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TLE2142AMJGB

Texas Instruments

TLE2142AMJGB by Texas Instruments

TLE2142AMJGB by Texas Instruments is a MIL-STD-883 compliant operational amplifier with 1600uV max input offset voltage, 108dB CMRR, and 27V/us min slew rate. Ideal for military applications requiring high precision signal processing in harsh environments.

Median Price

$31.245

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 166 parts In-Stock

1+ parts

$31.245

100+ parts

$28.267

1k+ parts

$27.910

10k+ parts

-

166

$31.245

$28.267

$27.910

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,278 parts In-Stock

1+ parts

$29.683

100+ parts

-

1k+ parts

-

10k+ parts

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4,278

$29.683

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TME

Poland . 374 parts In-Stock

1+ parts

$48.695

100+ parts

-

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374

$48.695

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-

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Vyrian

USA . 5,452 parts In-Stock

1+ parts

-

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5,452

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 714 parts In-Stock

1+ parts

$0.567

100+ parts

-

1k+ parts

$1.662

10k+ parts

-

714

$0.567

-

$1.662

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ChromeModa Solutions

Germany . 6,261 parts In-Stock

1+ parts

$0.637

100+ parts

$0.522

1k+ parts

-

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6,261

$0.637

$0.522

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IDEA Electronic Components Group

UK . 1,613 parts In-Stock

1+ parts

$0.637

100+ parts

-

1k+ parts

$0.573

10k+ parts

-

1,613

$0.637

-

$0.573

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AZTECH Wire

Italy . 833 parts In-Stock

1+ parts

$16.410

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833

$16.410

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Corphita

USA . 2,934 parts In-Stock

1+ parts

$28.120

100+ parts

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2,934

$28.120

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A-Z Elektronik GmbH

Germany . 6,138 parts In-Stock

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6,138

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DigiPath Technology Company

USA . 1,381 parts In-Stock

1+ parts

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100+ parts

$0.574

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1,381

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$0.574

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Microchip USA

USA . 1,307 parts In-Stock

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1,307

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Perfect Parts

USA . 18 parts In-Stock

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18

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Overview

Unleash the power of precision and reliability with the TLE2142AMJGB operational amplifier by Texas Instruments. Crafted with top-notch quality and designed for military-grade screening, this op amp is a game-changer in various applications. With a minimum slew rate of 27 V/us and a nominal voltage gain of 5000, this amplifier delivers unmatched performance. Experience the benefits of its innovative technology, high common mode rejection ratio, and exceptional unity gain bandwidth. Trust Texas Instruments to provide you with the best-in-class components for your next project, ensuring optimal functionality and long-lasting durability. Elevate your designs with the TLE2142AMJGB and unlock endless possibilities.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

This material provides high thermal conductivity and excellent protection for the components inside, ensuring reliability and stability in various operating conditions.

Maximum Input Offset Voltage: 1600 uV

Low input offset voltage helps in eliminating errors in signal processing applications, making the product suitable for precision measurement and instrumentation.

Maximum Average Bias Current (IIB): -1.8 uA

Low bias current minimizes errors and distortion in the signal path, making this operational amplifier ideal for high-fidelity audio applications.

Nominal Common Mode Reject Ratio: 108 dB

High common-mode rejection ratio ensures that the amplifier can effectively reject noise and interference present on both input terminals, improving signal integrity and accuracy.

Minimum Slew Rate: 27 V/us

Fast slew rate enables the amplifier to respond quickly to changes in input signals, making it suitable for applications requiring fast signal processing and response times.

Nominal Unity Gain Bandwidth: 6000 kHz

High unity gain bandwidth indicates the amplifier's ability to maintain stable operation even at high frequencies, making it suitable for wideband signal processing applications.

Technical Specifications

Operational Amplifiers (Op Amps) TLE2142AMJGB attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

BIPOLAR

Power Supply:

5/±15 V

Total Functions:

2

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

No

Low-Offset:

No

Micropower:

No

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

6 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

108 dB

Minimum Common Mode Rejection Ratio (CMRR ):

85 dB

Input Offset Voltage Limit:

1600 uV

Minimum Voltage Gain:

5000

Minimum Slew Rate:

27 V/us

Nominal Slew Rate:

45 V/us

Maximum Input Offset Current (IIO):

100 nA

Peak Bias Current:

-1.8 uA

Maximum Bias Current (IIB) @25 °C:

1.5 uA

Operational Characteristics

Nominal Supply Voltage:

15 V

Maximum Supply Voltage:

22 V

Maximum Negative Supply Voltage:

-15 V

Minimum Negative Supply Voltage:

-22 V

Lowest Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Maximum Supply Current:

8.8 mA

Physical Characteristics

Length:

0.377 in (9.58 mm)

Width:

0.3 in (7.62 mm)

Maximum Seated Height:

0.2 in (5.08 mm)

Total Terminals:

8

Terminal Pitch:

0.1 in (2.54 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Tin/Lead

Package Body Material:

Ceramic, Glass-Sealed

Surface Mount:

No

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Screening Level:

MIL-STD-883

Standards

JESD-30 Code:

R-GDIP-T8

JESD-609 Code:

e0

Packaging and Shipping

Packing Method:

Tube

Package Code:

DIP

Package Shape:

Package Style:

In Line

Package Equivalence Code:

DIP8,.3

Trade Compliance

TLE2142AMJGB Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

NSN

5962-01-461-5724, 5962014615724

NIIN

014615724

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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