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TLC5946RHBTG4

Texas Instruments

TLC5946RHBTG4 by Texas Instruments

TLC5946RHBTG4 by Texas Instruments is a graphics display driver with 16 segments, operating voltage of 3-5.5V, and serial data input mode. Ideal for LED displays, it has a compact square chip carrier package and operates in industrial temperature range from -40 to 85°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,580 parts In-Stock

1+ parts

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6,580

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Digiode

USA . 1,876 parts In-Stock

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1,876

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Prism Electronics

USA . 8 parts In-Stock

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8

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,227 parts In-Stock

1+ parts

$11.287

100+ parts

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1k+ parts

$11.718

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2,227

$11.287

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$11.718

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DigiPath Technology Company

USA . 1,496 parts In-Stock

1+ parts

$12.428

100+ parts

$11.434

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1,496

$12.428

$11.434

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ChromeModa Solutions

Germany . 5,865 parts In-Stock

1+ parts

$12.682

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$10.399

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5,865

$12.682

$10.399

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IDEA Electronic Components Group

UK . 2,377 parts In-Stock

1+ parts

$12.682

100+ parts

$12.048

1k+ parts

$11.414

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2,377

$12.682

$12.048

$11.414

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AZTECH Wire

Italy . 714 parts In-Stock

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$13.333

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714

$13.333

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One Stop Electronics

USA . 237 parts In-Stock

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$35.500

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237

$35.500

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Ampacity Inc.

Singapore . 290 parts In-Stock

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$49.500

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290

$49.500

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Corphita

USA . 4,498 parts In-Stock

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4,498

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Microchip USA

USA . 2,818 parts In-Stock

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2,818

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Perfect Parts

USA . 9 parts In-Stock

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Overview

Elevate your display experience with the TLC5946RHBTG4 from Texas Instruments, a leading manufacturer in graphics display drivers. Designed for dot matrix displays, this serial data input driver offers unparalleled quality and reliability. Perfect for industrial applications, this chip carrier package ensures efficient performance with a wide operating temperature range. With a maximum supply voltage of 5.5V and minimum of 3V, this LED display driver provides customers with exceptional value and benefits. Upgrade your visual displays today with the TLC5946RHBTG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the graphics display driver, ensuring it can withstand daily use and potential impacts.

Display Mode: DOT MATRIX

Dot matrix display mode allows for high-resolution graphics to be displayed, providing clear and detailed images on the screen.

Data Input Mode: SERIAL

Serial data input mode allows for efficient and reliable data transfer, ensuring accurate communication between the driver and the display.

Surface Mount: YES

Surface mount capability makes installation easy and minimizes space requirements, ideal for compact electronic devices.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage allows for flexibility in power input, accommodating various voltage requirements in different electronic systems.

Package Shape: SQUARE

The square package shape offers uniformity and ease of integration into electronic circuits, simplifying the design process.

Power Supplies (V): 3.3/5

Compatible with both 3.3V and 5V power supplies, providing flexibility in use with different electronic systems.

No. of Terminals: 32

Having 32 terminals allows for versatile connectivity options, enabling the driver to interface with multiple components in a system.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The chip carrier package style with heat sink/slug and thin profile design enhances thermal management and space efficiency in electronic devices.

Minimum Supply Voltage: 3 V

The low minimum supply voltage requirement ensures energy efficiency and compatibility with various power sources.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the graphics display driver can function reliably in challenging environments with elevated temperatures.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the driver to perform in colder conditions without loss of functionality.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The terminal finish provides corrosion resistance and ensures a reliable electrical connection for long-lasting performance.

Terminal Position: QUAD

The quad terminal position offers stable and secure connections, enhancing the overall reliability of the graphics display driver.

Maximum Seated Height: 1 mm

The low maximum seated height enables a compact and slim design for the driver, suitable for space-constrained electronic devices.

Width: 5 mm

The compact width dimension allows for easy integration of the graphics display driver into various electronic systems without occupying excessive space.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures durability and reliability during the soldering process, contributing to the long-term performance of the driver.

Length: 5 mm

The small length dimension further enhances the space-saving characteristics of the graphics display driver, making it suitable for compact electronic devices.

Temperature Grade: INDUSTRIAL

The industrial temperature grade signifies that the graphics display driver is designed to operate effectively in harsh industrial environments with varying temperature ranges.

Terminal Form: NO LEAD

The no lead terminal form is environmentally friendly and complies with regulations, making the graphics display driver a sustainable choice for electronic applications.

Input Characteristics: STANDARD

Standard input characteristics ensure compatibility and ease of integration with common electronic systems, simplifying the design and implementation process.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V allows for efficient power consumption and compatibility with modern electronic systems that operate at lower voltage levels.

No. of Segments: 16

Having 16 segments provides flexibility in displaying various graphics and visual elements on the screen, enhancing the versatility of the graphics display driver.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5mm allows for high-density mounting and compact design, making the graphics display driver suitable for space-constrained electronic devices.

Minimum fmax: 30 MHz

With a minimum frequency of 30 MHz, the graphics display driver can handle high-speed data transfer and processing, ensuring smooth and responsive performance.

Moisture Sensitivity Level (MSL): 2

The moisture sensitivity level of 2 indicates that the graphics display driver is moderately sensitive to moisture exposure, requiring standard handling procedures during assembly and storage.

Interface IC Type: LED DISPLAY DRIVER

The interface IC type of LED display driver ensures compatibility and optimized performance with LED display panels, delivering bright and vibrant visuals on the screen.

Technical Specifications

Graphics Display Drivers TLC5946RHBTG4 attributes and parameters. Explore more Graphics Display Drivers devices from Texas Instruments

Specs

Data Input Mode:

SERIAL

Display Mode:

DOT MATRIX

Input Characteristics:

STANDARD

Interface IC Type:

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

2

Multiplexed Display Capability:

NO

No. of Functions:

1

No. of Segments:

16

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Display Drivers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Minimum fmax:

30 MHz

Trade Compliance

TLC5946RHBTG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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