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TLE2144AMFKB

Texas Instruments

TLE2144AMFKB by Texas Instruments

TLE2144AMFKB by Texas Instruments is a quad operational amplifier with 3200uV max input offset voltage, 108dB CMRR, and 27V/us min slew rate. Ideal for military applications due to MIL-STD-883 screening level, it operates at -55 to 125 °C with +/-15V supplies in a ceramic metal-sealed package.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,520 parts In-Stock

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4,520

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Digiode

USA . 333 parts In-Stock

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333

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Distributors (Availability)

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Parana Technologies

USA . 586 parts In-Stock

1+ parts

$1.797

100+ parts

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$2.355

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586

$1.797

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$2.355

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DigiPath Technology Company

USA . 1,934 parts In-Stock

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$1.979

100+ parts

$1.820

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1,934

$1.979

$1.820

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ChromeModa Solutions

Germany . 5,001 parts In-Stock

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$2.019

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$1.656

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5,001

$2.019

$1.656

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IDEA Electronic Components Group

UK . 2,213 parts In-Stock

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$2.019

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$1.817

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2,213

$2.019

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One Stop Electronics

USA . 168 parts In-Stock

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$6.410

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168

$6.410

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AZTECH Wire

Italy . 671 parts In-Stock

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$19.721

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671

$19.721

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Corphita

USA . 3,374 parts In-Stock

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Microchip USA

USA . 2,588 parts In-Stock

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Overview

Experience unparalleled performance and reliability with the TLE2144AMFKB operational amplifier from Texas Instruments. As a trusted industry leader, Texas Instruments delivers top-quality products that meet rigorous MIL-STD-883 standards. This versatile op amp is perfect for a wide range of applications, offering customers precision, stability, and efficiency. With a high unity gain bandwidth and exceptional common mode rejection ratio, the TLE2144AMFKB ensures optimal performance in demanding environments. Trust Texas Instruments to provide the cutting-edge technology you need for your next project.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material ensures durability and reliability, making the product suitable for harsh environments.

Maximum Input Offset Voltage: 3200 uV

Low input offset voltage helps in minimizing errors in signal processing applications.

Surface Mount: YES

Easily mountable on a PCB, enabling compact and efficient designs.

No. of Functions: 4

Multiple functions in one component save space and simplify circuit design.

Nominal Common Mode Reject Ratio: 108 dB

High CMRR ensures accurate rejection of common-mode signals for better performance.

Nominal Supply Voltage / Vsup (V): 15

Stable supply voltage for consistent operation.

Minimum Slew Rate: 27 V/us

Fast slew rate allows for quick response to input changes, essential in dynamic applications.

Maximum Operating Temperature: 125 °C

Wide temperature range ensures reliable operation in various environmental conditions.

Nominal Unity Gain Bandwidth: 6000 kHz

High unity gain bandwidth enables high-frequency performance.

Technology: BIPOLAR

Bipolar technology offers high precision and low noise for accurate signal processing.

Technical Specifications

Operational Amplifiers (Op Amps) TLE2144AMFKB attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

BIPOLAR

Power Supply:

5/±15 V

Total Functions:

4

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

No

Low-Offset:

No

Micropower:

No

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

6 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

108 dB

Minimum Common Mode Rejection Ratio (CMRR ):

85 dB

Input Offset Voltage Limit:

3200 uV

Minimum Voltage Gain:

5000

Minimum Slew Rate:

27 V/us

Nominal Slew Rate:

45 V/us

Maximum Input Offset Current (IIO):

100 nA

Peak Bias Current:

-1.8 uA

Maximum Bias Current (IIB) @25 °C:

1.5 uA

Operational Characteristics

Nominal Supply Voltage:

15 V

Maximum Supply Voltage:

22 V

Maximum Negative Supply Voltage:

-15 V

Minimum Negative Supply Voltage:

-22 V

Lowest Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Maximum Supply Current:

18 mA

Physical Characteristics

Length:

0.35 in (8.89 mm)

Width:

0.35 in (8.89 mm)

Maximum Seated Height:

0.08 in (2.03 mm)

Total Terminals:

20

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Quad

Terminal Form:

Terminal Finish:

Tin/Lead

Package Body Material:

Ceramic, Metal-Sealed Cofired

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Screening Level:

MIL-STD-883

Standards

JESD-30 Code:

S-CQCC-N20

JESD-609 Code:

e0

Packaging and Shipping

Packing Method:

Tube

Package Code:

Package Shape:

Package Style:

Chip Carrier

Package Equivalence Code:

LCC20,.35SQ

Trade Compliance

TLE2144AMFKB Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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