA Electronic Components Group

UK . 2,316 parts In-Stock

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Parana Technologies

USA . 988 parts In-Stock

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$0.252

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988

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DigiPath Technology Company

USA . 948 parts In-Stock

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Corohmni

South Africa . 280 parts In-Stock

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Perfect Parts

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Overview

Experience high-quality performance and reliability with the TLK100EXTEVM by Texas Instruments. This interface evaluation board offers unmatched value and benefits, making it an essential tool for a variety of applications. Whether you are developing networking solutions or exploring Ethernet PHY functionality, this product provides a seamless experience with its top-notch design and functionality. Trust in Texas Instruments to deliver cutting-edge technology that meets your needs and exceeds your expectations. Elevate your projects with the TLK100EXTEVM and unlock a world of possibilities.

Feature Benefit Bullets

Other Names: 296-29306, TLK100EXTEVM-ND

These names can be used to easily identify and search for the product in the market.

Category: Development Boards, Kits, Programmers, Evaluation Boards

Indicates that this product is suitable for development and evaluation purposes, making it a versatile and essential tool for testing and prototyping.

Package: Box

The product comes in a protective box packaging, ensuring safe storage and transportation.

Type: Interface

Designed specifically for interfacing with devices, making it easy to connect and integrate into existing systems.

Function: Ethernet PHY

Allows for testing and evaluation of Ethernet Physical Layer functionality, making it ideal for networking and communication applications.

Utilized IC / Part: TLK100

Features the TLK100 Integrated Circuit, known for its high performance and reliability in Ethernet applications.

Supplied Contents: Board(s)

Includes the necessary boards for testing and evaluation, providing a complete solution for development purposes.

Base Product Number: TLK100

Ease of identification and compatibility with other TLK100 products in the same product line.

Moisture Sensitivity Level (MSL): 1 (Unlimited)

The product is not sensitive to moisture, ensuring its durability and reliability in various environments.

Technical Specifications

Additional Parts TLK100EXTEVM attributes and parameters. Explore more Additional Parts devices from Texas Instruments

Technical Specifications

Other Names:

296-29306
TLK100EXTEVM-ND

Function:

Ethernet PHY

Type:

Interface

Category:

Development Boards, Kits, Programmers
Evaluation Boards Evaluation and Demonstration Boards and Kits

Supplied Contents:

Board(s)

Utilized IC / Part:

TLK100

Package:

Box

Standard Package:

1

Base Product Number:

TLK100

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

TLK100EXTEVM Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

8473.30.1180

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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