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TLE2082ACDRG4

Texas Instruments

TLE2082ACDRG4 by Texas Instruments

TLE2082ACDRG4 by Texas Instruments is a BIFET technology operational amplifier with 2 functions, offering low-bias and frequency compensation. With a max input offset voltage of 3000 uV, it operates at temperatures from 0 to 70 °C and has a nominal unity gain bandwidth of 10 MHz. Ideal for applications requiring precise signal amplification in commercial-grade electronic circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 5,212 parts In-Stock

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Digiode

USA . 1,610 parts In-Stock

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Nova Conductors

Japan . 870 parts In-Stock

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Ampacity Inc.

Singapore . 948 parts In-Stock

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$0.410

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$0.410

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Parana Technologies

USA . 452 parts In-Stock

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$5.091

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$5.669

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$5.091

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DigiPath Technology Company

USA . 626 parts In-Stock

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$5.606

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626

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ChromeModa Solutions

Germany . 1,336 parts In-Stock

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$5.720

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$4.690

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$5.720

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IDEA Electronic Components Group

UK . 1,269 parts In-Stock

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$5.720

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$5.148

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One Stop Electronics

USA . 1,608 parts In-Stock

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$9.410

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AZTECH Wire

Italy . 369 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 18,176 parts In-Stock

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Authorized Procurement Solutions

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Microchip USA

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Argo Parts USA

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Continental Prestige Electronics

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A-Z Elektronik GmbH

Germany . 2,055 parts In-Stock

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Corphita

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Bastille Electronics

Australia . 200 parts In-Stock

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Overview

Enhance your electronics projects with the TLE2082ACDRG4 operational amplifier by Texas Instruments. Renowned for their high-quality components, Texas Instruments delivers precision and reliability in every product. The TLE2082ACDRG4 is perfect for a wide range of applications, offering superior performance and efficiency. Upgrade your circuit designs with this advanced operational amplifier, providing unparalleled value and unmatched benefits to customers seeking top-notch results. Trust Texas Instruments for excellence in engineering and innovation. Elevate your projects with the TLE2082ACDRG4 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the operational amplifier.

Maximum Input Offset Voltage: 3000 uV

Low input offset voltage helps in minimizing errors in voltage measurements and improves accuracy.

Maximum Average Bias Current (IIB): 0.005 uA

Low bias current ensures minimal power consumption and accurate signal processing.

Surface Mount: YES

Allows for easy installation on circuit boards, saving space and simplifying the assembly process.

No. of Functions: 2

Provides flexibility in circuit design and allows for multiple functions within a single component.

Nominal Common Mode Reject Ratio: 98 dB

High common mode rejection ratio helps in minimizing noise and interference in the signal.

Nominal Supply Voltage / Vsup (V): 5

Operates efficiently at a nominal supply voltage of 5V, suitable for various electronic applications.

Power Supplies (V): +-5/+-15

Supports dual power supplies of +-5V and +-15V, providing options for different voltage requirements.

No. of Terminals: 8

Offers multiple connection points for interfacing with external components and circuits.

Maximum Input Offset Current (IIO): 0.00035 uA

Low input offset current helps in maintaining accuracy and stability in signal processing.

Minimum Slew Rate: 25 V/us

Fast slew rate allows for rapid changes in the output voltage, essential for high-speed applications.

Maximum Supply Voltage Limit: 19 V

Safety feature to protect the operational amplifier from excessive voltage inputs.

Architecture: VOLTAGE-FEEDBACK

Voltage-feedback architecture ensures stable performance and precise amplification of voltage signals.

Technical Specifications

Operational Amplifiers (Op Amps) TLE2082ACDRG4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

BIFET

Power Supply:

±5/±15 V

Total Functions:

2

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

No

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

10 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

98 dB

Minimum Common Mode Rejection Ratio (CMRR ):

80 dB

Input Offset Voltage Limit:

3000 uV

Minimum Voltage Gain:

8912.5

Minimum Slew Rate:

25 V/us

Nominal Slew Rate:

40 V/us

Maximum Input Offset Current (IIO):

350 pA

Peak Bias Current:

5 nA

Maximum Bias Current (IIB) @25 °C:

175 pA

Operational Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

19 V

Maximum Negative Supply Voltage:

-5 V

Minimum Negative Supply Voltage:

-19 V

Lowest Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

30 s

Maximum Supply Current:

3.9 mA

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.905 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP8,.25

Trade Compliance

TLE2082ACDRG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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