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TLE2144MFKB

Texas Instruments

TLE2144MFKB by Texas Instruments

TLE2144MFKB by Texas Instruments is a quad operational amplifier with 4000uV max input offset voltage, 108dB CMRR, and 27V/us min slew rate. Ideal for military applications due to MIL-STD-883 screening level, it operates in -55 to 125 °C temperature range and has VFB architecture.

Median Price

$36.500

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 75 parts In-Stock

1+ parts

-

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$36.500

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75

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$36.500

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Distributors (In-Stock)

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Vyrian

USA . 5,769 parts In-Stock

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5,769

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Digiode

USA . 2,683 parts In-Stock

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2,683

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Distributors (Availability)

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Parana Technologies

USA . 2,283 parts In-Stock

1+ parts

$2.092

100+ parts

-

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$2.610

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2,283

$2.092

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$2.610

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DigiPath Technology Company

USA . 1,421 parts In-Stock

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$2.303

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1,421

$2.303

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ChromeModa Solutions

Germany . 2,459 parts In-Stock

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$2.350

100+ parts

$1.927

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2,459

$2.350

$1.927

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IDEA Electronic Components Group

UK . 670 parts In-Stock

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$2.350

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$2.115

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670

$2.350

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$2.115

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AZTECH Wire

Italy . 851 parts In-Stock

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$12.000

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851

$12.000

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Ampacity Inc.

Singapore . 75 parts In-Stock

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$31.020

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75

$31.020

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Corphita

USA . 3,547 parts In-Stock

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Microchip USA

USA . 2,273 parts In-Stock

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Overview

Elevate your designs with the TLE2144MFKB operational amplifier from Texas Instruments. Trusted for its exceptional quality and reliability, this op amp is ideal for a wide range of applications. With precise performance and advanced technology, this amplifier offers unparalleled value to customers seeking high-performance solutions. Experience the benefits of superior design and engineering with the TLE2144MFKB, setting new standards in operational amplifiers.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material ensures high reliability and stability, making the product suitable for use in demanding applications where consistency is key.

Maximum Input Offset Voltage: 4000 uV

Low input offset voltage ensures minimal errors in signal processing, resulting in accurate output readings.

Maximum Average Bias Current (IIB): -1.8 uA

Low bias current helps in minimizing power consumption and improves the overall efficiency of the amplifier.

Surface Mount: YES

Surface mount design makes it easy to integrate into compact electronic devices, saving space and simplifying the assembly process.

Nominal Supply Voltage / Vsup (V): 15

Stable supply voltage ensures consistent performance of the amplifier, making it reliable for long-term use.

Minimum Slew Rate: 27 V/us

High slew rate allows the amplifier to respond quickly to input signal changes, making it suitable for applications requiring fast response times.

Nominal Unity Gain Bandwidth: 6000 kHz

High bandwidth ensures that the amplifier can handle high-frequency signals efficiently, making it suitable for a wide range of applications.

Technical Specifications

Operational Amplifiers (Op Amps) TLE2144MFKB attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

BIPOLAR

Power Supply:

5/±15 V

Total Functions:

4

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

No

Low-Offset:

No

Micropower:

No

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

6 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

108 dB

Minimum Common Mode Rejection Ratio (CMRR ):

85 dB

Input Offset Voltage Limit:

4000 uV

Minimum Voltage Gain:

5000

Minimum Slew Rate:

27 V/us

Nominal Slew Rate:

45 V/us

Maximum Input Offset Current (IIO):

100 nA

Peak Bias Current:

-1.8 uA

Maximum Bias Current (IIB) @25 °C:

1.5 uA

Operational Characteristics

Nominal Supply Voltage:

15 V

Maximum Supply Voltage:

22 V

Maximum Negative Supply Voltage:

-15 V

Minimum Negative Supply Voltage:

-22 V

Lowest Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Maximum Supply Current:

18 mA

Physical Characteristics

Length:

0.35 in (8.89 mm)

Width:

0.35 in (8.89 mm)

Maximum Seated Height:

0.08 in (2.03 mm)

Total Terminals:

20

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Quad

Terminal Form:

Terminal Finish:

Tin/Lead

Package Body Material:

Ceramic, Metal-Sealed Cofired

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Screening Level:

MIL-STD-883

Standards

JESD-30 Code:

S-CQCC-N20

JESD-609 Code:

e0

Packaging and Shipping

Packing Method:

Tube

Package Code:

Package Shape:

Package Style:

Chip Carrier

Package Equivalence Code:

LCC20,.35SQ

Trade Compliance

TLE2144MFKB Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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