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TLC5944PWPRG4

Texas Instruments

TLC5944PWPRG4 by Texas Instruments

TLC5944PWPRG4 by Texas Instruments is a graphics display driver with 16 segments, operating at 3-5.5V. It features constant-current output, serial data input mode, and dot matrix display mode. Ideal for LED displays in industrial applications due to its small outline package and dual terminal position.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,586 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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4,586

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Digiode

USA . 4,268 parts In-Stock

1+ parts

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4,268

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Chip Stock

USA . 2,730 parts In-Stock

1+ parts

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10k+ parts

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2,730

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,618 parts In-Stock

1+ parts

$3.388

100+ parts

-

1k+ parts

$3.915

10k+ parts

-

1,618

$3.388

-

$3.915

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DigiPath Technology Company

USA . 1,339 parts In-Stock

1+ parts

$3.731

100+ parts

-

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-

10k+ parts

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1,339

$3.731

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ChromeModa Solutions

Germany . 3,383 parts In-Stock

1+ parts

$3.807

100+ parts

$3.122

1k+ parts

-

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3,383

$3.807

$3.122

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IDEA Electronic Components Group

UK . 1,221 parts In-Stock

1+ parts

$3.807

100+ parts

-

1k+ parts

$3.426

10k+ parts

-

1,221

$3.807

-

$3.426

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AZTECH Wire

Italy . 716 parts In-Stock

1+ parts

$10.458

100+ parts

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716

$10.458

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One Stop Electronics

USA . 845 parts In-Stock

1+ parts

$11.500

100+ parts

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845

$11.500

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Microchip USA

USA . 4,687 parts In-Stock

1+ parts

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4,687

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Corphita

USA . 1,504 parts In-Stock

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1,504

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Kepictronics

USA . 190 parts In-Stock

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190

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Overview

Elevate your display experience with the TLC5944PWPRG4 by Texas Instruments. Crafted with precision and expertise, this graphics display driver offers unmatched quality and reliability. Ideal for a variety of applications, this product is designed to enhance your visuals with its dot matrix display mode and constant-current output characteristics. With a small outline and low profile package style, this product provides easy installation and efficient performance. Trust Texas Instruments to deliver cutting-edge technology that exceeds expectations. Upgrade your displays today with the TLC5944PWPRG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and durable, suitable for a variety of applications.

Display Mode: DOT MATRIX

Dot matrix display mode allows for versatile display options with clear and sharp graphics.

Data Input Mode: SERIAL

Serial data input mode ensures efficient and reliable communication between the driver and the display.

Surface Mount: YES

Surface mount capability makes installation easy and saves space on the circuit board.

Maximum Supply Voltage: 5.5 V

High maximum supply voltage allows for flexibility in power supply options and compatibility with different systems.

Package Shape: RECTANGULAR

Rectangular package shape is commonly used and easy to handle for assembly and installation.

Power Supplies (V): 3.3/5

Support for multiple power supply options (3.3V and 5V) makes the driver versatile and adaptable to various systems.

No. of Terminals: 28

Having 28 terminals provides ample connection points for interfacing with the display and other components.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

The small outline, heat sink/slug, thin profile, and shrink pitch package style enhances the thermal dissipation and compactness of the driver.

Minimum Supply Voltage: 3 V

Low minimum supply voltage requirement makes the driver energy-efficient and suitable for low-power applications.

Maximum Operating Temperature: 85 °C

High maximum operating temperature allows the driver to withstand heat and operate reliably in various environments.

Output Characteristics: CONSTANT-CURRENT

Constant-current output ensures consistent brightness and performance of the display.

Minimum Operating Temperature: -40 °C

Wide temperature range (-40°C to 85°C) enables the driver to function in extreme cold and hot conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Nickel/palladium/gold terminal finish offers excellent conductivity and corrosion resistance for reliable connections.

Terminal Position: DUAL

Dual terminal position provides redundancy and ensures consistent signal transmission for improved reliability.

Maximum Seated Height: 1.2 mm

Low maximum seated height allows for a compact design and easy integration into space-constrained applications.

Width: 4.4 mm

Narrow width of 4.4mm saves space on the circuit board and facilitates dense packing of components for efficient PCB layout.

Peak Reflow Temperature °C: 260

High peak reflow temperature of 260°C ensures proper soldering and assembly of the driver on the PCB.

Length: 9.7 mm

Compact length of 9.7mm contributes to the overall small footprint of the driver, ideal for compact electronic devices.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance in harsh industrial environments with varying temperature conditions.

Terminal Form: GULL WING

Gull wing terminal form enables easy soldering and secure attachment to the PCB for stable electrical connections.

Maximum Supply Current: 60 mA

Low maximum supply current consumption of 60mA ensures energy efficiency and minimal power usage during operation.

Input Characteristics: STANDARD

Standard input characteristics make the driver compatible with a wide range of display modules and interface circuits.

Nominal Supply Voltage: 3.3 V

Nominal supply voltage of 3.3V ensures compatibility with standard power sources and efficient power management.

No. of Segments: 16

Support for 16 segments provides flexibility in displaying alphanumeric characters and symbols on the screen.

Terminal Pitch: 0.65 mm

Fine terminal pitch of 0.65mm enables high-density mounting and precise connections for improved signal integrity.

Minimum fmax: 30 MHz

Minimum fmax of 30MHz indicates high-speed performance and efficient data transmission capabilities of the driver.

Moisture Sensitivity Level (MSL): 2

Moisture sensitivity level of 2 ensures that the driver is resistant to moisture and can withstand humid environments.

Interface IC Type: LED DISPLAY DRIVER

Specifically designed for LED display applications, the driver provides optimized performance and compatibility with LED screens.

Technical Specifications

Graphics Display Drivers TLC5944PWPRG4 attributes and parameters. Explore more Graphics Display Drivers devices from Texas Instruments

Specs

Data Input Mode:

SERIAL

Display Mode:

DOT MATRIX

Input Characteristics:

STANDARD

Interface IC Type:

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

9.7 mm

Moisture Sensitivity Level (MSL):

2

Multiplexed Display Capability:

NO

No. of Functions:

1

No. of Segments:

16

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

CONSTANT-CURRENT

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP28,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Display Drivers

Maximum Supply Current:

60 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Minimum fmax:

30 MHz

Trade Compliance

TLC5944PWPRG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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