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TLE2071CDG4

Texas Instruments

TLE2071CDG4 by Texas Instruments

TLE2071CDG4 by Texas Instruments is an Operational Amplifier with 6000uV Max Input Offset Voltage, 89dB CMRR, and 23V/us Min Slew Rate. Ideal for precision signal conditioning in commercial applications due to low bias current of 0.005uA and BIFET technology.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,299 parts In-Stock

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8,299

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Digiode

USA . 1,131 parts In-Stock

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1,131

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 775 parts In-Stock

1+ parts

$0.410

100+ parts

-

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775

$0.410

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Advanced Electronics

New Zealand . 800 parts In-Stock

1+ parts

$1.127

100+ parts

$1.116

1k+ parts

$1.071

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-

800

$1.127

$1.116

$1.071

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Parana Technologies

USA . 760 parts In-Stock

1+ parts

$3.297

100+ parts

-

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$3.820

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760

$3.297

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$3.820

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DigiPath Technology Company

USA . 2,034 parts In-Stock

1+ parts

$3.630

100+ parts

$3.340

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2,034

$3.630

$3.340

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ChromeModa Solutions

Germany . 6,842 parts In-Stock

1+ parts

$3.704

100+ parts

$3.037

1k+ parts

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6,842

$3.704

$3.037

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IDEA Electronic Components Group

UK . 134 parts In-Stock

1+ parts

$3.704

100+ parts

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$3.334

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134

$3.704

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$3.334

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AZTECH Wire

Italy . 352 parts In-Stock

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$13.860

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352

$13.860

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QUARKTWIN TECHNOLOGY LTD

USA . 19,589 parts In-Stock

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Corphita

USA . 2,393 parts In-Stock

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Overview

Unleash the power of precision with the TLE2071CDG4 by Texas Instruments. This operational amplifier delivers unparalleled performance and reliability in a compact package, making it ideal for a wide range of applications. From audio equipment to sensor interfaces, this versatile op amp offers low bias current, high common mode rejection ratio, and industry-leading voltage feedback architecture. Trust Texas Instruments to provide cutting-edge technology that meets your needs with unmatched quality and value. Elevate your designs with the TLE2071CDG4 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, making it suitable for various applications.

Maximum Input Offset Voltage: 6000 uV

The low input offset voltage ensures minimal errors in signal processing, making this operational amplifier a precise and reliable choice.

Maximum Average Bias Current (IIB): 0.005 uA

The low bias current ensures minimal power consumption and stable operation, making this product efficient for long-term use.

Surface Mount: YES

The surface mount feature allows for easy installation on circuit boards, saving space and simplifying the assembly process.

Nominal Common Mode Reject Ratio: 89 dB

The high common mode reject ratio indicates the amplifier's ability to reject noise and interference, ensuring accurate signal amplification.

Nominal Supply Voltage / Vsup (V): 5

The nominal supply voltage of 5V makes this operational amplifier compatible with a wide range of electronic devices and power sources.

Power Supplies (V): +-5/+-15

The dual power supply options allow for flexible voltage requirements, making this amplifier suitable for various power configurations.

No. of Terminals: 8

The ample number of terminals provides connectivity options and versatility in circuit design, making this amplifier a versatile choice for different applications.

Minimum Slew Rate: 23 V/us

The high slew rate ensures fast response times and rapid signal processing, making this amplifier ideal for applications requiring quick and accurate amplification.

Technology: BIFET

The BIFET technology combines the advantages of bipolar and CMOS technologies, offering high input impedance and low input current, making this operational amplifier suitable for precision applications.

Technical Specifications

Operational Amplifiers (Op Amps) TLE2071CDG4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

BIFET

Power Supply:

±5/±15 V

Total Functions:

1

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

No

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

9.4 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

89 dB

Minimum Common Mode Rejection Ratio (CMRR ):

80 dB

Input Offset Voltage Limit:

6000 uV

Minimum Voltage Gain:

8900

Minimum Slew Rate:

23 V/us

Nominal Slew Rate:

35 V/us

Maximum Input Offset Current (IIO):

100 pA

Peak Bias Current:

5 nA

Maximum Bias Current (IIB) @25 °C:

175 pA

Operational Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

19 V

Maximum Negative Supply Voltage:

-5 V

Minimum Negative Supply Voltage:

-19 V

Lowest Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Supply Current:

2.2 mA

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel/Palladium/Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tube

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP8,.25

Trade Compliance

TLE2071CDG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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