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TLE2037IDR

Texas Instruments

TLE2037IDR by Texas Instruments

TLE2037IDR by Texas Instruments is an Operational Amplifier with 180uV Max Input Offset Voltage, 131dB Nominal CMRR, and 4.7V/us Min Slew Rate. Ideal for industrial applications requiring low-offset precision amplification in a compact package with dual terminals and voltage-feedback architecture.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,234 parts In-Stock

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9,234

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Digiode

USA . 4,215 parts In-Stock

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4,215

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Distributors (Availability)

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One Stop Electronics

USA . 1,211 parts In-Stock

1+ parts

$1.410

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$1.410

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Parana Technologies

USA . 2,226 parts In-Stock

1+ parts

$4.988

100+ parts

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$5.537

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2,226

$4.988

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$5.537

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ChromeModa Solutions

Germany . 5,427 parts In-Stock

1+ parts

$5.604

100+ parts

$4.595

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5,427

$5.604

$4.595

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IDEA Electronic Components Group

UK . 1,259 parts In-Stock

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$5.604

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$5.044

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1,259

$5.604

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$5.044

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AZTECH Wire

Italy . 612 parts In-Stock

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$5.671

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612

$5.671

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Corphita

USA . 3,921 parts In-Stock

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3,921

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A-Z Elektronik GmbH

Germany . 1,578 parts In-Stock

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DigiPath Technology Company

USA . 284 parts In-Stock

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$5.053

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Overview

Unlock unparalleled precision and performance with the TLE2037IDR operational amplifier by Texas Instruments. Crafted from high-quality materials and utilizing cutting-edge technology, this op amp delivers exceptional accuracy and reliability for a wide range of applications. Whether you're designing audio equipment, sensor interfaces, or precision instrumentation, the TLE2037IDR offers unmatched value with its low offset voltage, high common mode rejection ratio, and minimal bias current. Elevate your designs with the superior performance of Texas Instruments' TLE2037IDR operational amplifier.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good durability and protection for the internal components of the operational amplifier.

Maximum Input Offset Voltage: 180 uV

Low input offset voltage helps reduce error in the amplifier's output signal.

Maximum Average Bias Current (IIB): 0.15 uA

Low bias current ensures minimal power consumption and accurate signal amplification.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards.

Nominal Common Mode Reject Ratio: 131 dB

High common mode rejection ratio helps in maintaining signal integrity in the presence of noise.

Nominal Supply Voltage / Vsup (V): 15

Compatible with standard supply voltages for easy integration into various electronic systems.

Minimum Slew Rate: 4.7 V/us

Fast slew rate enables the amplifier to respond quickly to input signal changes.

Minimum Operating Temperature: -40 °C

Wide operating temperature range makes this amplifier suitable for use in various environments.

Technology: BIPOLAR

Bipolar technology offers stable performance and low noise levels in the amplifier circuit.

Nominal Unity Gain Bandwidth: 50000 kHz

High unity gain bandwidth ensures stable operation and accurate signal amplification across a wide frequency range.

Technical Specifications

Operational Amplifiers (Op Amps) TLE2037IDR attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

BIPOLAR

Power Supply:

±15 V

Total Functions:

1

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

YES (AVCL>=5)

Low-Bias:

No

Low-Offset:

Yes

Micropower:

No

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

50 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

131 dB

Minimum Common Mode Rejection Ratio (CMRR ):

100 dB

Input Offset Voltage Limit:

180 uV

Minimum Voltage Gain:

500000

Minimum Slew Rate:

4.7 V/us

Nominal Slew Rate:

7.5 V/us

Maximum Input Offset Current (IIO):

90 nA

Peak Bias Current:

150 nA

Maximum Bias Current (IIB) @25 °C:

90 nA

Operational Characteristics

Nominal Supply Voltage:

15 V

Maximum Supply Voltage:

19 V

Maximum Negative Supply Voltage:

-15 V

Minimum Negative Supply Voltage:

-19 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

105 °C (221 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Supply Current:

5.6 mA

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel/Palladium/Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP8,.25

Trade Compliance

TLE2037IDR Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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