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TLE2022AMJGB

Texas Instruments

TLE2022AMJGB by Texas Instruments

TLE2022AMJGB by Texas Instruments is a dual operational amplifier with low-offset and micropower features. It offers a max input offset voltage of 450uV, nominal voltage of +/-15V, and unity gain bandwidth of 2800kHz. Ideal for military-grade applications requiring high precision and low power consumption in compact designs.

Median Price

$45.590

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1 parts In-Stock

1+ parts

-

100+ parts

$45.590

1k+ parts

$40.790

10k+ parts

$38.390

1

-

$45.590

$40.790

$38.390

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,382 parts In-Stock

1+ parts

$40.622

100+ parts

-

1k+ parts

-

10k+ parts

-

4,382

$40.622

-

-

-

Vyrian

USA . 8,325 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,325

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,109 parts In-Stock

1+ parts

$4.527

100+ parts

-

1k+ parts

$4.973

10k+ parts

-

2,109

$4.527

-

$4.973

-

DigiPath Technology Company

USA . 1,427 parts In-Stock

1+ parts

$4.985

100+ parts

-

1k+ parts

-

10k+ parts

-

1,427

$4.985

-

-

-

IDEA Electronic Components Group

UK . 1,401 parts In-Stock

1+ parts

$5.087

100+ parts

-

1k+ parts

$4.578

10k+ parts

-

1,401

$5.087

-

$4.578

-

ChromeModa Solutions

Germany . 486 parts In-Stock

1+ parts

$5.087

100+ parts

$4.171

1k+ parts

-

10k+ parts

-

486

$5.087

$4.171

-

-

AZTECH Wire

Italy . 875 parts In-Stock

1+ parts

$13.490

100+ parts

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875

$13.490

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-

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Ampacity Inc.

Singapore . 1 parts In-Stock

1+ parts

$36.350

100+ parts

-

1k+ parts

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10k+ parts

-

1

$36.350

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-

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Corphita

USA . 3,130 parts In-Stock

1+ parts

$38.484

100+ parts

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3,130

$38.484

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Microchip USA

USA . 1,007 parts In-Stock

1+ parts

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100+ parts

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1,007

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Overview

Enhance your applications with the TLE2022AMJGB from Texas Instruments, a high-quality operational amplifier that offers unparalleled precision and reliability. Whether you're working on audio equipment, sensor interfaces, or precision instrumentation, this dual-function op amp provides exceptional performance in a compact package. With low offset voltage and micropower capabilities, customers can trust in the value and benefits this product brings to their projects. Trust Texas Instruments for quality components that deliver superior results every time.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

This material provides robust construction and high reliability for the op amp, making it suitable for various industrial applications.

Maximum Input Offset Voltage: 450 uV

Low input offset voltage ensures accurate signal processing and minimizes errors in the output signal.

Maximum Average Bias Current (IIB): 0.09 uA

Low bias current leads to lower power consumption and improved stability of the amplifier circuit.

No. of Functions: 2

Having multiple functions allows for versatile use of the op amp in different circuit configurations.

Nominal Common Mode Reject Ratio: 109 dB

High common mode rejection ratio helps in rejecting unwanted noise and interference, resulting in cleaner output signals.

Nominal Supply Voltage / Vsup (V): 15

Suitable supply voltage for the amplifier, providing stable operation within the specified range.

Frequency Compensation: YES

Frequency compensation ensures stability of the amplifier and prevents oscillations, making it reliable for various applications.

Minimum Voltage Gain: 100000

High voltage gain ensures that even small input signals are amplified effectively to produce the desired output.

Maximum Operating Temperature: 125 °C

Wide operating temperature range allows for use in different environmental conditions without performance degradation.

Architecture: VOLTAGE-FEEDBACK

Voltage-feedback architecture provides high linearity, low distortion, and stable operation for accurate signal processing.

Technical Specifications

Operational Amplifiers (Op Amps) TLE2022AMJGB attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

BIPOLAR

Power Supply:

±2/±20/4/40 V

Total Functions:

2

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

No

Low-Offset:

Yes

Micropower:

Yes

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

2.8 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

109 dB

Minimum Common Mode Rejection Ratio (CMRR ):

87 dB

Input Offset Voltage Limit:

450 uV

Minimum Voltage Gain:

100000

Minimum Slew Rate:

0.4 V/us

Nominal Slew Rate:

0.65 V/us

Maximum Input Offset Current (IIO):

6 nA

Peak Bias Current:

90 nA

Maximum Bias Current (IIB) @25 °C:

70 nA

Operational Characteristics

Nominal Supply Voltage:

15 V

Maximum Supply Voltage:

20 V

Maximum Negative Supply Voltage:

-15 V

Minimum Negative Supply Voltage:

-20 V

Lowest Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Maximum Supply Current:

600 μA

Physical Characteristics

Length:

0.377 in (9.58 mm)

Width:

0.3 in (7.62 mm)

Maximum Seated Height:

0.2 in (5.08 mm)

Total Terminals:

8

Terminal Pitch:

0.1 in (2.54 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Tin/Lead

Package Body Material:

Ceramic, Glass-Sealed

Surface Mount:

No

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Screening Level:

38535Q/M;38534H;883B

Standards

JESD-30 Code:

R-GDIP-T8

JESD-609 Code:

e0

Packaging and Shipping

Packing Method:

Tube

Package Code:

DIP

Package Shape:

Package Style:

In Line

Package Equivalence Code:

DIP8,.3

Trade Compliance

TLE2022AMJGB Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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