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TLE2064MDRG4

Texas Instruments

TLE2064MDRG4 by Texas Instruments

TLE2064MDRG4 by Texas Instruments is a BIFET technology operational amplifier with 90dB CMRR, 1.8V/us slew rate, and 1300kHz unity gain bandwidth. Ideal for military-grade applications requiring low bias current and micropower consumption in a compact SMD package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,566 parts In-Stock

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Digiode

USA . 3,427 parts In-Stock

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3,427

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Distributors (Availability)

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One Stop Electronics

USA . 1,549 parts In-Stock

1+ parts

$0.410

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1,549

$0.410

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Parana Technologies

USA . 1,692 parts In-Stock

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$1.694

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$2.292

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1,692

$1.694

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$2.292

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DigiPath Technology Company

USA . 1,129 parts In-Stock

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$1.865

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$1.865

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ChromeModa Solutions

Germany . 4,620 parts In-Stock

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$1.903

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$1.560

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4,620

$1.903

$1.560

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IDEA Electronic Components Group

UK . 747 parts In-Stock

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$1.903

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$1.713

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747

$1.903

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$1.713

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Component Stockers USA

USA . 6,553 parts In-Stock

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$14.470

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6,553

$14.470

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AZTECH Wire

Italy . 796 parts In-Stock

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$16.723

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Kepictronics

USA . 5,460 parts In-Stock

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Corphita

USA . 3,606 parts In-Stock

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Microchip USA

USA . 2,790 parts In-Stock

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Overview

Unleash the power of precision with the TLE2064MDRG4 by Texas Instruments. Crafted with expertise and excellence, this operational amplifier offers unmatched performance and reliability. Whether you're designing audio equipment, industrial controls, or precision instrumentation, this amplifier delivers exceptional results with its low-bias, micropower design. Elevate your projects with the TLE2064MDRG4 and experience the difference in quality and efficiency that only Texas Instruments can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package of the operational amplifier durable and resistant to external factors, ensuring a longer lifespan.

Maximum Input Offset Voltage: 9000 uV

High maximum input offset voltage of 9000 uV ensures accurate performance and precise signal processing in the operational amplifier.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and effort during the manufacturing process.

Nominal Common Mode Reject Ratio: 90 dB

With a high common mode reject ratio of 90 dB, the operational amplifier can effectively suppress common mode noise and interference, leading to cleaner output signals.

Nominal Supply Voltage / Vsup (V): 5

The nominal supply voltage of 5V makes it compatible with a wide range of applications and power sources, providing versatility in usage.

Minimum Slew Rate: 1.8 V/us

The minimum slew rate of 1.8 V/us indicates the operational amplifier's ability to respond quickly to input voltage changes, making it suitable for dynamic signal processing tasks.

Frequency Compensation: YES

Frequency compensation feature ensures stability and consistent performance of the operational amplifier across a range of frequencies, making it reliable in various applications.

Technology: BIFET

BIFET technology combines the advantages of bipolar and field-effect transistor technologies, offering high input impedance, low input current, and fast response times for improved overall performance.

Amplifier Type: OPERATIONAL AMPLIFIER

As an operational amplifier, this product is specifically designed for analog signal processing and amplification tasks, providing high gain and accuracy for precision applications.

Technical Specifications

Operational Amplifiers (Op Amps) TLE2064MDRG4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

BIFET

Power Supply:

±3.5/±18/7/36 V

Total Functions:

4

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

Yes

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

1.3 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

90 dB

Minimum Common Mode Rejection Ratio (CMRR ):

72 dB

Input Offset Voltage Limit:

9000 uV

Minimum Voltage Gain:

500

Minimum Slew Rate:

1.8 V/us

Nominal Slew Rate:

3.4 V/us

Maximum Input Offset Current (IIO):

15 nA

Peak Bias Current:

30 nA

Maximum Bias Current (IIB) @25 °C:

60 pA

Operational Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

19 V

Maximum Negative Supply Voltage:

-5 V

Minimum Negative Supply Voltage:

-19 V

Lowest Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

30 s

Maximum Supply Current:

1.38 mA

Physical Characteristics

Length:

0.341 in (8.65 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

14

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP14,.25

Trade Compliance

TLE2064MDRG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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